These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.
136 related articles for article (PubMed ID: 19076033)
1. Recent patents on Cu/low-k dielectrics interconnects in integrated circuits. Jiang Q; Zhu YF; Zhao M Recent Pat Nanotechnol; 2007; 1(3):193-209. PubMed ID: 19076033 [TBL] [Abstract][Full Text] [Related]
2. Copper metallization for current very large scale integration. Jiang Q; Zhu YF; Zhao M Recent Pat Nanotechnol; 2011 Jun; 5(2):106-37. PubMed ID: 21529334 [TBL] [Abstract][Full Text] [Related]
3. Ultralow-k nanoporous organosilicate dielectric films imprinted with dendritic spheres. Lee B; Park YH; Hwang YT; Oh W; Yoon J; Ree M Nat Mater; 2005 Feb; 4(2):147-51. PubMed ID: 15640808 [TBL] [Abstract][Full Text] [Related]
5. Effect of Thermal Boundary Resistance between the Interconnect Metal and Dielectric Interlayer on Temperature Increase of Interconnects in Deeply Scaled VLSI. Zhan T; Oda K; Ma S; Tomita M; Jin Z; Takezawa H; Mesaki K; Wu YJ; Xu Y; Matsukawa T; Matsuki T; Watanabe T ACS Appl Mater Interfaces; 2020 May; 12(19):22347-22356. PubMed ID: 32315529 [TBL] [Abstract][Full Text] [Related]
6. In Situ Time-dependent Dielectric Breakdown in the Transmission Electron Microscope: A Possibility to Understand the Failure Mechanism in Microelectronic Devices. Liao Z; Gall M; Yeap KB; Sander C; Clausner A; Mühle U; Gluch J; Standke Y; Aubel O; Beyer A; Hauschildt M; Zschech E J Vis Exp; 2015 Jun; (100):e52447. PubMed ID: 26167933 [TBL] [Abstract][Full Text] [Related]
7. Surface-Localized Sealing of Porous Ultralow-k Dielectric Films with Ultrathin (<2 nm) Polymer Coating. Yoon SJ; Pak K; Nam T; Yoon A; Kim H; Im SG; Cho BJ ACS Nano; 2017 Aug; 11(8):7841-7847. PubMed ID: 28723069 [TBL] [Abstract][Full Text] [Related]
8. Material design of plasma-enhanced chemical vapour deposition SiCH films for low- Shimizu H; Nagano S; Uedono A; Tajima N; Momose T; Shimogaki Y Sci Technol Adv Mater; 2013 Oct; 14(5):055005. PubMed ID: 27877612 [TBL] [Abstract][Full Text] [Related]
9. Characteristics of an Amorphous Carbon Layer as a Diffusion Barrier for an Advanced Copper Interconnect. An BS; Kwon Y; Oh JS; Lee C; Choi S; Kim H; Lee M; Pae S; Yang CW ACS Appl Mater Interfaces; 2020 Jan; 12(2):3104-3113. PubMed ID: 31845581 [TBL] [Abstract][Full Text] [Related]
10. Plasmonic interconnects versus conventional interconnects: a comparison of latency, crosstalk and energy costs. Conway JA; Sahni S; Szkopek T Opt Express; 2007 Apr; 15(8):4474-84. PubMed ID: 19532694 [TBL] [Abstract][Full Text] [Related]
11. Modification and Characterization of Interfacial Bonding for Thermal Management of Ruthenium Interconnects in Next-Generation Very-Large-Scale Integration Circuits. Zhan T; Sahara K; Takeuchi H; Yokogawa R; Oda K; Jin Z; Deng S; Tomita M; Wu YJ; Xu Y; Matsuki T; Wang H; Song M; Guan S; Ogura A; Watanabe T ACS Appl Mater Interfaces; 2022 Feb; 14(5):7392-7404. PubMed ID: 35099170 [TBL] [Abstract][Full Text] [Related]
12. Electrical Characteristics and Reliability of Nitrogen-Stuffed Porous Low-k SiOCH/Mn Cheng YL; Lin YL; Lee CY; Chen GS; Fang JS Molecules; 2019 Oct; 24(21):. PubMed ID: 31661909 [TBL] [Abstract][Full Text] [Related]
13. Direct-Liquid-Evaporation Chemical Vapor Deposition of Nanocrystalline Cobalt Metal for Nanoscale Copper Interconnect Encapsulation. Feng J; Gong X; Lou X; Gordon RG ACS Appl Mater Interfaces; 2017 Mar; 9(12):10914-10920. PubMed ID: 28266209 [TBL] [Abstract][Full Text] [Related]
18. Porous low dielectric constant materials for microelectronics. Baklanov MR; Maex K Philos Trans A Math Phys Eng Sci; 2006 Jan; 364(1838):201-15. PubMed ID: 18272461 [TBL] [Abstract][Full Text] [Related]
19. MoS Shen T; Valencia D; Wang Q; Wang KC; Povolotskyi M; Kim MJ; Klimeck G; Chen Z; Appenzeller J ACS Appl Mater Interfaces; 2019 Aug; 11(31):28345-28351. PubMed ID: 31287653 [TBL] [Abstract][Full Text] [Related]
20. Emerging Applications for High K Materials in VLSI Technology. Clark RD Materials (Basel); 2014 Apr; 7(4):2913-2944. PubMed ID: 28788599 [TBL] [Abstract][Full Text] [Related] [Next] [New Search]