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13. Three-dimensional optoelectronic stacked processor by use of free-space optical interconnection and three-dimensional VLSI chip stacks. Li G; Huang D; Yuceturk E; Marchand PJ; Esener SC; Ozguz VH; Liu Y Appl Opt; 2002 Jan; 41(2):348-60. PubMed ID: 11899274 [TBL] [Abstract][Full Text] [Related]
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