These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

90 related articles for article (PubMed ID: 21770156)

  • 1. Electrical performances and structural designs of copper bonding in wafer-level three-dimensional integration.
    Chen KN; Young AM; Lee SH; Lu JQ
    J Nanosci Nanotechnol; 2011 Jun; 11(6):5143-7. PubMed ID: 21770156
    [TBL] [Abstract][Full Text] [Related]  

  • 2. Wafer-Level 3D Integration Based on Poly (Diallyl Phthalate) Adhesive Bonding.
    Fang Z; You P; Jia Y; Pan X; Shi Y; Jiao J; He Y
    Micromachines (Basel); 2021 Dec; 12(12):. PubMed ID: 34945436
    [TBL] [Abstract][Full Text] [Related]  

  • 3. Research of Wafer Level Bonding Process Based on Cu-Sn Eutectic.
    Wu D; Tian W; Wang C; Huo R; Wang Y
    Micromachines (Basel); 2020 Aug; 11(9):. PubMed ID: 32825406
    [TBL] [Abstract][Full Text] [Related]  

  • 4. Quartz resonator assembling with TSV interposer using polymer sealing or metal bonding.
    Shih JY; Chen YC; Chiu CH; Lo CL; Chang CC; Chen KN
    Nanoscale Res Lett; 2014; 9(1):541. PubMed ID: 25324705
    [TBL] [Abstract][Full Text] [Related]  

  • 5. Fabrication of nano-scale Cu bond pads with seal design in 3D integration applications.
    Chen KN; Tsang CK; Wu WW; Lee SH; Lu JQ
    J Nanosci Nanotechnol; 2011 Apr; 11(4):3336-9. PubMed ID: 21776705
    [TBL] [Abstract][Full Text] [Related]  

  • 6. Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application.
    Huang YC; Lin YX; Hsiung CK; Hung TH; Chen KN
    Nanomaterials (Basel); 2023 Sep; 13(17):. PubMed ID: 37687000
    [TBL] [Abstract][Full Text] [Related]  

  • 7. Ultrastable 3D Heterogeneous Integration via N-Heterocyclic Carbene Self-Assembled Nanolayers.
    Lee J; Woo G; Lee G; Jeon J; Lee S; Wang Z; Shin H; Lee GW; Kim YJ; Lee DH; Kim MJ; Kim E; Seok H; Cho J; Kang B; No YS; Jang WJ; Kim T
    ACS Appl Mater Interfaces; 2024 Jul; 16(27):35505-35515. PubMed ID: 38935928
    [TBL] [Abstract][Full Text] [Related]  

  • 8. Development and Characterization of Low Temperature Wafer-Level Vacuum Packaging Using Cu-Sn Bonding and Nanomultilayer Getter.
    Kim T; Han S; Lee J; Na Y; Jung J; Park YC; Oh J; Yang C; Kim HY
    Micromachines (Basel); 2023 Feb; 14(2):. PubMed ID: 36838148
    [TBL] [Abstract][Full Text] [Related]  

  • 9. Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression Bonding.
    Tanaka K; Wang WS; Baum M; Froemel J; Hirano H; Tanaka S; Wiemer M; Otto T
    Micromachines (Basel); 2016 Dec; 7(12):. PubMed ID: 30404406
    [TBL] [