These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.
148 related articles for article (PubMed ID: 22629933)
1. Macroscopic and microscopic investigation on chemical mechanical polishing of sapphire wafer. Lee H; Lee H; Jeong H; Choi S; Lee Y; Jeong M; Jeong H J Nanosci Nanotechnol; 2012 Feb; 12(2):1256-9. PubMed ID: 22629933 [TBL] [Abstract][Full Text] [Related]
2. Green chemical mechanical polishing of sapphire wafers using a novel slurry. Xie W; Zhang Z; Liao L; Liu J; Su H; Wang S; Guo D Nanoscale; 2020 Nov; 12(44):22518-22526. PubMed ID: 32996521 [TBL] [Abstract][Full Text] [Related]
3. The Effects of Friction and Temperature in the Chemical-Mechanical Planarization Process. Ilie F; Minea IL; Cotici CD; Hristache AF Materials (Basel); 2023 Mar; 16(7):. PubMed ID: 37048844 [TBL] [Abstract][Full Text] [Related]
4. An in situ study of chemical-mechanical polishing behaviours on sapphire (0001) via simulating the chemical product-removal process by AFM-tapping mode in both liquid and air environments. Shi X; Xu L; Zhou Y; Zou C; Wang R; Pan G Nanoscale; 2018 Nov; 10(42):19692-19700. PubMed ID: 30338330 [TBL] [Abstract][Full Text] [Related]
5. Research on the Preparation and Application of Fixed-Abrasive Tools Based on Solid-Phase Reactions for Sapphire Wafer Lapping and Polishing. Cao L; Zhou X; Wang Y; Yang Z; Chen D; Wei W; Wang K Micromachines (Basel); 2023 Sep; 14(9):. PubMed ID: 37763959 [TBL] [Abstract][Full Text] [Related]
6. The Mechanism of Layer Stacked Clamping (LSC) for Polishing Ultra-Thin Sapphire Wafer. Chen Z; Cao L; Yuan J; Lyu B; Hang W; Wang J Micromachines (Basel); 2020 Aug; 11(8):. PubMed ID: 32781686 [TBL] [Abstract][Full Text] [Related]
7. Effect of OH Huang C; Mu W; Zhou H; Zhu Y; Xu X; Jia Z; Zheng L; Tao X RSC Adv; 2018 Feb; 8(12):6544-6550. PubMed ID: 35540376 [TBL] [Abstract][Full Text] [Related]
8. Analysis of the Influence of the Motion State of Ultra-Thin Sapphire Based on Layer-Stacked Clamping (LSC). Chen Z; Han S; Feng M; Zhang X Micromachines (Basel); 2023 May; 14(6):. PubMed ID: 37374710 [TBL] [Abstract][Full Text] [Related]
9. Preparation of Fe-doped colloidal SiO(2) abrasives and their chemical mechanical polishing behavior on sapphire substrates. Lei H; Gu Q; Chen R; Wang Z Appl Opt; 2015 Aug; 54(24):7188-94. PubMed ID: 26368752 [TBL] [Abstract][Full Text] [Related]
10. Polishing Performance and Removal Mechanism of Core-Shell Structured Diamond/SiO Zhao G; Xu Y; Wang Q; Liu J; Zhan Y; Chen B Micromachines (Basel); 2022 Dec; 13(12):. PubMed ID: 36557459 [TBL] [Abstract][Full Text] [Related]
11. Insight into Polishing Slurry and Material Removal Mechanism of Photoassisted Chemical Mechanical Polishing of YAG Crystals. Zhang X; Guo X; Wang H; Kang R; Gao S Langmuir; 2023 Sep; 39(38):13668-13677. PubMed ID: 37699563 [TBL] [Abstract][Full Text] [Related]
12. Tribochemical mechanisms of abrasives for SiC and sapphire substrates in nanoscale polishing. Luo Q; Lu J; Jiang F; Lin J; Tian Z Nanoscale; 2023 Oct; 15(38):15675-15685. PubMed ID: 37724457 [TBL] [Abstract][Full Text] [Related]
13. Silicon Wafer CMP Slurry Using a Hydrolysis Reaction Accelerator with an Amine Functional Group Remarkably Enhances Polishing Rate. Bae JY; Han MH; Lee SJ; Kim ES; Lee K; Lee GS; Park JH; Park JG Nanomaterials (Basel); 2022 Nov; 12(21):. PubMed ID: 36364668 [TBL] [Abstract][Full Text] [Related]
14. Fabrication of a new substrate for atomic force microscopic observation of DNA molecules from an ultrasmooth sapphire plate. Yoshida K; Yoshimoto M; Sasaki K; Ohnishi T; Ushiki T; Hitomi J; Yamamoto S; Sigeno M Biophys J; 1998 Apr; 74(4):1654-7. PubMed ID: 9545030 [TBL] [Abstract][Full Text] [Related]
15. Polymer Nanoparticles Applied in the CMP (Chemical Mechanical Polishing) Process of Chip Wafers for Defect Improvement and Polishing Removal Rate Response. Chiu WL; Huang CI Polymers (Basel); 2023 Jul; 15(15):. PubMed ID: 37571091 [TBL] [Abstract][Full Text] [Related]
16. Investigation on the Basic Characteristics of Semi-Fixed Abrasive Grains Polishing Technique for Polishing Sapphire (α-Al Lei Y; Feng M; Wu K; Chen J; Ji J; Yuan J Materials (Basel); 2022 Jun; 15(11):. PubMed ID: 35683293 [TBL] [Abstract][Full Text] [Related]
17. Orthogonal Experimental Research on Dielectrophoresis Polishing (DEPP) of Silicon Wafer. Zhao T; Deng Q; Zhang C; Feng K; Zhou Z; Yuan J Micromachines (Basel); 2020 May; 11(6):. PubMed ID: 32471163 [TBL] [Abstract][Full Text] [Related]
18. Study on chemical mechanical polishing of silicon wafer with megasonic vibration assisted. Zhai K; He Q; Li L; Ren Y Ultrasonics; 2017 Sep; 80():9-14. PubMed ID: 28494230 [TBL] [Abstract][Full Text] [Related]
19. Characterization of ultrasonic vibration and polishing force in sapphire ultrasonic vibration-assisted flexible polishing: Insights from in-situ monitoring systems. Geng Y; Sun G; Wang S; Zhao Q Ultrasonics; 2025 Jan; 145():107431. PubMed ID: 39250841 [TBL] [Abstract][Full Text] [Related]
20. Effect of slurry composition on the chemical mechanical polishing of thin diamond films. Werrell JM; Mandal S; Thomas ELH; Brousseau EB; Lewis R; Borri P; Davies PR; Williams OA Sci Technol Adv Mater; 2017; 18(1):654-663. PubMed ID: 29057022 [TBL] [Abstract][Full Text] [Related] [Next] [New Search]