211 related articles for article (PubMed ID: 24283767)
1. Room temperature synthesis of a copper ink for the intense pulsed light sintering of conductive copper films.
Dharmadasa R; Jha M; Amos DA; Druffel T
ACS Appl Mater Interfaces; 2013 Dec; 5(24):13227-34. PubMed ID: 24283767
[TBL] [Abstract][Full Text] [Related]
2. Solution phase synthesis and intense pulsed light sintering and reduction of a copper oxide ink with an encapsulating nickel oxide barrier.
Jha M; Dharmadasa R; Draper GL; Sherehiy A; Sumanasekera G; Amos D; Druffel T
Nanotechnology; 2015 May; 26(17):175601. PubMed ID: 25854751
[TBL] [Abstract][Full Text] [Related]
3. Sintering Copper Nanoparticles with Photonic Additive for Printed Conductive Patterns by Intense Pulsed Light.
Chung WY; Lai YC; Yonezawa T; Liao YC
Nanomaterials (Basel); 2019 Jul; 9(8):. PubMed ID: 31349711
[TBL] [Abstract][Full Text] [Related]
4. Highly conductive copper nano/microparticles ink via flash light sintering for printed electronics.
Joo SJ; Hwang HJ; Kim HS
Nanotechnology; 2014 Jul; 25(26):265601. PubMed ID: 24916116
[TBL] [Abstract][Full Text] [Related]
5. Copper nanoparticles: aqueous phase synthesis and conductive films fabrication at low sintering temperature.
Deng D; Jin Y; Cheng Y; Qi T; Xiao F
ACS Appl Mater Interfaces; 2013 May; 5(9):3839-46. PubMed ID: 23578010
[TBL] [Abstract][Full Text] [Related]
6. Fabrication of Conductive Copper Films on Flexible Polymer Substrates by Low-Temperature Sintering of Composite Cu Ink in Air.
Kanzaki M; Kawaguchi Y; Kawasaki H
ACS Appl Mater Interfaces; 2017 Jun; 9(24):20852-20858. PubMed ID: 28574247
[TBL] [Abstract][Full Text] [Related]
7. Fabrication of Elemental Copper by Intense Pulsed Light Processing of a Copper Nitrate Hydroxide Ink.
Draper GL; Dharmadasa R; Staats ME; Lavery BW; Druffel T
ACS Appl Mater Interfaces; 2015 Aug; 7(30):16478-85. PubMed ID: 26154246
[TBL] [Abstract][Full Text] [Related]
8. In situ monitoring of a flash light sintering process using silver nano-ink for producing flexible electronics.
Chung WH; Hwang HJ; Lee SH; Kim HS
Nanotechnology; 2013 Jan; 24(3):035202. PubMed ID: 23263030
[TBL] [Abstract][Full Text] [Related]
9. In situ monitoring of flash-light sintering of copper nanoparticle ink for printed electronics.
Hwang HJ; Chung WH; Kim HS
Nanotechnology; 2012 Dec; 23(48):485205. PubMed ID: 23138346
[TBL] [Abstract][Full Text] [Related]
10. Intensive Plasmonic Flash Light Sintering of Copper Nanoinks Using a Band-Pass Light Filter for Highly Electrically Conductive Electrodes in Printed Electronics.
Hwang YT; Chung WH; Jang YR; Kim HS
ACS Appl Mater Interfaces; 2016 Apr; 8(13):8591-9. PubMed ID: 26975337
[TBL] [Abstract][Full Text] [Related]
11. Inkjet Fabrication of Copper Patterns for Flexible Electronics: Using Paper with Active Precoatings.
Öhlund T; Schuppert AK; Hummelgård M; Bäckström J; Nilsson HE; Olin H
ACS Appl Mater Interfaces; 2015 Aug; 7(33):18273-82. PubMed ID: 26245645
[TBL] [Abstract][Full Text] [Related]
12. Cu ion ink for a flexible substrate and highly conductive patterning by intensive pulsed light sintering.
Wang BY; Yoo TH; Song YW; Lim DS; Oh YJ
ACS Appl Mater Interfaces; 2013 May; 5(10):4113-9. PubMed ID: 23586602
[TBL] [Abstract][Full Text] [Related]
13. Hybrid Printing Metal-mesh Transparent Conductive Films with Lower Energy Photonically Sintered Copper/tin Ink.
Chen X; Wu X; Shao S; Zhuang J; Xie L; Nie S; Su W; Chen Z; Cui Z
Sci Rep; 2017 Oct; 7(1):13239. PubMed ID: 29038555
[TBL] [Abstract][Full Text] [Related]
14. Synthesis of Antioxidative Conductive Copper Inks with Superior Adhesion.
Ma WY; Cheng YY; Chen JK; Chan KH; Lin ZJ; Chou WH; Chang WC
J Nanosci Nanotechnol; 2018 Jan; 18(1):318-322. PubMed ID: 29768847
[TBL] [Abstract][Full Text] [Related]
15. Conductive inks with a "built-in" mechanism that enables sintering at room temperature.
Grouchko M; Kamyshny A; Mihailescu CF; Anghel DF; Magdassi S
ACS Nano; 2011 Apr; 5(4):3354-9. PubMed ID: 21438563
[TBL] [Abstract][Full Text] [Related]
16. Low-Thermal-Budget Photonic Processing of Highly Conductive Cu Interconnects Based on CuO Nanoinks: Potential for Flexible Printed Electronics.
Rager MS; Aytug T; Veith GM; Joshi P
ACS Appl Mater Interfaces; 2016 Jan; 8(3):2441-8. PubMed ID: 26720684
[TBL] [Abstract][Full Text] [Related]
17. Flame-driven aerosol synthesis of copper-nickel nanopowders and conductive nanoparticle films.
Sharma MK; Qi D; Buchner RD; Scharmach WJ; Papavassiliou V; Swihart MT
ACS Appl Mater Interfaces; 2014 Aug; 6(16):13542-51. PubMed ID: 25075968
[TBL] [Abstract][Full Text] [Related]
18. Direct intense pulsed light sintering of inkjet-printed copper oxide layers within six milliseconds.
Kang H; Sowade E; Baumann RR
ACS Appl Mater Interfaces; 2014 Feb; 6(3):1682-7. PubMed ID: 24433059
[TBL] [Abstract][Full Text] [Related]
19. Suitability of Copper Nitride as a Wiring Ink Sintered by Low-Energy Intense Pulsed Light Irradiation.
Nakamura T; Cheong HJ; Takamura M; Yoshida M; Uemura S
Nanomaterials (Basel); 2018 Aug; 8(8):. PubMed ID: 30110978
[TBL] [Abstract][Full Text] [Related]
20. A self-reducible and alcohol-soluble copper-based metal-organic decomposition ink for printed electronics.
Shin DH; Woo S; Yem H; Cha M; Cho S; Kang M; Jeong S; Kim Y; Kang K; Piao Y
ACS Appl Mater Interfaces; 2014 Mar; 6(5):3312-9. PubMed ID: 24512011
[TBL] [Abstract][Full Text] [Related]
[Next] [New Search]
