These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

158 related articles for article (PubMed ID: 25692392)

  • 1. In situ visualization of metallurgical reactions in nanoscale Cu/Sn diffusion couples.
    Yin Q; Gao F; Gu Z; Stach EA; Zhou G
    Nanoscale; 2015 Mar; 7(11):4984-94. PubMed ID: 25692392
    [TBL] [Abstract][Full Text] [Related]  

  • 2. Microstructural study on Kirkendall void formation in Sn-containing/Cu solder joints during solid-state aging.
    Liu ZQ; Shang PJ; Tan F; Li D
    Microsc Microanal; 2013 Aug; 19 Suppl 5():105-8. PubMed ID: 23920185
    [TBL] [Abstract][Full Text] [Related]  

  • 3. Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient.
    Zhao N; Zhong Y; Huang ML; Ma HT; Dong W
    Sci Rep; 2015 Aug; 5():13491. PubMed ID: 26311323
    [TBL] [Abstract][Full Text] [Related]  

  • 4. Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene.
    Ko YH; Lee JD; Yoon T; Lee CW; Kim TS
    ACS Appl Mater Interfaces; 2016 Mar; 8(8):5679-86. PubMed ID: 26856638
    [TBL] [Abstract][Full Text] [Related]  

  • 5. Homogeneous (Cu, Ni)
    Li ZL; Dong HJ; Song XG; Zhao HY; Tian H; Liu JH; Feng JC; Yan JC
    Ultrason Sonochem; 2018 Apr; 42():403-410. PubMed ID: 29429685
    [TBL] [Abstract][Full Text] [Related]  

  • 6. Effects of Annealing, Thermomigration, and Electromigration on the Intermetallic Compounds Growth Kinetics of Cu/Sn-2.5Ag Microbump.
    Kim SH; Park GT; Park JJ; Park YB
    J Nanosci Nanotechnol; 2015 Nov; 15(11):8593-600. PubMed ID: 26726558
    [TBL] [Abstract][Full Text] [Related]  

  • 7. Ultrarapid formation of homogeneous Cu6Sn5 and Cu3Sn intermetallic compound joints at room temperature using ultrasonic waves.
    Li Z; Li M; Xiao Y; Wang C
    Ultrason Sonochem; 2014 May; 21(3):924-9. PubMed ID: 24279981
    [TBL] [Abstract][Full Text] [Related]  

  • 8. Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging.
    Zhao D; Zhang K; Ma N; Li S; Yin C; Huo F
    Materials (Basel); 2020 Feb; 13(4):. PubMed ID: 32059528
    [TBL] [Abstract][Full Text] [Related]  

  • 9. Microstructure evolution and grain refinement of ultrasonic-assisted soldering joint by using Ni foam reinforced Sn composite solder.
    He H; Song L; Gao H; Xiao Y; Cao Y
    Ultrason Sonochem; 2023 Jan; 92():106244. PubMed ID: 36508893
    [TBL] [Abstract][Full Text] [Related]  

  • 10. Interfacial Reactions between Ga and Cu-10Ni Substrate at Low Temperature.
    Liu S; Zeng G; Yang W; McDonald S; Gu Q; Matsumura S; Nogita K
    ACS Appl Mater Interfaces; 2020 May; 12(18):21045-21056. PubMed ID: 32272014
    [TBL] [Abstract][Full Text] [Related]  

  • 11. Effect of Thermal Aging on the Interfacial Reaction Behavior and Failure Mechanism of Ni-xCu/Sn Soldering Joints under Shear Loading.
    Li Z; Cheng K; Liu J; He Y; Xiao Y
    Materials (Basel); 2023 Jul; 16(15):. PubMed ID: 37569956
    [TBL] [Abstract][Full Text] [Related]  

  • 12. Diffusion Barrier Performance of Ni-W Layer at Sn/Cu Interfacial Reaction.
    Yao J; Li C; Shang M; Chen X; Wang Y; Ma H; Ma H; Liu X
    Materials (Basel); 2024 Jul; 17(15):. PubMed ID: 39124349
    [TBL] [Abstract][Full Text] [Related]  

  • 13. Cu
    Wang J; Wang J; Duan F; Chen H
    Sci Rep; 2023 Jan; 13(1):668. PubMed ID: 36635376
    [TBL] [Abstract][Full Text] [Related]  

  • 14. Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints.
    Zhang C; Zhang K; Gao Y; Wang Y
    Materials (Basel); 2023 Mar; 16(7):. PubMed ID: 37048920
    [TBL] [Abstract][Full Text] [Related]  

  • 15. Joining copper oxide nanotube arrays driven by the nanoscale Kirkendall effect.
    Chun SR; Sasangka WA; Ng MZ; Liu Q; Du A; Zhu J; Ng CM; Liu ZQ; Chiam SY; Gan CL
    Small; 2013 Aug; 9(15):2546-52, 2545. PubMed ID: 23401318
    [TBL] [Abstract][Full Text] [Related]  

  • 16. Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition.
    Wang Q; Chen H; Wang F
    Materials (Basel); 2019 Dec; 12(24):. PubMed ID: 31861193
    [TBL] [Abstract][Full Text] [Related]  

  • 17. Copper/solder intermetallic growth studies.
    Kirchner KW; Lucey GK; Geis J
    Microsc Res Tech; 1993 Aug; 25(5-6):503-8. PubMed ID: 8400445
    [TBL] [Abstract][Full Text] [Related]  

  • 18. Characterization of Sn-Sb-Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu-SiC Metal-Ceramic Composite.
    Kolenak R; Kostolny I; Drapala J; Babincova P; Pasak M
    Materials (Basel); 2021 Oct; 14(21):. PubMed ID: 34771894
    [TBL] [Abstract][Full Text] [Related]  

  • 19. Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects.
    Chia PY; Haseeb ASMA; Mannan SH
    Materials (Basel); 2016 May; 9(6):. PubMed ID: 28773552
    [TBL] [Abstract][Full Text] [Related]  

  • 20. Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate.
    Son J; Yu DY; Kim YC; Kim SI; Kim MS; Byun D; Bang J
    Materials (Basel); 2021 May; 14(9):. PubMed ID: 34063188
    [TBL] [Abstract][Full Text] [Related]  

    [Next]    [New Search]
    of 8.