These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

158 related articles for article (PubMed ID: 25692392)

  • 21. Synthesis of Cu3Sn alloy nanocrystals through sequential reduction induced by gradual increase of the reaction temperature.
    Cho S; Shin DH; Yin Z; Lee C; Park SY; Yoo J; Piao Y; Kim YS
    Chemistry; 2015 Apr; 21(18):6690-4. PubMed ID: 25777248
    [TBL] [Abstract][Full Text] [Related]  

  • 22. Thermodynamic phase control of Cu-Sn alloy electrocatalysts for selective CO
    Go S; Kwon W; Hong D; Lee T; Oh SH; Bae D; Kim JH; Lim S; Joo YC; Nam DH
    Nanoscale Horiz; 2024 Nov; 9(12):2295-2305. PubMed ID: 39291704
    [TBL] [Abstract][Full Text] [Related]  

  • 23. Interfacial Reactions and Mechanical Properties of Sn-58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding.
    Jeong G; Yu DY; Baek S; Bang J; Lee TI; Jung SB; Kim J; Ko YH
    Materials (Basel); 2021 Jan; 14(2):. PubMed ID: 33440741
    [TBL] [Abstract][Full Text] [Related]  

  • 24. Effects of Initial Morphology on Growth Kinetics of Cu
    Lee JY; Chen CM
    Materials (Basel); 2022 Jul; 15(14):. PubMed ID: 35888218
    [TBL] [Abstract][Full Text] [Related]  

  • 25. Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn-Cu solder alloy.
    Satyanarayan ; Prabhu KN
    Adv Colloid Interface Sci; 2011 Aug; 166(1-2):87-118. PubMed ID: 21676366
    [TBL] [Abstract][Full Text] [Related]  

  • 26. A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps.
    Chang YW; Hu CC; Peng HY; Liang YC; Chen C; Chang TC; Zhan CJ; Juang JY
    Sci Rep; 2018 Apr; 8(1):5935. PubMed ID: 29651034
    [TBL] [Abstract][Full Text] [Related]  

  • 27. Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn-5Sb/Cu solder joints under isothermal aging.
    Xin M; Wang X; Sun F
    J Mater Sci Mater Electron; 2022; 33(33):25025-25040. PubMed ID: 38625275
    [TBL] [Abstract][Full Text] [Related]  

  • 28. Secondary Phase Formation Mechanism in the Mo-Back Contact Region during Sulfo-Selenization Using a Metal Precursor: Effect of Wettability between a Liquid Metal and Substrate on Secondary Phase Formation.
    Kim SY; Kim SH; Hong S; Son DH; Kim YI; Kim S; Ahn K; Yang KJ; Kim DH; Kang JK
    ACS Appl Mater Interfaces; 2019 Jul; 11(26):23160-23167. PubMed ID: 31252489
    [TBL] [Abstract][Full Text] [Related]  

  • 29. In situ TEM study of stability of TaRhx diffusion barriers using a novel sample preparation method.
    Dalili N; Li P; Kupsta M; Liu Q; Ivey DG
    Micron; 2014 Mar; 58():25-31. PubMed ID: 24296039
    [TBL] [Abstract][Full Text] [Related]  

  • 30. Effect of CoSn
    Wang J; Zhang L; Lv Z; Wang J; Zhang W; Wang X; Chen H; Li M
    Sci Rep; 2023 Nov; 13(1):20693. PubMed ID: 38001161
    [TBL] [Abstract][Full Text] [Related]  

  • 31. Effects of Cu/SnAgCu Powder Fraction and Sintering Time on Microstructure and Mechanical Properties of Transient Liquid Phase Sintered Joints.
    Tran DP; Liu YT; Chen C
    Materials (Basel); 2024 Apr; 17(9):. PubMed ID: 38730812
    [TBL] [Abstract][Full Text] [Related]  

  • 32. Growth kinetics of Cu
    Feng J; Hang C; Tian Y; Liu B; Wang C
    Sci Rep; 2018 Jan; 8(1):1775. PubMed ID: 29379073
    [TBL] [Abstract][Full Text] [Related]  

  • 33. Predictions of particle size and lattice diffusion pathway requirements for sodium-ion anodes using η-Cu6Sn5 thin films as a model system.
    Baggetto L; Jumas JC; Górka J; Bridges CA; Veith GM
    Phys Chem Chem Phys; 2013 Jul; 15(26):10885-94. PubMed ID: 23698702
    [TBL] [Abstract][Full Text] [Related]  

  • 34. Volume Shrinkage-Induced Voiding Mechanism During Electromigration of Cu/Ni/Sn-Ag Microbump.
    Son K; Park GT; Lee BR; Park YB
    J Nanosci Nanotechnol; 2020 Jan; 20(1):278-284. PubMed ID: 31383167
    [TBL] [Abstract][Full Text] [Related]  

  • 35. Formation of Nanocrystalline Surface of Cu-Sn Alloy Foam Electrochemically Produced for Li-Ion Battery Electrode.
    Ye B; Kim S
    J Nanosci Nanotechnol; 2015 Oct; 15(10):8217-21. PubMed ID: 26726491
    [TBL] [Abstract][Full Text] [Related]  

  • 36. Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps.
    Kao CW; Kung PY; Chang CC; Huang WC; Chang FL; Kao CR
    Materials (Basel); 2022 Jun; 15(12):. PubMed ID: 35744357
    [TBL] [Abstract][Full Text] [Related]  

  • 37. Mechanical Properties of Solder-Jointed Copper Rods with Electrodeposited Sn-Zn Alloy Films.
    Tsurusaki T; Ohgai T
    Materials (Basel); 2020 Mar; 13(6):. PubMed ID: 32183363
    [TBL] [Abstract][Full Text] [Related]  

  • 38. Artifact-Free Microstructures in the Interfacial Reaction between Eutectic In-48Sn and Cu Using Ion Milling.
    Chang FL; Lin YH; Hung HT; Kao CW; Kao CR
    Materials (Basel); 2023 Apr; 16(9):. PubMed ID: 37176172
    [TBL] [Abstract][Full Text] [Related]  

  • 39. Direct observation of Sn crystal growth during the lithiation and delithiation processes of SnO(2) nanowires.
    Zhang LQ; Liu XH; Perng YC; Cho J; Chang JP; Mao SX; Ye ZZ; Huang JY
    Micron; 2012 Nov; 43(11):1127-33. PubMed ID: 22770619
    [TBL] [Abstract][Full Text] [Related]  

  • 40. Imaging the Polymorphic Transformation in a Single Cu₆Sn₅ Grain in a Solder Joint.
    Somidin F; Maeno H; Tran XQ; D McDonald S; Mohd Salleh MAA; Matsumura S; Nogita K
    Materials (Basel); 2018 Nov; 11(11):. PubMed ID: 30423946
    [TBL] [Abstract][Full Text] [Related]  

    [Previous]   [Next]    [New Search]
    of 8.