These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

191 related articles for article (PubMed ID: 26964943)

  • 1. Ultrasonic semi-solid coating soldering 6061 aluminum alloys with Sn-Pb-Zn alloys.
    Yu XY; Xing WQ; Ding M
    Ultrason Sonochem; 2016 Jul; 31():216-21. PubMed ID: 26964943
    [TBL] [Abstract][Full Text] [Related]  

  • 2. Direct-soldering 6061 aluminum alloys with ultrasonic coating.
    Ding M; Zhang PL; Zhang ZY; Yao S
    Ultrason Sonochem; 2010 Feb; 17(2):292-7. PubMed ID: 19900830
    [TBL] [Abstract][Full Text] [Related]  

  • 3. Ultrasonic-assisted soldering of fine-grained 7034 aluminum alloy using Sn-Zn solders below 300°C.
    Guo W; Luan T; He J; Yan J
    Ultrason Sonochem; 2018 Jan; 40(Pt A):815-821. PubMed ID: 28946490
    [TBL] [Abstract][Full Text] [Related]  

  • 4. Ultrasonic semi-solid soldering 6061 aluminum alloys joint with Sn-9Zn solder reinforced with nano/nano+micron Al
    Min D
    Ultrason Sonochem; 2019 Apr; 52():150-156. PubMed ID: 30477792
    [TBL] [Abstract][Full Text] [Related]  

  • 5. Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints.
    Wang F; Huang Y; Zhang Z; Yan C
    Materials (Basel); 2017 Aug; 10(8):. PubMed ID: 28792440
    [TBL] [Abstract][Full Text] [Related]  

  • 6. Microstructural evolution of SiC joints soldered using Zn-Al filler metals with the assistance of ultrasound.
    Wu B; Leng X; Xiu Z; Yan J
    Ultrason Sonochem; 2018 Jun; 44():280-287. PubMed ID: 29680613
    [TBL] [Abstract][Full Text] [Related]  

  • 7. Solid-phase transient soldering method based on Au/Ni-W multilayer thin-film-modified copper-based structures.
    Xiao J; Zhai Q; Luo J
    Heliyon; 2024 Jun; 10(12):e33071. PubMed ID: 38988553
    [TBL] [Abstract][Full Text] [Related]  

  • 8. Ultrasonic soldering of Cu alloy using Ni-foam/Sn composite interlayer.
    Xiao Y; Wang Q; Wang L; Zeng X; Li M; Wang Z; Zhang X; Zhu X
    Ultrason Sonochem; 2018 Jul; 45():223-230. PubMed ID: 29705316
    [TBL] [Abstract][Full Text] [Related]  

  • 9. Microstructure evolution and grain refinement of ultrasonic-assisted soldering joint by using Ni foam reinforced Sn composite solder.
    He H; Song L; Gao H; Xiao Y; Cao Y
    Ultrason Sonochem; 2023 Jan; 92():106244. PubMed ID: 36508893
    [TBL] [Abstract][Full Text] [Related]  

  • 10. Ultrasonic-promoted rapid TLP bonding of fine-grained 7034 high strength aluminum alloys.
    Guo W; Leng X; Luan T; Yan J; He J
    Ultrason Sonochem; 2017 May; 36():354-361. PubMed ID: 28069220
    [TBL] [Abstract][Full Text] [Related]  

  • 11. [Study on postsoldering of Ni-Cr ceramic alloys. Effect of soldering temperature and atmosphere].
    Ishigure K
    Aichi Gakuin Daigaku Shigakkai Shi; 1990 Mar; 28(1 Pt 1):21-41. PubMed ID: 1983731
    [TBL] [Abstract][Full Text] [Related]  

  • 12. Mechanical Properties of Solder-Jointed Copper Rods with Electrodeposited Sn-Zn Alloy Films.
    Tsurusaki T; Ohgai T
    Materials (Basel); 2020 Mar; 13(6):. PubMed ID: 32183363
    [TBL] [Abstract][Full Text] [Related]  

  • 13. Building a nano-crystalline α-alumina layer at a liquid metal/sapphire interface by ultrasound.
    Cui W; Yan J; Dai Y; Li D
    Ultrason Sonochem; 2015 Jan; 22():108-12. PubMed ID: 24882591
    [TBL] [Abstract][Full Text] [Related]  

  • 14. Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn-Cu solder alloy.
    Satyanarayan ; Prabhu KN
    Adv Colloid Interface Sci; 2011 Aug; 166(1-2):87-118. PubMed ID: 21676366
    [TBL] [Abstract][Full Text] [Related]  

  • 15. Ultrasonic-accelerated metallurgical reaction of Sn/Ni composite solder: Principle, kinetics, microstructure, and joint properties.
    Zhang W; Cao Y; Huang J; Zhao W; Liu X; Li M; Ji H
    Ultrason Sonochem; 2020 Sep; 66():105090. PubMed ID: 32247233
    [TBL] [Abstract][Full Text] [Related]  

  • 16. Microstructure and morphology of the soldering interface of Sn-2.0Ag-1.5Zn low Ag content lead-free solder ball and different substrates.
    Xiao J; Tong X; Liang J; Chen Q; Tang Q
    Heliyon; 2023 Feb; 9(2):e12952. PubMed ID: 36747560
    [TBL] [Abstract][Full Text] [Related]  

  • 17. Characterization of Sn-Sb-Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu-SiC Metal-Ceramic Composite.
    Kolenak R; Kostolny I; Drapala J; Babincova P; Pasak M
    Materials (Basel); 2021 Oct; 14(21):. PubMed ID: 34771894
    [TBL] [Abstract][Full Text] [Related]  

  • 18. Characterization of Zn-Mg-Sr Type Soldering Alloy and Study of Ultrasonic Soldering of SiC Ceramics and Cu-SiC Composite.
    Kolenak R; Pluhar A; Drapala J; Babincova P; Pasak M
    Materials (Basel); 2023 May; 16(10):. PubMed ID: 37241421
    [TBL] [Abstract][Full Text] [Related]  

  • 19. Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted reflow soldering.
    Tan AT; Tan AW; Yusof F
    Ultrason Sonochem; 2017 Jan; 34():616-625. PubMed ID: 27773288
    [TBL] [Abstract][Full Text] [Related]  

  • 20. Soldering strength of post-soldering of palladium-based metal-ceramic alloys.
    Sakurai Y; Kawada E; Oda Y
    Bull Tokyo Dent Coll; 1997 May; 38(2):95-103. PubMed ID: 9566126
    [TBL] [Abstract][Full Text] [Related]  

    [Next]    [New Search]
    of 10.