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6. Ultrasonic soldering of Cu alloy using Ni-foam/Sn composite interlayer. Xiao Y; Wang Q; Wang L; Zeng X; Li M; Wang Z; Zhang X; Zhu X Ultrason Sonochem; 2018 Jul; 45():223-230. PubMed ID: 29705316 [TBL] [Abstract][Full Text] [Related]
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