These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

305 related articles for article (PubMed ID: 29677761)

  • 1. Mechanical Property of SAC305 Ball-Grid Array and Epoxy Sn-58Bi Solder Joints with 85 °C/85% Relative Humidity Environmental Conditions.
    Kim KY; Myung WR; Jeong H; Sung YG; Jung SB
    J Nanosci Nanotechnol; 2018 Sep; 18(9):6162-6166. PubMed ID: 29677761
    [TBL] [Abstract][Full Text] [Related]  

  • 2. Effects of Cu Opening Size on the Mechanical Properties of Epoxy-Contained Sn-58Bi Solder Joints.
    Min KD; Myung WR; Kim KY; Sung YG; Jung SB
    J Nanosci Nanotechnol; 2019 Oct; 19(10):6437-6443. PubMed ID: 31026974
    [TBL] [Abstract][Full Text] [Related]  

  • 3. Effect of Epoxy on Mechanical Property of SAC305 Solder Joint with Various Surface Finishes Under 3-Point Bend Test.
    Jeong H; Myung WR; Sung YG; Kim KY; Jung SB
    J Nanosci Nanotechnol; 2018 Sep; 18(9):6316-6320. PubMed ID: 29677789
    [TBL] [Abstract][Full Text] [Related]  

  • 4. Interfacial Reactions and Mechanical Properties of Sn-58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding.
    Jeong G; Yu DY; Baek S; Bang J; Lee TI; Jung SB; Kim J; Ko YH
    Materials (Basel); 2021 Jan; 14(2):. PubMed ID: 33440741
    [TBL] [Abstract][Full Text] [Related]  

  • 5. Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints.
    Wang F; Huang Y; Zhang Z; Yan C
    Materials (Basel); 2017 Aug; 10(8):. PubMed ID: 28792440
    [TBL] [Abstract][Full Text] [Related]  

  • 6. Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder.
    Yang F; Zhang L; Liu ZQ; Zhong SJ; Ma J; Bao L
    Materials (Basel); 2017 May; 10(5):. PubMed ID: 28772917
    [TBL] [Abstract][Full Text] [Related]  

  • 7. Influence of Isothermal Aging on Microstructure and Shear Property of Novel Epoxy Composite SAC305 Solder Joints.
    Zhang P; Xue S; Liu L; Wang J; Tatsumi H; Nishikawa H
    Polymers (Basel); 2023 Oct; 15(20):. PubMed ID: 37896411
    [TBL] [Abstract][Full Text] [Related]  

  • 8. Microstructure and Shear Behaviour of Sn-3.0Ag-0.5Cu Composite Solder Pastes Enhanced by Epoxy Resin.
    Zhang P; Xue S; Liu L; Wu J; Luo Q; Wang J
    Polymers (Basel); 2022 Dec; 14(23):. PubMed ID: 36501697
    [TBL] [Abstract][Full Text] [Related]  

  • 9. Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes.
    Choi H; Kim CL; Sohn Y
    Materials (Basel); 2022 Nov; 15(23):. PubMed ID: 36499917
    [TBL] [Abstract][Full Text] [Related]  

  • 10. Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn⁻Ag⁻Cu Solder on a Cu Substrate.
    Kang MS; Kim DS; Shin YE
    Materials (Basel); 2019 Mar; 12(6):. PubMed ID: 30901825
    [TBL] [Abstract][Full Text] [Related]  

  • 11. Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low Temperature.
    He S; Jiang J; Shen YA; Mo L; Bi Y; Wu J; Guo C
    Materials (Basel); 2024 Feb; 17(5):. PubMed ID: 38473526
    [TBL] [Abstract][Full Text] [Related]  

  • 12. Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing.
    Zaimi NSM; Salleh MAAM; Sandu AV; Abdullah MMAB; Saud N; Rahim SZA; Vizureanu P; Said RM; Ramli MII
    Materials (Basel); 2021 Feb; 14(4):. PubMed ID: 33562200
    [TBL] [Abstract][Full Text] [Related]  

  • 13. Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu.
    Li YJ; Yen YW; Chen CM
    Materials (Basel); 2024 May; 17(9):. PubMed ID: 38730955
    [TBL] [Abstract][Full Text] [Related]  

  • 14. The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints.
    Kang MS; Kim DS; Shin YE
    Materials (Basel); 2019 Mar; 12(6):. PubMed ID: 30909434
    [TBL] [Abstract][Full Text] [Related]  

  • 15. Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow.
    Zaimi NSM; Salleh MAAM; Abdullah MMA; Nadzri NIM; Sandu AV; Vizureanu P; Ramli MII; Nogita K; Yasuda H; Sandu IG
    Materials (Basel); 2022 Apr; 15(8):. PubMed ID: 35454450
    [TBL] [Abstract][Full Text] [Related]  

  • 16. The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints.
    Sayyadi R; Naffakh-Moosavy H
    Sci Rep; 2019 Jun; 9(1):8389. PubMed ID: 31182784
    [TBL] [Abstract][Full Text] [Related]  

  • 17. Microstructure and morphology of the soldering interface of Sn-2.0Ag-1.5Zn low Ag content lead-free solder ball and different substrates.
    Xiao J; Tong X; Liang J; Chen Q; Tang Q
    Heliyon; 2023 Feb; 9(2):e12952. PubMed ID: 36747560
    [TBL] [Abstract][Full Text] [Related]  

  • 18. Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling.
    Shen C; Hai Z; Zhao C; Zhang J; Evans JL; Bozack MJ; Suhling JC
    Materials (Basel); 2017 Apr; 10(5):. PubMed ID: 28772811
    [TBL] [Abstract][Full Text] [Related]  

  • 19. Atomistic analysis of the thermomechanical properties of Sn-Ag-Cu solder materials at the nanoscale with the MEAM potential.
    Motalab M; Paul R; Saha S; Mojumder S; Ahmed T; Suhling JC
    J Mol Model; 2019 Feb; 25(3):59. PubMed ID: 30741336
    [TBL] [Abstract][Full Text] [Related]  

  • 20. Intermetallic Growth Mechanism and Mechanical Properties of Post-Annealed SAC305 Solder Joints on Cu-Based Electrode Interfaces.
    Beck J; Baek YJ; Son S; Kim JB; Yang SH; Hyun SK
    J Nanosci Nanotechnol; 2019 Mar; 19(3):1645-1648. PubMed ID: 30469238
    [TBL] [Abstract][Full Text] [Related]  

    [Next]    [New Search]
    of 16.