These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.
158 related articles for article (PubMed ID: 29722528)
21. Modeling and Validation of Total Ionizing Dose Effect on the TSVs in RF Microsystem. Yang L; Li Z; Shan G; Lu Q; Fu Y Micromachines (Basel); 2023 May; 14(6):. PubMed ID: 37374765 [TBL] [Abstract][Full Text] [Related]
22. Investigation of thermal effects in through-silicon vias using scanning thermal microscopy. Wielgoszewski G; Jóźwiak G; Babij M; Baraniecki T; Geer R; Gotszalk T Micron; 2014 Nov; 66():63-8. PubMed ID: 25080278 [TBL] [Abstract][Full Text] [Related]
23. Mechanical integrity of a carbon nanotube/copper-based through-silicon via for 3D integrated circuits: a multi-scale modeling approach. Awad I; Ladani L Nanotechnology; 2015 Dec; 26(48):485705. PubMed ID: 26559788 [TBL] [Abstract][Full Text] [Related]
24. Fabrication and Optimization of High Aspect Ratio Through-Silicon-Vias Electroplating for 3D Inductor. Li H; Liu J; Xu T; Xia J; Tan X; Tao Z Micromachines (Basel); 2018 Oct; 9(10):. PubMed ID: 30424461 [TBL] [Abstract][Full Text] [Related]
25. Effect of Pulse Current and Pre-annealing on Thermal Extrusion of Cu in Through-Silicon via (TSV). Kim Y; Jin S; Park K; Lee J; Lim JH; Yoo B Front Chem; 2020; 8():771. PubMed ID: 33195017 [TBL] [Abstract][Full Text] [Related]
26. Process Optimization and Performance Evaluation of TSV Arrays for High Voltage Application. Feng L; Zeng S; Su Y; Wang L; Xu Y; Guo S; Chen S; Ji Y; Peng X; Wu Z; Wang S Micromachines (Basel); 2022 Dec; 14(1):. PubMed ID: 36677165 [TBL] [Abstract][Full Text] [Related]
27. Electromagnetic analysis for optical coherence tomography based through silicon vias metrology. Iff WA; Hugonin JP; Sauvan C; Besbes M; Chavel P; Vienne G; Milord L; Alliata D; Herth E; Coste P; Bosseboeuf A Appl Opt; 2019 Sep; 58(27):7472-7488. PubMed ID: 31674397 [TBL] [Abstract][Full Text] [Related]
28. A RF Redundant TSV Interconnection for High Resistance Si Interposer. Wang M; Ma S; Jin Y; Wang W; Chen J; Hu L; He S Micromachines (Basel); 2021 Feb; 12(2):. PubMed ID: 33567782 [TBL] [Abstract][Full Text] [Related]
29. Electrodeposition of Nanotwin Cu by Pulse Current for Through-Si-Via (TSV) Process. Jin S; Seo S; Wang G; Yoo B J Nanosci Nanotechnol; 2016 May; 16(5):5410-4. PubMed ID: 27483940 [TBL] [Abstract][Full Text] [Related]
30. Self-Anchored Catalyst Interface Enables Ordered Via Array Formation from Submicrometer to Millimeter Scale for Polycrystalline and Single-Crystalline Silicon. Kim JD; Kim M; Kong L; Mohseni PK; Ranganathan S; Pachamuthu J; Chim WK; Chiam SY; Coleman JJ; Li X ACS Appl Mater Interfaces; 2018 Mar; 10(10):9116-9122. PubMed ID: 29406759 [TBL] [Abstract][Full Text] [Related]
31. Bottom-Up Cu Filling of High-Aspect-Ratio through-Diamond vias for 3D Integration in Thermal Management. Zhao K; Zhao J; Wei X; Guan X; Deng C; Dai B; Zhu J Micromachines (Basel); 2023 Jan; 14(2):. PubMed ID: 36837990 [TBL] [Abstract][Full Text] [Related]
32. Comprehensive characterization of TSV etching performance with phase-contrast X-ray microtomography. Li K; Deng B; Zhang H; Yu F; Xue Y; Xie C; Ye T; Xiao T J Synchrotron Radiat; 2020 Jul; 27(Pt 4):1023-1032. PubMed ID: 33566012 [TBL] [Abstract][Full Text] [Related]
33. TSV-integrated thermoelectric cooling by holey silicon for hot spot thermal management. Ren Z; Yu Z; Kim JC; Lee J Nanotechnology; 2019 Jan; 30(3):035201. PubMed ID: 30418957 [TBL] [Abstract][Full Text] [Related]
34. Automated, 3-D and Sub-Micron Accurate Ablation-Volume Determination by Inverse Molding and X-Ray Computed Tomography. Monserrat Lopez D; Grimaudo V; Prone G; Flisch A; Riedo A; Zboray R; Lüthi T; Mayor M; Fussenegger M; Broekmann P; Wurz P; Lörtscher E Adv Sci (Weinh); 2022 Jul; 9(20):e2200136. PubMed ID: 35521972 [TBL] [Abstract][Full Text] [Related]
35. Chemical-mechanical planarization aided dimple etching for self alignment. Jeong M; Choi S; Guo Y; Park J; Jeong H J Nanosci Nanotechnol; 2012 Apr; 12(4):3191-4. PubMed ID: 22849086 [TBL] [Abstract][Full Text] [Related]
36. Metal particles produced by laser ablation for ICP-MS measurements. Gonzalez JJ; Liu C; Wen SB; Mao X; Russo RE Talanta; 2007 Sep; 73(3):567-76. PubMed ID: 19073072 [TBL] [Abstract][Full Text] [Related]
37. Capabilities of femtosecond laser ablation inductively coupled plasma mass spectrometry for depth profiling of thin metal coatings. Pisonero J; Koch J; Wälle M; Hartung W; Spencer ND; Günther D Anal Chem; 2007 Mar; 79(6):2325-33. PubMed ID: 17305314 [TBL] [Abstract][Full Text] [Related]
38. Diffusion barrier and adhesion properties of SiO(x)N(y) and SiO(x) layers between Ag/polypyrrole composites and Si substrates. Horváth B; Kawakita J; Chikyow T ACS Appl Mater Interfaces; 2014 Jun; 6(12):9201-6. PubMed ID: 24869419 [TBL] [Abstract][Full Text] [Related]
39. Superconformal Copper Deposition in Through Silicon Vias by Suppression-Breakdown. Josell D; Moffat TP J Electrochem Soc; 2018; 165(2):. PubMed ID: 33041352 [TBL] [Abstract][Full Text] [Related]
40. Superconformal Film Growth: From Smoothing Surfaces to Interconnect Technology. Moffat TP; Braun TM; Raciti D; Josell D Acc Chem Res; 2023 May; 56(9):1004-1017. PubMed ID: 37076974 [TBL] [Abstract][Full Text] [Related] [Previous] [Next] [New Search]