These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

208 related articles for article (PubMed ID: 30477792)

  • 1. Ultrasonic semi-solid soldering 6061 aluminum alloys joint with Sn-9Zn solder reinforced with nano/nano+micron Al
    Min D
    Ultrason Sonochem; 2019 Apr; 52():150-156. PubMed ID: 30477792
    [TBL] [Abstract][Full Text] [Related]  

  • 2. Ultrasonic-assisted soldering of fine-grained 7034 aluminum alloy using Sn-Zn solders below 300°C.
    Guo W; Luan T; He J; Yan J
    Ultrason Sonochem; 2018 Jan; 40(Pt A):815-821. PubMed ID: 28946490
    [TBL] [Abstract][Full Text] [Related]  

  • 3. Ultrasonic soldering of Cu alloy using Ni-foam/Sn composite interlayer.
    Xiao Y; Wang Q; Wang L; Zeng X; Li M; Wang Z; Zhang X; Zhu X
    Ultrason Sonochem; 2018 Jul; 45():223-230. PubMed ID: 29705316
    [TBL] [Abstract][Full Text] [Related]  

  • 4. Ultrasonic semi-solid coating soldering 6061 aluminum alloys with Sn-Pb-Zn alloys.
    Yu XY; Xing WQ; Ding M
    Ultrason Sonochem; 2016 Jul; 31():216-21. PubMed ID: 26964943
    [TBL] [Abstract][Full Text] [Related]  

  • 5. Direct-soldering 6061 aluminum alloys with ultrasonic coating.
    Ding M; Zhang PL; Zhang ZY; Yao S
    Ultrason Sonochem; 2010 Feb; 17(2):292-7. PubMed ID: 19900830
    [TBL] [Abstract][Full Text] [Related]  

  • 6. Microstructure evolution and grain refinement of ultrasonic-assisted soldering joint by using Ni foam reinforced Sn composite solder.
    He H; Song L; Gao H; Xiao Y; Cao Y
    Ultrason Sonochem; 2023 Jan; 92():106244. PubMed ID: 36508893
    [TBL] [Abstract][Full Text] [Related]  

  • 7. Solid-phase transient soldering method based on Au/Ni-W multilayer thin-film-modified copper-based structures.
    Xiao J; Zhai Q; Luo J
    Heliyon; 2024 Jun; 10(12):e33071. PubMed ID: 38988553
    [TBL] [Abstract][Full Text] [Related]  

  • 8. Building a nano-crystalline α-alumina layer at a liquid metal/sapphire interface by ultrasound.
    Cui W; Yan J; Dai Y; Li D
    Ultrason Sonochem; 2015 Jan; 22():108-12. PubMed ID: 24882591
    [TBL] [Abstract][Full Text] [Related]  

  • 9. Control Al/Mg intermetallic compound formation during ultrasonic-assisted soldering Mg to Al.
    Xu Z; Li Z; Li J; Ma Z; Yan J
    Ultrason Sonochem; 2018 Sep; 46():79-88. PubMed ID: 29739515
    [TBL] [Abstract][Full Text] [Related]  

  • 10. Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted reflow soldering.
    Tan AT; Tan AW; Yusof F
    Ultrason Sonochem; 2017 Jan; 34():616-625. PubMed ID: 27773288
    [TBL] [Abstract][Full Text] [Related]  

  • 11. Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints.
    Wang F; Huang Y; Zhang Z; Yan C
    Materials (Basel); 2017 Aug; 10(8):. PubMed ID: 28792440
    [TBL] [Abstract][Full Text] [Related]  

  • 12. Soldering of Passive Components Using Sn Nanoparticle Reinforced Solder Paste: Influence on Microstructure and Joint Strength.
    Atieh AM; Abedalaziz TJ; AlHazaa A; Weser M; Al-Kouz WG; Sari MS; Alhoweml I
    Nanomaterials (Basel); 2019 Oct; 9(10):. PubMed ID: 31627380
    [TBL] [Abstract][Full Text] [Related]  

  • 13. Effects of Yttrium Addition on the Microstructure Evolution and Electrochemical Corrosion of SN-9Zn Lead-Free Solders Alloy.
    Yang W; Mao J; Ma Y; Yu S; He H; Qi D; Zhan Y
    Materials (Basel); 2021 May; 14(10):. PubMed ID: 34068956
    [TBL] [Abstract][Full Text] [Related]  

  • 14. [Study on postsoldering of Ni-Cr ceramic alloys. Effect of soldering temperature and atmosphere].
    Ishigure K
    Aichi Gakuin Daigaku Shigakkai Shi; 1990 Mar; 28(1 Pt 1):21-41. PubMed ID: 1983731
    [TBL] [Abstract][Full Text] [Related]  

  • 15. Effects of ultrasonic vibration on microstructure and mechanical properties of nano-sized SiC particles reinforced Al-5Cu composites.
    Li J; Lü S; Wu S; Gao Q
    Ultrason Sonochem; 2018 Apr; 42():814-822. PubMed ID: 29429735
    [TBL] [Abstract][Full Text] [Related]  

  • 16. Ultrasonic-accelerated metallurgical reaction of Sn/Ni composite solder: Principle, kinetics, microstructure, and joint properties.
    Zhang W; Cao Y; Huang J; Zhao W; Liu X; Li M; Ji H
    Ultrason Sonochem; 2020 Sep; 66():105090. PubMed ID: 32247233
    [TBL] [Abstract][Full Text] [Related]  

  • 17. Grain refinement caused by intensified cavitation within narrow channel and its improvement to ultrasonically soldered Al joint property.
    Li Z; Xu Z; Zhao D; Liu X; Yan J
    Ultrason Sonochem; 2020 Jan; 60():104786. PubMed ID: 31536881
    [TBL] [Abstract][Full Text] [Related]  

  • 18. Microstructural evolution of SiC joints soldered using Zn-Al filler metals with the assistance of ultrasound.
    Wu B; Leng X; Xiu Z; Yan J
    Ultrason Sonochem; 2018 Jun; 44():280-287. PubMed ID: 29680613
    [TBL] [Abstract][Full Text] [Related]  

  • 19. Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling.
    Cui J; Zhang K; Zhao D; Pan Y
    Sci Rep; 2021 Mar; 11(1):6297. PubMed ID: 33737642
    [TBL] [Abstract][Full Text] [Related]  

  • 20. Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered with Bi-Ag-Mg-Type Solder.
    Kolenak R; Melus T; Drapala J; Gogola P; Pasak M
    Materials (Basel); 2023 Apr; 16(8):. PubMed ID: 37109827
    [TBL] [Abstract][Full Text] [Related]  

    [Next]    [New Search]
    of 11.