These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

197 related articles for article (PubMed ID: 30842519)

  • 1. Effect of FeCoNiCrCu
    Shen YA; Lin CM; Li J; He S; Nishikawa H
    Sci Rep; 2019 Mar; 9(1):3658. PubMed ID: 30842519
    [TBL] [Abstract][Full Text] [Related]  

  • 2. Suppressed Growth of (Fe, Cr
    Shen YA; Lin CM; Li J; Gao R; Nishikawa H
    Sci Rep; 2019 Jul; 9(1):10210. PubMed ID: 31308462
    [TBL] [Abstract][Full Text] [Related]  

  • 3. The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-
    Li C; Yan Y; Gao T; Xu G
    Materials (Basel); 2020 Oct; 13(19):. PubMed ID: 33036405
    [TBL] [Abstract][Full Text] [Related]  

  • 4. Author Correction: Effect of FeCoNiCrCu
    Shen YA; Lin CM; Li J; He S; Nishikawa H
    Sci Rep; 2020 Jul; 10(1):12229. PubMed ID: 32699303
    [TBL] [Abstract][Full Text] [Related]  

  • 5. Tensile properties and thermal shock reliability of Sn-Ag-Cu solder joint with indium addition.
    Yu AM; Jang JW; Lee JH; Kim JK; Kim MS
    J Nanosci Nanotechnol; 2012 Apr; 12(4):3655-7. PubMed ID: 22849189
    [TBL] [Abstract][Full Text] [Related]  

  • 6. Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene.
    Ko YH; Lee JD; Yoon T; Lee CW; Kim TS
    ACS Appl Mater Interfaces; 2016 Mar; 8(8):5679-86. PubMed ID: 26856638
    [TBL] [Abstract][Full Text] [Related]  

  • 7. Microstructure and morphology of the soldering interface of Sn-2.0Ag-1.5Zn low Ag content lead-free solder ball and different substrates.
    Xiao J; Tong X; Liang J; Chen Q; Tang Q
    Heliyon; 2023 Feb; 9(2):e12952. PubMed ID: 36747560
    [TBL] [Abstract][Full Text] [Related]  

  • 8. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition.
    Leong YM; Haseeb ASMA
    Materials (Basel); 2016 Jun; 9(7):. PubMed ID: 28773645
    [TBL] [Abstract][Full Text] [Related]  

  • 9. The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints.
    Fu X; Liu M; Xu K; Chen S; Shi Y; Fu Z; Huang Y; Chen H; Yao R
    Materials (Basel); 2020 Dec; 13(23):. PubMed ID: 33276575
    [TBL] [Abstract][Full Text] [Related]  

  • 10. Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate.
    Huang ML; Yang F
    Sci Rep; 2014 Nov; 4():7117. PubMed ID: 25408359
    [TBL] [Abstract][Full Text] [Related]  

  • 11. Effects of Cu Opening Size on the Mechanical Properties of Epoxy-Contained Sn-58Bi Solder Joints.
    Min KD; Myung WR; Kim KY; Sung YG; Jung SB
    J Nanosci Nanotechnol; 2019 Oct; 19(10):6437-6443. PubMed ID: 31026974
    [TBL] [Abstract][Full Text] [Related]  

  • 12. Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn-Cu solder alloy.
    Satyanarayan ; Prabhu KN
    Adv Colloid Interface Sci; 2011 Aug; 166(1-2):87-118. PubMed ID: 21676366
    [TBL] [Abstract][Full Text] [Related]  

  • 13. Microstructure and Electro-Physical Properties of Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced with Ni Nanoparticles in the Melting-Solidification Temperature Range.
    Yakymovych A; Plevachuk Y; Sklyarchuk V; Sokoliuk B; Galya T; Ipser H
    J Phase Equilibria Diffus; 2017; 38(3):217-222. PubMed ID: 32025225
    [TBL] [Abstract][Full Text] [Related]  

  • 14. Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper.
    Xiao J; Cheng W; Fu-Kang Q
    Heliyon; 2024 Mar; 10(5):e27010. PubMed ID: 38455589
    [TBL] [Abstract][Full Text] [Related]  

  • 15. Crystallographic Characteristic Effect of Cu Substrate on Serrated Cathode Dissolution in Cu/Sn-3.0Ag-0.5Cu/Cu Solder Joints during Electromigration.
    Yue W; Ding C; Qin H; Gong C; Zhang J
    Materials (Basel); 2021 May; 14(10):. PubMed ID: 34064928
    [TBL] [Abstract][Full Text] [Related]  

  • 16. Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model.
    Qiu J; Peng Y; Gao P; Li C
    Materials (Basel); 2021 Apr; 14(9):. PubMed ID: 33946308
    [TBL] [Abstract][Full Text] [Related]  

  • 17. Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing.
    Zaimi NSM; Salleh MAAM; Sandu AV; Abdullah MMAB; Saud N; Rahim SZA; Vizureanu P; Said RM; Ramli MII
    Materials (Basel); 2021 Feb; 14(4):. PubMed ID: 33562200
    [TBL] [Abstract][Full Text] [Related]  

  • 18. Hybrid solder joints: the effect of nanosized ZrO
    Wodak I; Yakymovych A; Svec P; Orovcik L; Khatibi G
    Appl Nanosci; 2023; 13(11):7379-7385. PubMed ID: 38046828
    [TBL] [Abstract][Full Text] [Related]  

  • 19. Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO
    Mohamed Muzni NH; Mhd Noor EE; Abdullah MMAB
    Nanomaterials (Basel); 2023 Oct; 13(20):. PubMed ID: 37887960
    [TBL] [Abstract][Full Text] [Related]  

  • 20. Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate.
    Son J; Yu DY; Kim YC; Kim SI; Kim MS; Byun D; Bang J
    Materials (Basel); 2021 May; 14(9):. PubMed ID: 34063188
    [TBL] [Abstract][Full Text] [Related]  

    [Next]    [New Search]
    of 10.