These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

238 related articles for article (PubMed ID: 30901825)

  • 1. Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn⁻Ag⁻Cu Solder on a Cu Substrate.
    Kang MS; Kim DS; Shin YE
    Materials (Basel); 2019 Mar; 12(6):. PubMed ID: 30901825
    [TBL] [Abstract][Full Text] [Related]  

  • 2. Effect of Graphene Nanosheet Addition on the Wettability and Mechanical Properties of Sn-20Bi-xGNS/Cu Solder Joints.
    Yang W; Yang Z; Fu Y; Yu A; Feng J; Zhan Y
    Materials (Basel); 2020 Sep; 13(18):. PubMed ID: 32911653
    [TBL] [Abstract][Full Text] [Related]  

  • 3. Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene.
    Ko YH; Lee JD; Yoon T; Lee CW; Kim TS
    ACS Appl Mater Interfaces; 2016 Mar; 8(8):5679-86. PubMed ID: 26856638
    [TBL] [Abstract][Full Text] [Related]  

  • 4. Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging.
    Zhao D; Zhang K; Ma N; Li S; Yin C; Huo F
    Materials (Basel); 2020 Feb; 13(4):. PubMed ID: 32059528
    [TBL] [Abstract][Full Text] [Related]  

  • 5. Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing.
    Zaimi NSM; Salleh MAAM; Sandu AV; Abdullah MMAB; Saud N; Rahim SZA; Vizureanu P; Said RM; Ramli MII
    Materials (Basel); 2021 Feb; 14(4):. PubMed ID: 33562200
    [TBL] [Abstract][Full Text] [Related]  

  • 6. Mechanical Property of SAC305 Ball-Grid Array and Epoxy Sn-58Bi Solder Joints with 85 °C/85% Relative Humidity Environmental Conditions.
    Kim KY; Myung WR; Jeong H; Sung YG; Jung SB
    J Nanosci Nanotechnol; 2018 Sep; 18(9):6162-6166. PubMed ID: 29677761
    [TBL] [Abstract][Full Text] [Related]  

  • 7. Influence of Isothermal Aging on Microstructure and Shear Property of Novel Epoxy Composite SAC305 Solder Joints.
    Zhang P; Xue S; Liu L; Wang J; Tatsumi H; Nishikawa H
    Polymers (Basel); 2023 Oct; 15(20):. PubMed ID: 37896411
    [TBL] [Abstract][Full Text] [Related]  

  • 8. Effect of Mo Nanoparticles on the Growth Behavior of the Intermetallic Compounds Layer in Sn3.0Ag0.5Cu/Cu Solder Joints.
    Yang L; Quan S; Liu C; Xiong H
    J Nanosci Nanotechnol; 2020 Apr; 20(4):2573-2577. PubMed ID: 31492278
    [TBL] [Abstract][Full Text] [Related]  

  • 9. Effect of Epoxy on Mechanical Property of SAC305 Solder Joint with Various Surface Finishes Under 3-Point Bend Test.
    Jeong H; Myung WR; Sung YG; Kim KY; Jung SB
    J Nanosci Nanotechnol; 2018 Sep; 18(9):6316-6320. PubMed ID: 29677789
    [TBL] [Abstract][Full Text] [Related]  

  • 10. Microstructure and Shear Behaviour of Sn-3.0Ag-0.5Cu Composite Solder Pastes Enhanced by Epoxy Resin.
    Zhang P; Xue S; Liu L; Wu J; Luo Q; Wang J
    Polymers (Basel); 2022 Dec; 14(23):. PubMed ID: 36501697
    [TBL] [Abstract][Full Text] [Related]  

  • 11. Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu.
    Li YJ; Yen YW; Chen CM
    Materials (Basel); 2024 May; 17(9):. PubMed ID: 38730955
    [TBL] [Abstract][Full Text] [Related]  

  • 12. Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing.
    Ramli MII; Salleh MAAM; Sandu AV; Amli SFM; Said RM; Saud N; Abdullah MMAB; Vizureanu P; Rylski A; Chaiprapa J; Nabialek M
    Materials (Basel); 2021 Sep; 14(18):. PubMed ID: 34576358
    [TBL] [Abstract][Full Text] [Related]  

  • 13. Effects of Cu Opening Size on the Mechanical Properties of Epoxy-Contained Sn-58Bi Solder Joints.
    Min KD; Myung WR; Kim KY; Sung YG; Jung SB
    J Nanosci Nanotechnol; 2019 Oct; 19(10):6437-6443. PubMed ID: 31026974
    [TBL] [Abstract][Full Text] [Related]  

  • 14. Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition.
    Wang Q; Chen H; Wang F
    Materials (Basel); 2019 Dec; 12(24):. PubMed ID: 31861193
    [TBL] [Abstract][Full Text] [Related]  

  • 15. Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review.
    Ramli MII; Salleh MAAM; Abdullah MMAB; Zaimi NSM; Sandu AV; Vizureanu P; Rylski A; Amli SFM
    Materials (Basel); 2022 Feb; 15(4):. PubMed ID: 35207990
    [TBL] [Abstract][Full Text] [Related]  

  • 16. The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints.
    Kang MS; Kim DS; Shin YE
    Materials (Basel); 2019 Mar; 12(6):. PubMed ID: 30909434
    [TBL] [Abstract][Full Text] [Related]  

  • 17. Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints.
    Zhang C; Zhang K; Gao Y; Wang Y
    Materials (Basel); 2023 Mar; 16(7):. PubMed ID: 37048920
    [TBL] [Abstract][Full Text] [Related]  

  • 18. Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn-Ag-Cu/Cu solder joint during different thermal conditions.
    Ting Tan A; Wen Tan A; Yusof F
    Sci Technol Adv Mater; 2015 Jun; 16(3):033505. PubMed ID: 27877786
    [TBL] [Abstract][Full Text] [Related]  

  • 19. Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow.
    Zaimi NSM; Salleh MAAM; Abdullah MMA; Nadzri NIM; Sandu AV; Vizureanu P; Ramli MII; Nogita K; Yasuda H; Sandu IG
    Materials (Basel); 2022 Apr; 15(8):. PubMed ID: 35454450
    [TBL] [Abstract][Full Text] [Related]  

  • 20. Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging.
    Li Y; Long W; Hu X; Fu Y
    Materials (Basel); 2018 Jan; 11(1):. PubMed ID: 29316625
    [TBL] [Abstract][Full Text] [Related]  

    [Next]    [New Search]
    of 12.