These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

135 related articles for article (PubMed ID: 31536881)

  • 1. Grain refinement caused by intensified cavitation within narrow channel and its improvement to ultrasonically soldered Al joint property.
    Li Z; Xu Z; Zhao D; Liu X; Yan J
    Ultrason Sonochem; 2020 Jan; 60():104786. PubMed ID: 31536881
    [TBL] [Abstract][Full Text] [Related]  

  • 2. Microstructure evolution and grain refinement of ultrasonic-assisted soldering joint by using Ni foam reinforced Sn composite solder.
    He H; Song L; Gao H; Xiao Y; Cao Y
    Ultrason Sonochem; 2023 Jan; 92():106244. PubMed ID: 36508893
    [TBL] [Abstract][Full Text] [Related]  

  • 3. Microstructural evolution of SiC joints soldered using Zn-Al filler metals with the assistance of ultrasound.
    Wu B; Leng X; Xiu Z; Yan J
    Ultrason Sonochem; 2018 Jun; 44():280-287. PubMed ID: 29680613
    [TBL] [Abstract][Full Text] [Related]  

  • 4. Cavitation at filler metal/substrate interface during ultrasonic-assisted soldering. Part II: Cavitation erosion effect.
    Li Z; Xu Z; Ma L; Wang S; Liu X; Yan J
    Ultrason Sonochem; 2019 Jan; 50():278-288. PubMed ID: 30274890
    [TBL] [Abstract][Full Text] [Related]  

  • 5. Control Al/Mg intermetallic compound formation during ultrasonic-assisted soldering Mg to Al.
    Xu Z; Li Z; Li J; Ma Z; Yan J
    Ultrason Sonochem; 2018 Sep; 46():79-88. PubMed ID: 29739515
    [TBL] [Abstract][Full Text] [Related]  

  • 6. Ultrasonic soldering of Cu alloy using Ni-foam/Sn composite interlayer.
    Xiao Y; Wang Q; Wang L; Zeng X; Li M; Wang Z; Zhang X; Zhu X
    Ultrason Sonochem; 2018 Jul; 45():223-230. PubMed ID: 29705316
    [TBL] [Abstract][Full Text] [Related]  

  • 7. Ultrasonic semi-solid soldering 6061 aluminum alloys joint with Sn-9Zn solder reinforced with nano/nano+micron Al
    Min D
    Ultrason Sonochem; 2019 Apr; 52():150-156. PubMed ID: 30477792
    [TBL] [Abstract][Full Text] [Related]  

  • 8. Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging.
    Li Y; Long W; Hu X; Fu Y
    Materials (Basel); 2018 Jan; 11(1):. PubMed ID: 29316625
    [TBL] [Abstract][Full Text] [Related]  

  • 9. Ultrasonic-assisted soldering of fine-grained 7034 aluminum alloy using Sn-Zn solders below 300°C.
    Guo W; Luan T; He J; Yan J
    Ultrason Sonochem; 2018 Jan; 40(Pt A):815-821. PubMed ID: 28946490
    [TBL] [Abstract][Full Text] [Related]  

  • 10. Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted reflow soldering.
    Tan AT; Tan AW; Yusof F
    Ultrason Sonochem; 2017 Jan; 34():616-625. PubMed ID: 27773288
    [TBL] [Abstract][Full Text] [Related]  

  • 11. The role of ultrasonic cavitation in refining the microstructure of aluminum based nanocomposites during the solidification process.
    Xuan Y; Nastac L
    Ultrasonics; 2018 Feb; 83():94-102. PubMed ID: 28693864
    [TBL] [Abstract][Full Text] [Related]  

  • 12. Influence of ultrasonic melt treatment on the formation of primary intermetallics and related grain refinement in aluminum alloys.
    Zhang L; Eskin DG; Katgerman L
    J Mater Sci; 2011; 46(15):5252-5259. PubMed ID: 36039104
    [TBL] [Abstract][Full Text] [Related]  

  • 13. An overview and critical assessment of the mechanisms of microstructural refinement during ultrasonic solidification of metals.
    Balasubramani N; Venezuela J; Yang N; Wang G; StJohn D; Dargusch M
    Ultrason Sonochem; 2022 Sep; 89():106151. PubMed ID: 36067645
    [TBL] [Abstract][Full Text] [Related]  

  • 14. Ultrasonic semi-solid coating soldering 6061 aluminum alloys with Sn-Pb-Zn alloys.
    Yu XY; Xing WQ; Ding M
    Ultrason Sonochem; 2016 Jul; 31():216-21. PubMed ID: 26964943
    [TBL] [Abstract][Full Text] [Related]  

  • 15. Ultrasonic-accelerated metallurgical reaction of Sn/Ni composite solder: Principle, kinetics, microstructure, and joint properties.
    Zhang W; Cao Y; Huang J; Zhao W; Liu X; Li M; Ji H
    Ultrason Sonochem; 2020 Sep; 66():105090. PubMed ID: 32247233
    [TBL] [Abstract][Full Text] [Related]  

  • 16. The Influence of Inter-Cooling and Electromagnetic Stirring above Liquidus on the Formation of Primary Al₃Zr and Grain Refinement in an Al-0.2%Zr Alloy.
    Guan T; Zhang Z; Bai Y; He M; Zheng H; Zhao H; Li X; Wang P
    Materials (Basel); 2018 Dec; 12(1):. PubMed ID: 30577628
    [TBL] [Abstract][Full Text] [Related]  

  • 17. The cavitation erosion of ultrasonic sonotrode during large-scale metallic casting: Experiment and simulation.
    Tian Y; Liu Z; Li X; Zhang L; Li R; Jiang R; Dong F
    Ultrason Sonochem; 2018 May; 43():29-37. PubMed ID: 29555286
    [TBL] [Abstract][Full Text] [Related]  

  • 18. Ultrasound cavitation induced nucleation in metal solidification: An analytical model and validation by real-time experiments.
    Huang H; Qin L; Tang H; Shu D; Yan W; Sun B; Mi J
    Ultrason Sonochem; 2021 Dec; 80():105832. PubMed ID: 34826724
    [TBL] [Abstract][Full Text] [Related]  

  • 19. Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered with Bi-Ag-Mg-Type Solder.
    Kolenak R; Melus T; Drapala J; Gogola P; Pasak M
    Materials (Basel); 2023 Apr; 16(8):. PubMed ID: 37109827
    [TBL] [Abstract][Full Text] [Related]  

  • 20. Evolution behavior of cavitation bubble in pure Sn liquid medium with narrow gap under low-amplitude ultrasound.
    Li G; Zhao Y; Li J; Xiao Y
    Ultrason Sonochem; 2023 Oct; 99():106567. PubMed ID: 37647743
    [TBL] [Abstract][Full Text] [Related]  

    [Next]    [New Search]
    of 7.