These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.
332 related articles for article (PubMed ID: 31550883)
21. A self-reducible and alcohol-soluble copper-based metal-organic decomposition ink for printed electronics. Shin DH; Woo S; Yem H; Cha M; Cho S; Kang M; Jeong S; Kim Y; Kang K; Piao Y ACS Appl Mater Interfaces; 2014 Mar; 6(5):3312-9. PubMed ID: 24512011 [TBL] [Abstract][Full Text] [Related]
22. Highly conductive copper nano/microparticles ink via flash light sintering for printed electronics. Joo SJ; Hwang HJ; Kim HS Nanotechnology; 2014 Jul; 25(26):265601. PubMed ID: 24916116 [TBL] [Abstract][Full Text] [Related]
24. Facile Preparation of Monodisperse Cu@Ag Core-Shell Nanoparticles for Conductive Ink in Printing Electronics. Li G; Yu X; Zhang R; Ouyang Q; Sun R; Cao L; Zhu P Micromachines (Basel); 2023 Jun; 14(7):. PubMed ID: 37512629 [TBL] [Abstract][Full Text] [Related]
25. Large-Area Flexible Printed Thin-Film Transistors with Semiconducting Single-Walled Carbon Nanotubes for NO Wang X; Wei M; Li X; Shao S; Ren Y; Xu W; Li M; Liu W; Liu X; Zhao J ACS Appl Mater Interfaces; 2020 Nov; 12(46):51797-51807. PubMed ID: 33141551 [TBL] [Abstract][Full Text] [Related]
26. Screen printing as a scalable and low-cost approach for rigid and flexible thin-film transistors using separated carbon nanotubes. Cao X; Chen H; Gu X; Liu B; Wang W; Cao Y; Wu F; Zhou C ACS Nano; 2014 Dec; 8(12):12769-76. PubMed ID: 25497107 [TBL] [Abstract][Full Text] [Related]
27. Ultrahigh Conductivity and Superior Interfacial Adhesion of a Nanostructured, Photonic-Sintered Copper Membrane for Printed Flexible Hybrid Electronics. Kwon YT; Kim YS; Lee Y; Kwon S; Lim M; Song Y; Choa YH; Yeo WH ACS Appl Mater Interfaces; 2018 Dec; 10(50):44071-44079. PubMed ID: 30452228 [TBL] [Abstract][Full Text] [Related]
28. Photonic Curing of Low-Cost Aqueous Silver Flake Inks for Printed Conductors with Increased Yield. Cronin HM; Stoeva Z; Brown M; Shkunov M; Silva SRP ACS Appl Mater Interfaces; 2018 Jun; 10(25):21398-21410. PubMed ID: 29863321 [TBL] [Abstract][Full Text] [Related]
29. Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics. Tomotoshi D; Kawasaki H Nanomaterials (Basel); 2020 Aug; 10(9):. PubMed ID: 32867267 [TBL] [Abstract][Full Text] [Related]
30. Fully Printed and Encapsulated SWCNT-Based Thin Film Transistors via a Combination of R2R Gravure and Inkjet Printing. Homenick CM; James R; Lopinski GP; Dunford J; Sun J; Park H; Jung Y; Cho G; Malenfant PRL ACS Appl Mater Interfaces; 2016 Oct; 8(41):27900-27910. PubMed ID: 27662405 [TBL] [Abstract][Full Text] [Related]
31. Amphiphilic Silver Nanoparticles for Inkjet-Printable Conductive Inks. Ivanišević I; Kovačić M; Zubak M; Ressler A; Krivačić S; Katančić Z; Gudan Pavlović I; Kassal P Nanomaterials (Basel); 2022 Nov; 12(23):. PubMed ID: 36500875 [TBL] [Abstract][Full Text] [Related]
32. Large-Area Inkjet-Printed Flexible Hybrid Electrodes with Photonic Sintered Silver Grids/High Conductive Polymer. Kant C; Mahmood S; Seetharaman M; Katiyar M Small Methods; 2024 Jan; 8(1):e2300638. PubMed ID: 37727075 [TBL] [Abstract][Full Text] [Related]
33. One-step photonic curing of screen-printed conductive Ni flake electrodes for use in flexible electronics. Altay BN; Turkani VS; Pekarovicova A; Fleming PD; Atashbar MZ; Bolduc M; Cloutier SG Sci Rep; 2021 Feb; 11(1):3393. PubMed ID: 33564062 [TBL] [Abstract][Full Text] [Related]
34. Ambient atmosphere-processable, printable Cu electrodes for flexible device applications: structural welding on a millisecond timescale of surface oxide-free Cu nanoparticles. Oh SJ; Jo Y; Lee EJ; Lee SS; Kang YH; Jeon HJ; Cho SY; Park JS; Seo YH; Ryu BH; Choi Y; Jeong S Nanoscale; 2015 Mar; 7(9):3997-4004. PubMed ID: 25626472 [TBL] [Abstract][Full Text] [Related]
35. In situ monitoring of a flash light sintering process using silver nano-ink for producing flexible electronics. Chung WH; Hwang HJ; Lee SH; Kim HS Nanotechnology; 2013 Jan; 24(3):035202. PubMed ID: 23263030 [TBL] [Abstract][Full Text] [Related]
36. Plasma-Induced Decomposition of Copper Complex Ink for the Formation of Highly Conductive Copper Tracks on Heat-Sensitive Substrates. Farraj Y; Smooha A; Kamyshny A; Magdassi S ACS Appl Mater Interfaces; 2017 Mar; 9(10):8766-8773. PubMed ID: 28229585 [TBL] [Abstract][Full Text] [Related]
37. Nanoalloy Printed and Pulse-Laser Sintered Flexible Sensor Devices with Enhanced Stability and Materials Compatibility. Zhao W; Rovere T; Weerawarne D; Osterhoudt G; Kang N; Joseph P; Luo J; Shim B; Poliks M; Zhong CJ ACS Nano; 2015 Jun; 9(6):6168-77. PubMed ID: 26034999 [TBL] [Abstract][Full Text] [Related]