These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

189 related articles for article (PubMed ID: 31619710)

  • 21. Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing.
    Ramli MII; Salleh MAAM; Sandu AV; Amli SFM; Said RM; Saud N; Abdullah MMAB; Vizureanu P; Rylski A; Chaiprapa J; Nabialek M
    Materials (Basel); 2021 Sep; 14(18):. PubMed ID: 34576358
    [TBL] [Abstract][Full Text] [Related]  

  • 22. Effect of Graphene Nanosheet Addition on the Wettability and Mechanical Properties of Sn-20Bi-xGNS/Cu Solder Joints.
    Yang W; Yang Z; Fu Y; Yu A; Feng J; Zhan Y
    Materials (Basel); 2020 Sep; 13(18):. PubMed ID: 32911653
    [TBL] [Abstract][Full Text] [Related]  

  • 23. Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu.
    Li YJ; Yen YW; Chen CM
    Materials (Basel); 2024 May; 17(9):. PubMed ID: 38730955
    [TBL] [Abstract][Full Text] [Related]  

  • 24. Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient.
    Zhao N; Zhong Y; Huang ML; Ma HT; Dong W
    Sci Rep; 2015 Aug; 5():13491. PubMed ID: 26311323
    [TBL] [Abstract][Full Text] [Related]  

  • 25. Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate.
    Huang ML; Yang F
    Sci Rep; 2014 Nov; 4():7117. PubMed ID: 25408359
    [TBL] [Abstract][Full Text] [Related]  

  • 26. Microstructure evolution and grain refinement of ultrasonic-assisted soldering joint by using Ni foam reinforced Sn composite solder.
    He H; Song L; Gao H; Xiao Y; Cao Y
    Ultrason Sonochem; 2023 Jan; 92():106244. PubMed ID: 36508893
    [TBL] [Abstract][Full Text] [Related]  

  • 27. Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing.
    Zaimi NSM; Salleh MAAM; Sandu AV; Abdullah MMAB; Saud N; Rahim SZA; Vizureanu P; Said RM; Ramli MII
    Materials (Basel); 2021 Feb; 14(4):. PubMed ID: 33562200
    [TBL] [Abstract][Full Text] [Related]  

  • 28. Cu
    Wang J; Wang J; Duan F; Chen H
    Sci Rep; 2023 Jan; 13(1):668. PubMed ID: 36635376
    [TBL] [Abstract][Full Text] [Related]  

  • 29. Microstructure Influence of SACX0307-TiO
    Skwarek A; Ptak P; Górecki K; Hurtony T; Illés B
    Materials (Basel); 2020 Mar; 13(7):. PubMed ID: 32231058
    [TBL] [Abstract][Full Text] [Related]  

  • 30. Mechanical Property of SAC305 Ball-Grid Array and Epoxy Sn-58Bi Solder Joints with 85 °C/85% Relative Humidity Environmental Conditions.
    Kim KY; Myung WR; Jeong H; Sung YG; Jung SB
    J Nanosci Nanotechnol; 2018 Sep; 18(9):6162-6166. PubMed ID: 29677761
    [TBL] [Abstract][Full Text] [Related]  

  • 31. Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints.
    Shen YA; Wu JA
    Materials (Basel); 2022 Jul; 15(14):. PubMed ID: 35888552
    [TBL] [Abstract][Full Text] [Related]  

  • 32. Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling.
    Cui J; Zhang K; Zhao D; Pan Y
    Sci Rep; 2021 Mar; 11(1):6297. PubMed ID: 33737642
    [TBL] [Abstract][Full Text] [Related]  

  • 33. Interfacial Reactions and Mechanical Properties of Sn-58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding.
    Jeong G; Yu DY; Baek S; Bang J; Lee TI; Jung SB; Kim J; Ko YH
    Materials (Basel); 2021 Jan; 14(2):. PubMed ID: 33440741
    [TBL] [Abstract][Full Text] [Related]  

  • 34. Microstructure Evolution and Shear Strength of the Cu/Au80Sn20/Cu Solder Joints with Multiple Reflow Temperatures.
    Chen C; Sun M; Cheng Z; Liang Y
    Materials (Basel); 2022 Jan; 15(3):. PubMed ID: 35160725
    [TBL] [Abstract][Full Text] [Related]  

  • 35. Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn-Cu solder alloy.
    Satyanarayan ; Prabhu KN
    Adv Colloid Interface Sci; 2011 Aug; 166(1-2):87-118. PubMed ID: 21676366
    [TBL] [Abstract][Full Text] [Related]  

  • 36. Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention.
    Li MY; Yang HF; Zhang ZH; Gu JH; Yang SH
    Sci Rep; 2016 Jun; 6():27522. PubMed ID: 27273421
    [TBL] [Abstract][Full Text] [Related]  

  • 37. The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-
    Li C; Yan Y; Gao T; Xu G
    Materials (Basel); 2020 Oct; 13(19):. PubMed ID: 33036405
    [TBL] [Abstract][Full Text] [Related]  

  • 38. Fine Microstructured In-Sn-Bi Solder for Adhesion on a Flexible PET Substrate: Its Effect on Superplasticity and Toughness.
    Kim SH; Yeon SM; Kim JH; Park SJ; Lee JE; Park SH; Choi JP; Aranas C; Son Y
    ACS Appl Mater Interfaces; 2019 May; 11(18):17090-17099. PubMed ID: 31021602
    [TBL] [Abstract][Full Text] [Related]  

  • 39. Effect of Graphene Nanosheets on the Microstructure and Mechanical Properties of Sn-20Bi Solder.
    Yang W; Qin W; Wu J; Feng J; Zhan Y
    Materials (Basel); 2023 Feb; 16(4):. PubMed ID: 36837178
    [TBL] [Abstract][Full Text] [Related]  

  • 40. Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints.
    Chen D; Qin J; Zhang X; Liang D; Bai H; Yi J; Yan J
    Materials (Basel); 2022 Dec; 15(24):. PubMed ID: 36556810
    [TBL] [Abstract][Full Text] [Related]  

    [Previous]   [Next]    [New Search]
    of 10.