These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.
43. Fabrication and Characterization of Sn-Based Babbitt Alloy Nanocomposite Reinforced with Al Ramadan M; Alghamdi AS; Subhani T; Halim KSA Materials (Basel); 2020 Jun; 13(12):. PubMed ID: 32570734 [TBL] [Abstract][Full Text] [Related]
44. A Review of Cu-Ni-Sn Alloys: Processing, Microstructure, Properties, and Developing Trends. Guo L; Zuo P; Zhang Z; Zhang Q; Zhao M; Hou X; Wu J; Zhang B Materials (Basel); 2023 Jan; 16(1):. PubMed ID: 36614783 [TBL] [Abstract][Full Text] [Related]
45. Microstructures and Properties of Sn2.5Ag0.7Cu0.1RE Composite Solders Reinforced with Cu-Coated Graphene Nanosheets Synthesized by Pyrolysis. Zhang M; Zhang KK; Huo FP; Wang HG; Wang Y Materials (Basel); 2019 Jan; 12(2):. PubMed ID: 30658465 [TBL] [Abstract][Full Text] [Related]
46. Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing. Ramli MII; Salleh MAAM; Sandu AV; Amli SFM; Said RM; Saud N; Abdullah MMAB; Vizureanu P; Rylski A; Chaiprapa J; Nabialek M Materials (Basel); 2021 Sep; 14(18):. PubMed ID: 34576358 [TBL] [Abstract][Full Text] [Related]
52. Interfacial Reactions and Mechanical Properties of Sn-58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding. Jeong G; Yu DY; Baek S; Bang J; Lee TI; Jung SB; Kim J; Ko YH Materials (Basel); 2021 Jan; 14(2):. PubMed ID: 33440741 [TBL] [Abstract][Full Text] [Related]
53. Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder. Yang F; Zhang L; Liu ZQ; Zhong SJ; Ma J; Bao L Materials (Basel); 2017 May; 10(5):. PubMed ID: 28772917 [TBL] [Abstract][Full Text] [Related]
54. Microstructure Characterization and Interfacial Reactions between Au-Sn Solder and Different Back Metallization Systems of GaAs MMICs. Wu N; Hu Y; Sun S Materials (Basel); 2020 Mar; 13(6):. PubMed ID: 32168807 [TBL] [Abstract][Full Text] [Related]
55. Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder. Yamamoto M; Shohji I; Kobayashi T; Mitsui K; Watanabe H Materials (Basel); 2021 Jul; 14(14):. PubMed ID: 34300718 [TBL] [Abstract][Full Text] [Related]
56. Thermal cycling life prediction of Sn-3.0Ag-0.5Cu solder joint using type-I censored data. Mi J; Li YF; Yang YJ; Peng W; Huang HZ ScientificWorldJournal; 2014; 2014():807693. PubMed ID: 25121138 [TBL] [Abstract][Full Text] [Related]
57. In Situ and Ex Situ Characterization of the Microstructure Formation in Ni-Cr-Si Alloys during Rapid Solidification-Toward Alloy Design for Laser Additive Manufacturing. Li X; Zweiacker K; Grolimund D; Ferreira Sanchez D; Spierings AB; Leinenbach C; Wegener K Materials (Basel); 2020 May; 13(9):. PubMed ID: 32397639 [TBL] [Abstract][Full Text] [Related]
58. Fine Microstructured In-Sn-Bi Solder for Adhesion on a Flexible PET Substrate: Its Effect on Superplasticity and Toughness. Kim SH; Yeon SM; Kim JH; Park SJ; Lee JE; Park SH; Choi JP; Aranas C; Son Y ACS Appl Mater Interfaces; 2019 May; 11(18):17090-17099. PubMed ID: 31021602 [TBL] [Abstract][Full Text] [Related]
59. Design and Development of Ti-Ni, Ni-Mn-Ga and Cu-Al-Ni-based Alloys with High and Low Temperature Shape Memory Effects. Pushin V; Kuranova N; Marchenkova E; Pushin A Materials (Basel); 2019 Aug; 12(16):. PubMed ID: 31426375 [TBL] [Abstract][Full Text] [Related]
60. Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling. Shen C; Hai Z; Zhao C; Zhang J; Evans JL; Bozack MJ; Suhling JC Materials (Basel); 2017 Apr; 10(5):. PubMed ID: 28772811 [TBL] [Abstract][Full Text] [Related] [Previous] [Next] [New Search]