These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.
126 related articles for article (PubMed ID: 32183097)
1. Laser-based Thickness Control in a Double-Side Polishing System for Silicon Wafers. Zhu L; Mei B; Zhu W; Li W Sensors (Basel); 2020 Mar; 20(6):. PubMed ID: 32183097 [TBL] [Abstract][Full Text] [Related]
2. Numerical Analysis in Double-Sided Polishing: Mechanism Exploration of Edge Roll-Off. Chen J; Liu Y; Wang D; Yu W; Zhu L Materials (Basel); 2024 Sep; 17(19):. PubMed ID: 39410332 [TBL] [Abstract][Full Text] [Related]
3. Orthogonal Experimental Research on Dielectrophoresis Polishing (DEPP) of Silicon Wafer. Zhao T; Deng Q; Zhang C; Feng K; Zhou Z; Yuan J Micromachines (Basel); 2020 May; 11(6):. PubMed ID: 32471163 [TBL] [Abstract][Full Text] [Related]
4. Improved geometry of double-sided polished parallel wafers prepared for direct wafer bonding. Haisma J; van der Kruis FJ; Spierings BA; Baalbergen JJ; Bijsterveld BH; Brehm R; Faasen JH; Groenen JJ; de Haas PW; Haddeman TB; Michielsen TM; Vijfvinkel J Appl Opt; 1994 Dec; 33(34):7945-54. PubMed ID: 20963009 [TBL] [Abstract][Full Text] [Related]
5. Contribution of ultrasonic traveling wave to chemical-mechanical polishing. Li L; He Q; Zheng M; Liu Z Ultrasonics; 2015 Feb; 56():530-8. PubMed ID: 25455193 [TBL] [Abstract][Full Text] [Related]
6. Study on chemical mechanical polishing of silicon wafer with megasonic vibration assisted. Zhai K; He Q; Li L; Ren Y Ultrasonics; 2017 Sep; 80():9-14. PubMed ID: 28494230 [TBL] [Abstract][Full Text] [Related]
7. Kerf-Less Exfoliated Thin Silicon Wafer Prepared by Nickel Electrodeposition for Solar Cells. Yang HS; Kim J; Kim S; Eom NSA; Kang S; Han CS; Kim SH; Lim D; Lee JH; Park SH; Choi JW; Lee CL; Yoo B; Lim JH Front Chem; 2018; 6():600. PubMed ID: 30693277 [TBL] [Abstract][Full Text] [Related]
8. Enhancing Slurry Stability and Surface Flatness of Silicon Wafers through Organic Amine-Catalyzed Synthesis Silica Sol. Xing Y; Wang W; Liu W; Song Z Nanomaterials (Basel); 2024 Aug; 14(16):. PubMed ID: 39195409 [TBL] [Abstract][Full Text] [Related]
9. The Mechanism of Layer Stacked Clamping (LSC) for Polishing Ultra-Thin Sapphire Wafer. Chen Z; Cao L; Yuan J; Lyu B; Hang W; Wang J Micromachines (Basel); 2020 Aug; 11(8):. PubMed ID: 32781686 [TBL] [Abstract][Full Text] [Related]
10. Silicon Wafer CMP Slurry Using a Hydrolysis Reaction Accelerator with an Amine Functional Group Remarkably Enhances Polishing Rate. Bae JY; Han MH; Lee SJ; Kim ES; Lee K; Lee GS; Park JH; Park JG Nanomaterials (Basel); 2022 Nov; 12(21):. PubMed ID: 36364668 [TBL] [Abstract][Full Text] [Related]
11. Improvement in thickness uniformity of thick SOI by numerically controlled local wet etching. Yamamura K; Ueda K; Hosoda M; Zettsu N J Nanosci Nanotechnol; 2011 Apr; 11(4):2910-5. PubMed ID: 21776652 [TBL] [Abstract][Full Text] [Related]
12. Dual Laser Beam Asynchronous Dicing of 4H-SiC Wafer. Zhang Z; Wen Z; Shi H; Song Q; Xu Z; Li M; Hou Y; Zhang Z Micromachines (Basel); 2021 Oct; 12(11):. PubMed ID: 34832743 [TBL] [Abstract][Full Text] [Related]
13. Numerical-experimental study on the polishing of silicon wafers using coupled finite element-smoothed particle hydrodynamics. Mosavat M; Rahimi A Appl Opt; 2019 Feb; 58(6):1569-1576. PubMed ID: 30874009 [TBL] [Abstract][Full Text] [Related]
14. Nano-finishing of the monocrystalline silicon wafer using magnetic abrasive finishing process. Mosavat M; Rahimi A; Eshraghi MJ; Karami S Appl Opt; 2019 May; 58(13):3447-3453. PubMed ID: 31044841 [TBL] [Abstract][Full Text] [Related]
15. Breakage Ratio of Silicon Wafer during Fixed Diamond Wire Sawing. Liu T; Su Y; Ge P Micromachines (Basel); 2022 Nov; 13(11):. PubMed ID: 36363919 [TBL] [Abstract][Full Text] [Related]
16. The Effect of Microstructure, Thickness Variation, and Crack on the Natural Frequency of Solar Silicon Wafers. Saffar S; Gouttebroze S; Zhang ZL J Sol Energy Eng; 2014 Feb; 136(1):0110011-110018. PubMed ID: 24891752 [TBL] [Abstract][Full Text] [Related]
17. Mechanism Exploration of the Effect of Polyamines on the Polishing Rate of Silicon Chemical Mechanical Polishing: A Study Combining Simulations and Experiments. Lin Z; Zhu J; Huang Q; Zhu L; Li W; Yu W Nanomaterials (Basel); 2024 Jan; 14(1):. PubMed ID: 38202582 [TBL] [Abstract][Full Text] [Related]
18. Endpoint Detection Based on Optical Method in Chemical Mechanical Polishing. Tian F; Wang T; Lu X Micromachines (Basel); 2023 Nov; 14(11):. PubMed ID: 38004910 [TBL] [Abstract][Full Text] [Related]
19. Integration Technology for Wafer-Level LiNbO Geng W; Yang X; Xue G; Xu W; Bi K; Mei L; Zhang L; Hou X; Chou X Nanomaterials (Basel); 2021 Sep; 11(10):. PubMed ID: 34685009 [TBL] [Abstract][Full Text] [Related]
20. A Novel Fabrication Method for a Capacitive MEMS Accelerometer Based on Glass-Silicon Composite Wafers. He Y; Si C; Han G; Zhao Y; Ning J; Yang F Micromachines (Basel); 2021 Jan; 12(2):. PubMed ID: 33494437 [TBL] [Abstract][Full Text] [Related] [Next] [New Search]