These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

67 related articles for article (PubMed ID: 32247233)

  • 1. Ultrasonic-accelerated metallurgical reaction of Sn/Ni composite solder: Principle, kinetics, microstructure, and joint properties.
    Zhang W; Cao Y; Huang J; Zhao W; Liu X; Li M; Ji H
    Ultrason Sonochem; 2020 Sep; 66():105090. PubMed ID: 32247233
    [TBL] [Abstract][Full Text] [Related]  

  • 2. Solid-phase transient soldering method based on Au/Ni-W multilayer thin-film-modified copper-based structures.
    Xiao J; Zhai Q; Luo J
    Heliyon; 2024 Jun; 10(12):e33071. PubMed ID: 38988553
    [TBL] [Abstract][Full Text] [Related]  

  • 3. Microstructure and Properties of Magnesium Alloy Joints Bonded by Using Gallium with the Assistance of Ultrasound at Room Temperature.
    Fang Q; Guo Z; Zhao L; Liu Y
    Materials (Basel); 2023 Oct; 16(21):. PubMed ID: 37959591
    [TBL] [Abstract][Full Text] [Related]  

  • 4. Effect of Thermal Aging on the Interfacial Reaction Behavior and Failure Mechanism of Ni-xCu/Sn Soldering Joints under Shear Loading.
    Li Z; Cheng K; Liu J; He Y; Xiao Y
    Materials (Basel); 2023 Jul; 16(15):. PubMed ID: 37569956
    [TBL] [Abstract][Full Text] [Related]  

  • 5. Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding.
    Han S; Han SE; Lee TY; Han DG; Park YB; Yoo S
    Materials (Basel); 2024 Jul; 17(14):. PubMed ID: 39063910
    [TBL] [Abstract][Full Text] [Related]  

  • 6. Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn-5Sb/Cu solder joints under isothermal aging.
    Xin M; Wang X; Sun F
    J Mater Sci Mater Electron; 2022; 33(33):25025-25040. PubMed ID: 38625275
    [TBL] [Abstract][Full Text] [Related]  

  • 7. Hybrid solder joints: the effect of nanosized ZrO
    Wodak I; Yakymovych A; Svec P; Orovcik L; Khatibi G
    Appl Nanosci; 2023; 13(11):7379-7385. PubMed ID: 38046828
    [TBL] [Abstract][Full Text] [Related]  

  • 8. Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low Temperature.
    He S; Jiang J; Shen YA; Mo L; Bi Y; Wu J; Guo C
    Materials (Basel); 2024 Feb; 17(5):. PubMed ID: 38473526
    [TBL] [Abstract][Full Text] [Related]  

  • 9. Influence of Isothermal Aging on Microstructure and Shear Property of Novel Epoxy Composite SAC305 Solder Joints.
    Zhang P; Xue S; Liu L; Wang J; Tatsumi H; Nishikawa H
    Polymers (Basel); 2023 Oct; 15(20):. PubMed ID: 37896411
    [TBL] [Abstract][Full Text] [Related]  

  • 10. Preparation and performance of semiconductor device bonding joints based on Cu@Sn@Ag preform.
    Zhang H; Xu H; Wang T; Wang S
    RSC Adv; 2023 Nov; 13(50):35683-35688. PubMed ID: 38077966
    [TBL] [Abstract][Full Text] [Related]  

  • 11. Role of Zn in the Microstructure, Segregation, and Cytotoxicity of Sn-0.2 Ni Solders.
    Paixão JL; Batista de Sousa R; Dantas de Freitas PR; de Sousa RM; Duarte da Luz JR; Silva BL; Spinelli JE
    ACS Omega; 2024 Feb; 9(8):8829-8845. PubMed ID: 38434885
    [TBL] [Abstract][Full Text] [Related]  

  • 12. Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing.
    Zaimi NSM; Salleh MAAM; Sandu AV; Abdullah MMAB; Saud N; Rahim SZA; Vizureanu P; Said RM; Ramli MII
    Materials (Basel); 2021 Feb; 14(4):. PubMed ID: 33562200
    [TBL] [Abstract][Full Text] [Related]  

  • 13. Effect of electromigration on microstructure and properties of CeO
    Chen W; Zhang K; Fan Y; Zhang C; Wang N
    Sci Rep; 2024 Jul; 14(1):15693. PubMed ID: 38977834
    [TBL] [Abstract][Full Text] [Related]  

  • 14. Ceramic-to-metal bonding using rare-earth containing Sn-Bi solder.
    Feng T; Pati B; Chung KM; Pei Y; Chen R
    J Mater Sci Mater Electron; 2024; 35(6):369. PubMed ID: 38420148
    [TBL] [Abstract][Full Text] [Related]  

  • 15. Improvement of PbSn Solder Reliability with Ge Microalloying-Induced Optimization of Intermetallic Compounds Growth.
    Qu Z; Hao Y; Chen C; Wang Y; Xu S; Shi S; Lin P; Xie X
    Materials (Basel); 2024 Feb; 17(3):. PubMed ID: 38591612
    [TBL] [Abstract][Full Text] [Related]  

  • 16. Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper.
    Xiao J; Cheng W; Fu-Kang Q
    Heliyon; 2024 Mar; 10(5):e27010. PubMed ID: 38455589
    [TBL] [Abstract][Full Text] [Related]  

  • 17. Study on microstructure and mechanical properties of 3003 aluminum alloy joints brazed with Al-Si-Cu-Ni paste brazing materials.
    Gao Z; Jin X; Li S; Zhang Z; Niu J; Brnic J
    Sci Rep; 2024 May; 14(1):10648. PubMed ID: 38729954
    [TBL] [Abstract][Full Text] [Related]  

  • 18. Metal deposited nanoparticles as "bridge materials" for lead-free solder nanocomposites.
    Plevachuk Y; Švec P; Švec P; Orovcik L; Bajana O; Yakymovych A; Rud A
    Appl Nanosci; 2023; 13(12):7387-7397. PubMed ID: 38099240
    [TBL] [Abstract][Full Text] [Related]  

  • 19. Thermal Fatigue Failure of Micro-Solder Joints in Electronic Packaging Devices: A Review.
    Li L; Du X; Chen J; Wu Y
    Materials (Basel); 2024 May; 17(10):. PubMed ID: 38793430
    [TBL] [Abstract][Full Text] [Related]  

  • 20. A Study on the Interfacial Reactions between Gallium and Cu/Ni/Au(Pd) Multilayer Metallization.
    Kim B; Kim CL; Sohn Y
    Materials (Basel); 2023 Sep; 16(18):. PubMed ID: 37763462
    [TBL] [Abstract][Full Text] [Related]  

    [Next]    [New Search]
    of 4.