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5. Assessing microleakage at the junction between amalgam and composite resin: a new method in vitro. Hadavi F; Hey JH; Ambrose ER Oper Dent; 1991; 16(1):6-12. PubMed ID: 1784538 [TBL] [Abstract][Full Text] [Related]
6. [Technic for etched resin-bonded retainers]. Tovar Davila JA Rev Fed Odontol Colomb; 1984; 33(148):47-53. PubMed ID: 6399146 [No Abstract] [Full Text] [Related]
7. [An opaque resin-bonding system as the bonding method for composite acid-etched bridges. A new bonding technic between metals and composites]. Veen JH; Bronsdijk AE; Poel VD Quintessenz; 1984 Oct; 35(10):1943-6. PubMed ID: 6395162 [No Abstract] [Full Text] [Related]
8. Anterior etched cast resin-bonded retainers: an overview of design, fabrication, and clinical use. Wood M; Thompson VP Compend Contin Educ Dent (Lawrenceville); 1983; 4(3):247-56, 258. PubMed ID: 6360530 [No Abstract] [Full Text] [Related]
9. Microleakage of amalgam restorations using dentin bonding system primers. Berry FA; Parker SD; Rice D; Muñoz CA Am J Dent; 1996 Aug; 9(4):174-8. PubMed ID: 9002794 [TBL] [Abstract][Full Text] [Related]
10. Effect of different adhesive systems on microleakage at the amalgam/composite resin interface. Hadavi F; Hey JH; Ambrose ER; Elbadrawy HE Oper Dent; 1993; 18(1):2-7. PubMed ID: 8332537 [TBL] [Abstract][Full Text] [Related]
11. A combined use of an etched metal resin-bonded splint and direct bonding of composite resin. Katz M N Y State Dent J; 1983; 49(6):412-3. PubMed ID: 6350955 [No Abstract] [Full Text] [Related]
12. A chemical etching system for creating micromechanical retention in resin-bonded retainers. Livaditis GJ J Prosthet Dent; 1986 Aug; 56(2):181-8. PubMed ID: 3531467 [TBL] [Abstract][Full Text] [Related]
13. Composite binding of etched metal bridge. McLaughlin G; Foerth D Gen Dent; 1982; 30(2):132-4. PubMed ID: 6749594 [No Abstract] [Full Text] [Related]
14. Microleakage at the etched enamel-resin interface with bonded orthodontic brackets. Lee SM; Freer TJ; Basford KE Aust Orthod J; 1986 Mar; 9(3):270-5. PubMed ID: 3530232 [No Abstract] [Full Text] [Related]