These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.
13. Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon Vias. Kim SH; Lee HJ; Braun TM; Moffat TP; Josell D J Electrochem Soc; 2021; 168(11):. PubMed ID: 36936718 [TBL] [Abstract][Full Text] [Related]
14. Extreme Bottom-up Gold Filling of High Aspect Ratio Features. Josell D; Moffat TP Acc Chem Res; 2023 Mar; 56(6):677-688. PubMed ID: 36848589 [TBL] [Abstract][Full Text] [Related]
15. Investigations of the electrochemical performance and filling effects of additives on electroplating process of TSV. Wu H; Wang Y; Li Z; Zhu W Sci Rep; 2020 Jun; 10(1):9204. PubMed ID: 32514129 [TBL] [Abstract][Full Text] [Related]
17. Effect of Pulse Current and Pre-annealing on Thermal Extrusion of Cu in Through-Silicon via (TSV). Kim Y; Jin S; Park K; Lee J; Lim JH; Yoo B Front Chem; 2020; 8():771. PubMed ID: 33195017 [TBL] [Abstract][Full Text] [Related]
18. Experiment and simulation of single inhibitor SH110 for void-free TSV copper filling. Wang F; Le Y Sci Rep; 2021 Jun; 11(1):12108. PubMed ID: 34103562 [TBL] [Abstract][Full Text] [Related]
19. Exploring the Limits of Bottom-Up Gold Filling to Fabricate Diffraction Gratings. Josell D; Ambrozik S; Williams ME; Hollowell AE; Arrington C; Muramoto S; Moffat TP J Electrochem Soc; 2019; 166(16):. PubMed ID: 33041357 [TBL] [Abstract][Full Text] [Related]
20. Effect of the Nickel Source on the Structure, Performance, and Carbon Deposition of the Ni/Al Liu Y; He X; Mo W; Qin S; Guo J; Deng Y; Abudurehman B ACS Omega; 2021 Oct; 6(42):27668-27675. PubMed ID: 34722966 [TBL] [Abstract][Full Text] [Related] [Next] [New Search]