These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.
15. Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon Vias. Kim SH; Lee HJ; Braun TM; Moffat TP; Josell D J Electrochem Soc; 2021; 168(11):. PubMed ID: 36936718 [TBL] [Abstract][Full Text] [Related]
16. Effect of Pulse Current and Pre-annealing on Thermal Extrusion of Cu in Through-Silicon via (TSV). Kim Y; Jin S; Park K; Lee J; Lim JH; Yoo B Front Chem; 2020; 8():771. PubMed ID: 33195017 [TBL] [Abstract][Full Text] [Related]
17. Bottom-Up Gold Filling in New Geometries and Yet Higher Aspect Ratio Gratings for Hard X-Ray Interferometry. Josell D; Shi Z; Jefimovs K; Guzenko V; Beauchamp C; Peer L; Polikarpov M; Moffat TP J Electrochem Soc; 2021; 168(8):. PubMed ID: 36938320 [TBL] [Abstract][Full Text] [Related]
18. A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications. Shao S; Liu D; Niu Y; O'Donnell K; Sengupta D; Park S Sensors (Basel); 2017 Feb; 17(2):. PubMed ID: 28208758 [TBL] [Abstract][Full Text] [Related]
19. Bottom-up Filling of Damascene Trenches with Gold in a Sulfite Electrolyte. Josell D; Moffat TP J Electrochem Soc; 2019; 166(1):. PubMed ID: 33041353 [TBL] [Abstract][Full Text] [Related]
20. A sub-atmospheric chemical vapor deposition process for deposition of oxide liner in high aspect ratio through silicon vias. Lisker M; Marschmeyer S; Kaynak M; Tekin I J Nanosci Nanotechnol; 2011 Sep; 11(9):8061-7. PubMed ID: 22097530 [TBL] [Abstract][Full Text] [Related] [Next] [New Search]