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9. Survey of P-Block Metal Additives for Superconformal Cu Deposition in an Alkaline Electrolyte. Josell D; Moffat TP J Electrochem Soc; 2022; 169(9):. PubMed ID: 36875632 [TBL] [Abstract][Full Text] [Related]
10. Superconformal Bottom-Up Gold Deposition in High Aspect Ratio Through Silicon Vias. Josell D; Moffat TP J Electrochem Soc; 2017; 164(6):D327-D334. PubMed ID: 28729743 [TBL] [Abstract][Full Text] [Related]
11. Superconformal Film Growth: From Smoothing Surfaces to Interconnect Technology. Moffat TP; Braun TM; Raciti D; Josell D Acc Chem Res; 2023 May; 56(9):1004-1017. PubMed ID: 37076974 [TBL] [Abstract][Full Text] [Related]
12. Superconformal Copper Deposition in Through Silicon Vias by Suppression-Breakdown. Josell D; Moffat TP J Electrochem Soc; 2018; 165(2):. PubMed ID: 33041352 [TBL] [Abstract][Full Text] [Related]
13. Superconformal Bottom-Up Nickel Deposition in High Aspect Ratio Through Silicon Vias. Josell D; Moffat TP ECS Trans; 2016; 163(7):D322-D331. PubMed ID: 29503673 [TBL] [Abstract][Full Text] [Related]
14. The Impact of Adsorbates on Metal Deposition Through The Curvature Enhanced Accelerator Coverage Mechanism… And Beyond. Josell D; Moffat TP ECS Trans; 2018; 85(12):. PubMed ID: 33062132 [TBL] [Abstract][Full Text] [Related]
15. Superconformal Bottom-Up Cobalt Deposition in High Aspect Ratio Through Silicon Vias. Josell D; Silva M; Moffat TP ECS Trans; 2016; 75(2):25-30. PubMed ID: 28690759 [TBL] [Abstract][Full Text] [Related]