These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.
150 related articles for article (PubMed ID: 33286587)
1. Design and Analysis of the IGBT Heat Dissipation Structure Based on Computational Continuum Mechanics. Lin X; Wu H; Liu Z; Ying B; Ye C; Zhang Y; Li Z Entropy (Basel); 2020 Jul; 22(8):. PubMed ID: 33286587 [TBL] [Abstract][Full Text] [Related]
2. Heat Dissipation Characteristics of IGBT Module Based on Flow-Solid Coupling. Tan L; Liu P; She C; Xu P; Yan L; Quan H Micromachines (Basel); 2022 Mar; 13(4):. PubMed ID: 35457859 [TBL] [Abstract][Full Text] [Related]
3. Thermal Performance Optimization of Integrated Microchannel Cooling Plate for IGBT Power Module. Xu H; Huang J; Tian W; Li Z Micromachines (Basel); 2023 Jul; 14(8):. PubMed ID: 37630033 [TBL] [Abstract][Full Text] [Related]
4. Effect of Solder Layer Void Damage on the Temperature of IGBT Modules. Xu P; Liu P; Yan L; Zhang Z Micromachines (Basel); 2023 Jun; 14(7):. PubMed ID: 37512655 [TBL] [Abstract][Full Text] [Related]
5. Study of the Solder Characteristics of IGBT Modules Based on Thermal-Mechanical Coupling Simulation. Chen J; Liu B; Hu M; Huang S; Yu S; Wu Y; Yang J Materials (Basel); 2023 May; 16(9):. PubMed ID: 37176386 [TBL] [Abstract][Full Text] [Related]
6. The Optimal Design of Field Ring for Reliability and Realization of 3.3 kV Insulated-Gate Bipolar Transistor Power Semiconductor. Shin MC; Kim HA; Ahn BS; Cui HF; Kim SY; Kang EG J Nanosci Nanotechnol; 2019 Mar; 19(3):1720-1723. PubMed ID: 30469253 [TBL] [Abstract][Full Text] [Related]
7. A Study on Real Time IGBT Junction Temperature Estimation Using the NTC and Calculation of Power Losses in the Automotive Inverter System. Lim H; Hwang J; Kwon S; Baek H; Uhm J; Lee G Sensors (Basel); 2021 Apr; 21(7):. PubMed ID: 33918142 [TBL] [Abstract][Full Text] [Related]
8. Soft and Damping Thermal Interface Materials with Honeycomb-Board-Mimetic Filler Network for Electronic Heat Dissipation. Liu W; Liu Y; Zhong S; Chen J; Li Z; Zhang C; Jiang P; Huang X Small; 2024 Aug; 20(35):e2400115. PubMed ID: 38678491 [TBL] [Abstract][Full Text] [Related]
9. Real-Time Temperature Prediction of Power Devices Using an Improved Thermal Equivalent Circuit Model and Application in Power Electronics. Hu Z; Cui M; Wu X Micromachines (Basel); 2023 Dec; 15(1):. PubMed ID: 38258182 [TBL] [Abstract][Full Text] [Related]
10. A Novel IGBT with SIPOS Pillars Achieving Ultralow Power Loss in TCAD Simulation Study. Yuan S; Yan Z; Li Y; Wang Y; Liu Q; Zhan X; Jiang X; He Y; Gong X Micromachines (Basel); 2024 Jun; 15(6):. PubMed ID: 38930729 [TBL] [Abstract][Full Text] [Related]
11. Prediction of IGBT Gate Oxide Layer's Performance Degradation Based on MultiScaleFormer Network. He S; Yu M; Chen Y; Zhou Z; Yu L; Zhang C; Ni Y Micromachines (Basel); 2024 Jul; 15(8):. PubMed ID: 39203636 [TBL] [Abstract][Full Text] [Related]
12. Power Performance Comparison of SiC-IGBT and Si-IGBT Switches in a Three-Phase Inverter for Aircraft Applications. Abdalgader IAS; Kivrak S; Özer T Micromachines (Basel); 2022 Feb; 13(2):. PubMed ID: 35208437 [TBL] [Abstract][Full Text] [Related]
13. A junction temperature model based on heat flow distribution in an IGBT module with solder layer voids. Li Q; Zhang F; Chen Y; Fu T; Zheng Z Heliyon; 2024 Jul; 10(13):e33625. PubMed ID: 39040395 [TBL] [Abstract][Full Text] [Related]
14. Preparation of a Crosslinked Poly(imide-siloxane) for Application to Transistor Insulation. Park HJ; Choi JY; Jin SW; Lee SH; Choi YJ; Kim DB; Chung CM Polymers (Basel); 2022 Dec; 14(24):. PubMed ID: 36559758 [TBL] [Abstract][Full Text] [Related]
15. Online Recognition of Fallen-Off Bond Wires in IGBT Modules. Hu Z; Cui M; Shi T Micromachines (Basel); 2024 Mar; 15(3):. PubMed ID: 38542651 [TBL] [Abstract][Full Text] [Related]
16. IGBT Gate Boost Drive Technology for Promoting the Overload Capacity of Traction Converter. Zhang Y; Dong X; Wu L; Wang X; Ma M; Huang X; Jin Y; Zhu P Micromachines (Basel); 2024 May; 15(6):. PubMed ID: 38930708 [TBL] [Abstract][Full Text] [Related]
17. Near Net Forming Research for Fin-Typed LED Radiator. Ni L; He S; Huang Y; Niu L; He G; Peng W Materials (Basel); 2022 Feb; 15(5):. PubMed ID: 35268966 [TBL] [Abstract][Full Text] [Related]
18. IGBT Fault Prediction Combining Terminal Characteristics and Artificial Intelligence Neural Network. Li C Comput Math Methods Med; 2022; 2022():7459354. PubMed ID: 35872937 [TBL] [Abstract][Full Text] [Related]
19. A Novel Manifold Dual-Microchannel Flow Field Structure with High-Performance Heat Dissipation. Yang X; Lin K; Zhang D; Liu S; Han B; Wang Z; Yu K; Wu W; Ge D; Wang C Micromachines (Basel); 2022 Aug; 13(9):. PubMed ID: 36144043 [TBL] [Abstract][Full Text] [Related]
20. A Novel Concept of Electron-Hole Enhancement for Superjunction Reverse-Conducting Insulated Gate Bipolar Transistor with Electron-Blocking Layer. Wang Z; Yang C; Huang X Micromachines (Basel); 2023 Mar; 14(3):. PubMed ID: 36985053 [TBL] [Abstract][Full Text] [Related] [Next] [New Search]