These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

251 related articles for article (PubMed ID: 33375238)

  • 1. Temperature-Triggered/Switchable Thermal Conductivity of Epoxy Resins.
    Windberger MS; Dimitriou E; Rendl S; Wewerka K; Wiesbrock F
    Polymers (Basel); 2020 Dec; 13(1):. PubMed ID: 33375238
    [TBL] [Abstract][Full Text] [Related]  

  • 2. Odd-even effect on the thermal conductivity of liquid crystalline epoxy resins.
    Lv G; Shen C; Shan N; Jensen E; Li X; Evans CM; Cahill DG
    Proc Natl Acad Sci U S A; 2022 Nov; 119(46):e2211151119. PubMed ID: 36343252
    [TBL] [Abstract][Full Text] [Related]  

  • 3. A Preliminary Study of Thermosets from Epoxy Resins Made Using Low-Toxicity Furan-Based Diols.
    Shafranska O; Sutton C; Kalita D; Kannaboina P; Tiwari S; Sibi MP; Webster DC
    Macromol Rapid Commun; 2024 Mar; ():e2300665. PubMed ID: 38444218
    [TBL] [Abstract][Full Text] [Related]  

  • 4. D-GQDs Modified Epoxy Resin Enhances the Thermal Conductivity of AlN/Epoxy Resin Thermally Conductive Composites.
    Zhang D; Liu F; Wang S; Yan M; Hu X; Xu M
    Polymers (Basel); 2021 Nov; 13(23):. PubMed ID: 34883578
    [TBL] [Abstract][Full Text] [Related]  

  • 5. Effect of the Structure of Epoxy Monomers and Curing Agents: Toward Making Intrinsically Highly Thermally Conductive and Low-Dielectric Epoxy Resins.
    Zhang J; Dang L; Zhang F; Zhang K; Kong Q; Gu J
    JACS Au; 2023 Dec; 3(12):3424-3435. PubMed ID: 38155647
    [TBL] [Abstract][Full Text] [Related]  

  • 6. Physical, Thermal Transport, and Compressive Properties of Epoxy Composite Filled with Graphitic- and Ceramic-Based Thermally Conductive Nanofillers.
    Samsudin SS; Abdul Majid MS; Mohd Jamir MR; Osman AF; Jaafar M; Alshahrani HA
    Polymers (Basel); 2022 Mar; 14(5):. PubMed ID: 35267837
    [TBL] [Abstract][Full Text] [Related]  

  • 7. Surface Degradation of DGEBA Epoxy Resins Cured with Structurally Different Amine Hardeners: Effects of UV Radiation.
    Varganici CD; Rosu L; Rosu D; Rosca I; Ignat ME; Ignat L
    Polymers (Basel); 2023 Dec; 16(1):. PubMed ID: 38201733
    [TBL] [Abstract][Full Text] [Related]  

  • 8. Thermal Healing, Reshaping and Ecofriendly Recycling of Epoxy Resin Crosslinked with Schiff Base of Vanillin and Hexane-1,6-Diamine.
    Mai VD; Shin SR; Lee DS; Kang I
    Polymers (Basel); 2019 Feb; 11(2):. PubMed ID: 30960277
    [TBL] [Abstract][Full Text] [Related]  

  • 9. Discotic Liquid Crystal Epoxy Resins Integrating Intrinsic High Thermal Conductivity and Intrinsic Flame Retardancy.
    Zhong X; Yang X; Ruan K; Zhang J; Zhang H; Gu J
    Macromol Rapid Commun; 2022 Jan; 43(1):e2100580. PubMed ID: 34626506
    [TBL] [Abstract][Full Text] [Related]  

  • 10. The use of polyimide-modified aluminum nitride fillers in AlN@PI/epoxy composites with enhanced thermal conductivity for electronic encapsulation.
    Zhou Y; Yao Y; Chen CY; Moon K; Wang H; Wong CP
    Sci Rep; 2014 Apr; 4():4779. PubMed ID: 24759082
    [TBL] [Abstract][Full Text] [Related]  

  • 11. Heat Dissipation in Epoxy/Amine-Based Gradient Composites with Alumina Particles: A Critical Evaluation of Thermal Conductivity Measurements.
    Morak M; Marx P; Gschwandl M; Fuchs PF; Pfost M; Wiesbrock F
    Polymers (Basel); 2018 Oct; 10(10):. PubMed ID: 30961056
    [TBL] [Abstract][Full Text] [Related]  

  • 12. Design of Intrinsically Flame-Retardant Vanillin-Based Epoxy Resin for Thermal-Conductive Epoxy/Graphene Aerogel Composites.
    Yang W; Ding H; Liu T; Ou R; Lin J; Puglia D; Xu P; Wang Q; Dong W; Du M; Ma P
    ACS Appl Mater Interfaces; 2021 Dec; 13(49):59341-59351. PubMed ID: 34859998
    [TBL] [Abstract][Full Text] [Related]  

  • 13. Syringaresinol: A Renewable and Safer Alternative to Bisphenol A for Epoxy-Amine Resins.
    Janvier M; Hollande L; Jaufurally AS; Pernes M; Ménard R; Grimaldi M; Beaugrand J; Balaguer P; Ducrot PH; Allais F
    ChemSusChem; 2017 Feb; 10(4):738-746. PubMed ID: 28045228
    [TBL] [Abstract][Full Text] [Related]  

  • 14. Rheological Properties and Thermal Conductivity of Epoxy Resins Filled with a Mixture of Alumina and Boron Nitride.
    Mai VD; Lee DI; Park JH; Lee DS
    Polymers (Basel); 2019 Apr; 11(4):. PubMed ID: 30960581
    [TBL] [Abstract][Full Text] [Related]  

  • 15. Study on Thermomechanical Properties and Morphology of an Epoxy Resin Thermally Conductive Adhesive under Different Curing Conditions.
    Zhang C; Xu Z; Huang Y; Li Y; Li Y; Yang B; Hu R; Zou J; Zheng C; Qian Q
    ACS Omega; 2024 Mar; 9(10):11637-11645. PubMed ID: 38497002
    [TBL] [Abstract][Full Text] [Related]  

  • 16. Effect of the alumina micro-particle sizes on the thermal conductivity and dynamic mechanical property of epoxy resin.
    Xu Z; Zhang C; Li Y; Zou J; Li Y; Yang B; Hu R; Qian Q
    PLoS One; 2023; 18(10):e0292878. PubMed ID: 37831678
    [TBL] [Abstract][Full Text] [Related]  

  • 17. Synergistic Effects of Hybrid Carbonaceous Fillers of Carbon Fibers and Reduced Graphene Oxides on Enhanced Heat-Dissipation Capability of Polymer Composites.
    Lee YS; Yu J; Shim SE; Yang CM
    Polymers (Basel); 2020 Apr; 12(4):. PubMed ID: 32295199
    [TBL] [Abstract][Full Text] [Related]  

  • 18. Remarkable enhancement of thermal stability of epoxy resin through the incorporation of mesoporous silica micro-filler.
    Yeasmin F; Mallik AK; Chisty AH; Robel FN; Shahruzzaman M; Haque P; Rahman MM; Hano N; Takafuji M; Ihara H
    Heliyon; 2021 Jan; 7(1):e05959. PubMed ID: 33521354
    [TBL] [Abstract][Full Text] [Related]  

  • 19. Aligned structures of mesogenic motifs in epoxy resin and their thermal conductivities.
    Lee M; Ha MY; Lee M; Kim JH; Kim SD; Kim I; Lee WB
    Nanoscale Adv; 2022 Apr; 4(8):1970-1978. PubMed ID: 36133416
    [TBL] [Abstract][Full Text] [Related]  

  • 20. Double-Wall Nanotubes and Graphene Nanoplatelets for Hybrid Conductive Adhesives with Enhanced Thermal and Electrical Conductivity.
    Messina E; Leone N; Foti A; Di Marco G; Riccucci C; Di Carlo G; Di Maggio F; Cassata A; Gargano L; D'Andrea C; Fazio B; Maragò OM; Robba B; Vasi C; Ingo GM; Gucciardi PG
    ACS Appl Mater Interfaces; 2016 Sep; 8(35):23244-59. PubMed ID: 27538099
    [TBL] [Abstract][Full Text] [Related]  

    [Next]    [New Search]
    of 13.