These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

117 related articles for article (PubMed ID: 33531717)

  • 1. Influence on temperature distribution of COB deep UV LED due to different packaging density and substrate type.
    Xia Z; Liang S; Li B; Wang F; Zhang D
    Optik (Stuttg); 2021 Apr; 231():166392. PubMed ID: 33531717
    [TBL] [Abstract][Full Text] [Related]  

  • 2. Deposition and thermal characterization of nano-structured aluminum nitride thin film on Cu-W substrate for high power light emitting diode package.
    Cho HM; Kim MS
    J Nanosci Nanotechnol; 2014 Aug; 14(8):5824-7. PubMed ID: 25936009
    [TBL] [Abstract][Full Text] [Related]  

  • 3. Effect of refractive index of packaging materials on the light extraction efficiency of COB-LEDs with millilens array.
    Yu X; Xiang L; Zhou S; Pei N; Luo X
    Appl Opt; 2021 Jan; 60(2):306-311. PubMed ID: 33448953
    [TBL] [Abstract][Full Text] [Related]  

  • 4. Vertical semiconductor deep ultraviolet light emitting diodes on a nanowire-assisted aluminum nitride buffer layer.
    Zhang Q; Parimoo H; Martel E; Zhao S
    Sci Rep; 2022 May; 12(1):7230. PubMed ID: 35508615
    [TBL] [Abstract][Full Text] [Related]  

  • 5. Low-Yellowing Phosphor-in-Glass for High-Power Chip-on-board White LEDs by Optimizing a Low-Melting Sn-P-F-O Glass Matrix.
    Yoon HC; Yoshihiro K; Yoo H; Lee SW; Oh JH; Do YR
    Sci Rep; 2018 May; 8(1):7412. PubMed ID: 29743520
    [TBL] [Abstract][Full Text] [Related]  

  • 6. Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging.
    Wang PH; Huang YW; Chiang KN
    Micromachines (Basel); 2021 Mar; 12(3):. PubMed ID: 33802243
    [TBL] [Abstract][Full Text] [Related]  

  • 7. Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application.
    Zhou T; Ma S; Yu D; Li M; Hang T
    Sensors (Basel); 2020 Jul; 20(15):. PubMed ID: 32707858
    [TBL] [Abstract][Full Text] [Related]  

  • 8. Preparation of a YAG:Ce phosphor glass by screen-printing technology and its application in LED packaging.
    Yang L; Chen M; Lv Z; Wang S; Liu X; Liu S
    Opt Lett; 2013 Jul; 38(13):2240-3. PubMed ID: 23811889
    [TBL] [Abstract][Full Text] [Related]  

  • 9. Changes in the physical properties of frozen cooked rice depending on thermal insulation levels of packaging during freeze-thaw.
    Lee HG; Yoo S
    J Food Sci; 2020 Dec; 85(12):4342-4350. PubMed ID: 33179330
    [TBL] [Abstract][Full Text] [Related]  

  • 10. Improving Thermal Conductivity of Injection Molded Polycarbonate/Boron Nitride Composites by Incorporating Spherical Alumina Particles: The Influence of Alumina Particle Size.
    Zhou C; Bai Y; Zou H; Zhou S
    Polymers (Basel); 2022 Aug; 14(17):. PubMed ID: 36080549
    [TBL] [Abstract][Full Text] [Related]  

  • 11. Development of LED Package Heat Dissipation Research.
    Liu P; She C; Tan L; Xu P; Yan L
    Micromachines (Basel); 2022 Jan; 13(2):. PubMed ID: 35208353
    [TBL] [Abstract][Full Text] [Related]  

  • 12. Achieving highly practical capacitance of MnO
    Yan J; Wang H; Ji S; Pollet BG; Wang R
    Nanoscale; 2018 Apr; 10(16):7813-7820. PubMed ID: 29664088
    [TBL] [Abstract][Full Text] [Related]  

  • 13. Highly Thermally Conductive and Superior Electrical Insulation Polymer Composites via In Situ Thermal Expansion of Expanded Graphite and In Situ Oxidation of Aluminum Nanoflakes.
    Yang S; Wang Q; Wen B
    ACS Appl Mater Interfaces; 2021 Jan; 13(1):1511-1523. PubMed ID: 33347278
    [TBL] [Abstract][Full Text] [Related]  

  • 14. Rheological Properties and Thermal Conductivity of Epoxy Resins Filled with a Mixture of Alumina and Boron Nitride.
    Mai VD; Lee DI; Park JH; Lee DS
    Polymers (Basel); 2019 Apr; 11(4):. PubMed ID: 30960581
    [TBL] [Abstract][Full Text] [Related]  

  • 15. Enhanced Thermal Conductivity of Epoxy Composites Filled with Al
    Lee Sanchez WA; Huang CY; Chen JX; Soong YC; Chan YN; Chiou KC; Lee TM; Cheng CC; Chiu CW
    Polymers (Basel); 2021 Jan; 13(1):. PubMed ID: 33401420
    [TBL] [Abstract][Full Text] [Related]  

  • 16. Study on aluminum nitride/addition-cure liquid silicone rubber composite for high-voltage power encapsulation.
    Ou Z; Gao F; Zhu L; Zhao H; Xun Z
    PLoS One; 2021; 16(6):e0252619. PubMed ID: 34061909
    [TBL] [Abstract][Full Text] [Related]  

  • 17. Use of advanced modeling techniques to optimize thermal packaging designs.
    Formato RM; Potami R; Ahmed I
    PDA J Pharm Sci Technol; 2010; 64(6):545-61. PubMed ID: 21502065
    [TBL] [Abstract][Full Text] [Related]  

  • 18. Acid tolerant multicomponent bacterial enzymes production enhancement under the influence of corn cob waste substrate.
    Srivastava N; Singh R; Mohammad A; Pal DB; Ahmad I; Alam MM; Mishra PK; Gupta VK
    Int J Food Microbiol; 2022 Jul; 373():109698. PubMed ID: 35561526
    [TBL] [Abstract][Full Text] [Related]  

  • 19. Warpage Simulation During Fan-Out Wafer-Level Packaging Process with Uncertainty of Material Properties.
    Kim G; Kwon D
    J Nanosci Nanotechnol; 2021 May; 21(5):2987-2991. PubMed ID: 33653469
    [TBL] [Abstract][Full Text] [Related]  

  • 20. Polymer-Based Biocompatible Packaging for Implantable Devices: Packaging Method, Materials, and Reliability Simulation.
    Seok S
    Micromachines (Basel); 2021 Aug; 12(9):. PubMed ID: 34577664
    [TBL] [Abstract][Full Text] [Related]  

    [Next]    [New Search]
    of 6.