These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

171 related articles for article (PubMed ID: 33919757)

  • 1. The Influence of Wire Speed on Phase Transitions and Residual Stress in Single Crystal Silicon Wafers Sawn by Resin Bonded Diamond Wire Saw.
    Liu T; Ge P; Bi W
    Micromachines (Basel); 2021 Apr; 12(4):. PubMed ID: 33919757
    [TBL] [Abstract][Full Text] [Related]  

  • 2. Breakage Ratio of Silicon Wafer during Fixed Diamond Wire Sawing.
    Liu T; Su Y; Ge P
    Micromachines (Basel); 2022 Nov; 13(11):. PubMed ID: 36363919
    [TBL] [Abstract][Full Text] [Related]  

  • 3. Prediction of Subsurface Microcrack Damage Depth Based on Surface Roughness in Diamond Wire Sawing of Monocrystalline Silicon.
    Wang K; Gao Y; Yang C
    Materials (Basel); 2024 Jan; 17(3):. PubMed ID: 38591417
    [TBL] [Abstract][Full Text] [Related]  

  • 4. Influence of Diamond Wire Saw Processing Parameters on the Sawn Surface Characteristics of Silicon Nitride Ceramics.
    Zhang S; Gao Y; Zhang X; Guo Y
    Micromachines (Basel); 2023 Aug; 14(9):. PubMed ID: 37763823
    [TBL] [Abstract][Full Text] [Related]  

  • 5. Experimental Study on Surface Integrity of Solar Cell Silicon Wafers Sliced by Electrochemical Multi-Wire Saw.
    Bao G; Huang C; Zhang Y; Yu Z; Wang W
    Micromachines (Basel); 2022 Sep; 13(9):. PubMed ID: 36144092
    [TBL] [Abstract][Full Text] [Related]  

  • 6. Wire Bow In Situ Measurement for Monitoring the Evolution of Sawing Capability of Diamond Wire Saw during Slicing Sapphire.
    Yang Z; Huang H; Liao X; Lai Z; Xu Z; Zhao Y
    Materials (Basel); 2024 May; 17(9):. PubMed ID: 38730940
    [TBL] [Abstract][Full Text] [Related]  

  • 7. Grain flash temperatures in diamond wire sawing of silicon.
    Pala U; Süssmaier S; Wegener K
    Int J Adv Manuf Technol; 2021; 117(7-8):2227-2236. PubMed ID: 34759440
    [TBL] [Abstract][Full Text] [Related]  

  • 8. Experimental Study on the Influence of Wire-Saw Wear on Cutting Force and Silicon Wafer Surface.
    Liang L; Li S; Lan K; Yu R; Wang J; Zhao W
    Materials (Basel); 2023 May; 16(10):. PubMed ID: 37241246
    [TBL] [Abstract][Full Text] [Related]  

  • 9. Review of resource and recycling of silicon powder from diamond-wire sawing silicon waste.
    Li X; Lv G; Ma W; Li T; Zhang R; Zhang J; Li S; Lei Y
    J Hazard Mater; 2022 Feb; 424(Pt A):127389. PubMed ID: 34879579
    [TBL] [Abstract][Full Text] [Related]  

  • 10. Sawing Force Prediction Model and Experimental Study on Vibration-Assisted Diamond Wire Sawing.
    Zhang C; Dong Z; Zhao Y; Liu Z; Wu S; Yang J
    Micromachines (Basel); 2022 Nov; 13(11):. PubMed ID: 36422455
    [TBL] [Abstract][Full Text] [Related]  

  • 11. Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon.
    Li A; Hu S; Zhou Y; Wang H; Zhang Z; Ming W
    Micromachines (Basel); 2023 Jul; 14(8):. PubMed ID: 37630048
    [TBL] [Abstract][Full Text] [Related]  

  • 12. A method for determining average damage depth of sawn crystalline silicon wafers.
    Sopori B; Devayajanam S; Basnyat P
    Rev Sci Instrum; 2016 Apr; 87(4):045104. PubMed ID: 27131704
    [TBL] [Abstract][Full Text] [Related]  

  • 13. A Grain Orientation-Independent Single-Step Saw Damage Gettering/Wet texturing Process for Efficient Silicon Solar Cells.
    Jung Y; Min KH; Post R; Kwapil W; Schubert MC; Kim D; Kang Y; Lee HS
    Small; 2023 May; 19(19):e2206831. PubMed ID: 36811154
    [TBL] [Abstract][Full Text] [Related]  

  • 14. Recycling of silicon from waste PV diamond wire sawing silicon powders: A strategy of Na
    Zou Q; Huang L; Chen W; Chen G; Li Y; Li M; Zhang C; Luo X
    Waste Manag; 2023 Aug; 168():107-115. PubMed ID: 37290339
    [TBL] [Abstract][Full Text] [Related]  

  • 15. A new strategy for de-oxidation of diamond-wire sawing silicon waste via the synergistic effect of magnesium thermal reduction and hydrochloric acid leaching.
    Yang F; Yu W; Rao Z; Wei P; Jiang W; Chen H
    J Environ Manage; 2022 Sep; 317():115424. PubMed ID: 35661877
    [TBL] [Abstract][Full Text] [Related]  

  • 16. HF-(NH₄)₂S₂O₈-HCl Mixtures for HNO₃- and NOx-free Etching of Diamond Wire- and SiC-Slurry-Sawn Silicon Wafers: Reactivity Studies, Surface Chemistry, and Unexpected Pyramidal Surface Morphologies.
    Stapf A; Gondek C; Lippold M; Kroke E
    ACS Appl Mater Interfaces; 2015 Apr; 7(16):8733-42. PubMed ID: 25826145
    [TBL] [Abstract][Full Text] [Related]  

  • 17. Simulation of the ductile machining mode of silicon.
    Klippel H; Süssmaier S; Röthlin M; Afrasiabi M; Pala U; Wegener K
    Int J Adv Manuf Technol; 2021; 115(5-6):1565-1578. PubMed ID: 34776579
    [TBL] [Abstract][Full Text] [Related]  

  • 18. Experimental Research on the Supply of Working Fluid for Fixed Diamond Wire Slicing Based on Ultrasonic Capillary Effect.
    Zhao J; Shen L; Zhang C; Wang Y
    Micromachines (Basel); 2024 Jul; 15(7):. PubMed ID: 39064421
    [TBL] [Abstract][Full Text] [Related]  

  • 19. Inversion of surface damage and residual stress in ground silicon wafers by laser surface acoustic wave technology.
    Liu Z; Lin B; Liang X; Du A
    Ultrasonics; 2021 May; 113():106367. PubMed ID: 33550086
    [TBL] [Abstract][Full Text] [Related]  

  • 20. Recycling and reuse of kerf-loss silicon from diamond wire sawing for photovoltaic industry.
    Yang HL; Liu IT; Liu CE; Hsu HP; Lan CW
    Waste Manag; 2019 Feb; 84():204-210. PubMed ID: 30691894
    [TBL] [Abstract][Full Text] [Related]  

    [Next]    [New Search]
    of 9.