These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

169 related articles for article (PubMed ID: 34489499)

  • 1. Super fine cerium hydroxide abrasives for SiO
    Son YH; Jeong GP; Kim PS; Han MH; Hong SW; Bae JY; Kim SI; Park JH; Park JG
    Sci Rep; 2021 Sep; 11(1):17736. PubMed ID: 34489499
    [TBL] [Abstract][Full Text] [Related]  

  • 2. The Effects of Friction and Temperature in the Chemical-Mechanical Planarization Process.
    Ilie F; Minea IL; Cotici CD; Hristache AF
    Materials (Basel); 2023 Mar; 16(7):. PubMed ID: 37048844
    [TBL] [Abstract][Full Text] [Related]  

  • 3. Characterization of Ceria Nanoparticles as Abrasives Applied with Defoaming Polymers for CMP (Chemical Mechanical Polishing) Applications.
    Hwang S; Kim W
    Polymers (Basel); 2024 Mar; 16(6):. PubMed ID: 38543450
    [TBL] [Abstract][Full Text] [Related]  

  • 4. Scavenger with Protonated Phosphite Ions for Incredible Nanoscale ZrO
    Kim SI; Jeong GP; Lee SJ; Lee JC; Lee JM; Park JH; Bae JY; Park JG
    Nanomaterials (Basel); 2021 Dec; 11(12):. PubMed ID: 34947644
    [TBL] [Abstract][Full Text] [Related]  

  • 5. Tribochemical mechanisms of abrasives for SiC and sapphire substrates in nanoscale polishing.
    Luo Q; Lu J; Jiang F; Lin J; Tian Z
    Nanoscale; 2023 Oct; 15(38):15675-15685. PubMed ID: 37724457
    [TBL] [Abstract][Full Text] [Related]  

  • 6. Comparison of ceria nanoparticle concentrations in effluent from chemical mechanical polishing of silicon dioxide.
    Zazzera L; Mader B; Ellefson M; Eldridge J; Loper S; Zabasajja J; Qian J
    Environ Sci Technol; 2014 Nov; 48(22):13427-33. PubMed ID: 25317965
    [TBL] [Abstract][Full Text] [Related]  

  • 7. The Effects of Precursors on the Morphology and Chemical Mechanical Polishing Performance of Ceria-Based Abrasives.
    Zheng Y; Wang N; Feng Z; Tan X; Zhang Z; Han H; Huang X
    Materials (Basel); 2022 Oct; 15(21):. PubMed ID: 36363118
    [TBL] [Abstract][Full Text] [Related]  

  • 8. Synthesis and performance of colloidal silica nano-abrasives with controllable size for chemical mechanical planarization.
    Zhang KL; Song ZT; Wang F; Wang LY; Feng SL
    J Nanosci Nanotechnol; 2009 Feb; 9(2):1054-7. PubMed ID: 19441454
    [TBL] [Abstract][Full Text] [Related]  

  • 9. Polymer Nanoparticles Applied in the CMP (Chemical Mechanical Polishing) Process of Chip Wafers for Defect Improvement and Polishing Removal Rate Response.
    Chiu WL; Huang CI
    Polymers (Basel); 2023 Jul; 15(15):. PubMed ID: 37571091
    [TBL] [Abstract][Full Text] [Related]  

  • 10. Preparation of Fe-doped colloidal SiO(2) abrasives and their chemical mechanical polishing behavior on sapphire substrates.
    Lei H; Gu Q; Chen R; Wang Z
    Appl Opt; 2015 Aug; 54(24):7188-94. PubMed ID: 26368752
    [TBL] [Abstract][Full Text] [Related]  

  • 11. Application of electrospray-scanning mobility particle sizer for the measurement of sub-10 nm chemical mechanical planarization slurry abrasive size distribution.
    Kwak D; Kim J; Oh S; Bae C; Kim T
    Rev Sci Instrum; 2020 Jul; 91(7):075117. PubMed ID: 32752794
    [TBL] [Abstract][Full Text] [Related]  

  • 12. Atomic surface of quartz glass induced by photocatalytic green chemical mechanical polishing using the developed SiO
    Fan Y; Zhang Z; Yu J; Deng X; Shi C; Zhou H; Meng F; Feng J
    Nanoscale Adv; 2024 Feb; 6(5):1380-1391. PubMed ID: 38419872
    [TBL] [Abstract][Full Text] [Related]  

  • 13. Crystalline structure of ceria particles controlled by the oxygen partial pressure and STI CMP performances.
    Kim YH; Kim SK; Kim N; Park JG; Paik U
    Ultramicroscopy; 2008 Sep; 108(10):1292-6. PubMed ID: 18562111
    [TBL] [Abstract][Full Text] [Related]  

  • 14. Non-Prestonian behavior of rectangular shaped ceria slurry in shallow trench isolation chemical mechanical planarization.
    Kim YH; Jung YG; Yoon GS; Moon J; Watanabe A; Naito M; Paik U
    J Nanosci Nanotechnol; 2012 Mar; 12(3):2810-4. PubMed ID: 22755127
    [TBL] [Abstract][Full Text] [Related]  

  • 15. Interaction, transformation and toxicity assessment of particles and additives used in the semiconducting industry.
    Dumitrescu E; Karunaratne DP; Babu SV; Wallace KN; Andreescu S
    Chemosphere; 2018 Feb; 192():178-185. PubMed ID: 29101857
    [TBL] [Abstract][Full Text] [Related]  

  • 16. Control of adhesion force between ceria particles and polishing pad in shallow trench isolation chemical mechanical planarization.
    Seo J; Moon J; Bae JY; Yoon KS; Sigmund W; Paik U
    J Nanosci Nanotechnol; 2014 Jun; 14(6):4351-6. PubMed ID: 24738395
    [TBL] [Abstract][Full Text] [Related]  

  • 17. Colloid aspects of chemical-mechanical planarization.
    Matijević E; Babu SV
    J Colloid Interface Sci; 2008 Apr; 320(1):219-37. PubMed ID: 18201713
    [TBL] [Abstract][Full Text] [Related]  

  • 18. Synthesis, Characterization, and Polishing Properties of a Lanthanum Cerium Fluoride Abrasive.
    Mei Y; Chen W; Chen X
    Materials (Basel); 2023 Apr; 16(9):. PubMed ID: 37176275
    [TBL] [Abstract][Full Text] [Related]  

  • 19. Abrasive-free chemical-mechanical planarization (CMP) of gold for thin film nano-patterning.
    Gherman R; Beaudin G; Stricher R; Bryche JF; Levesque P; Fillion-Gourdeau F; MacLean SG; Drouin D; Charette PG; Ecoffey S
    Nanoscale; 2024 Sep; 16(36):16861-16869. PubMed ID: 39148377
    [TBL] [Abstract][Full Text] [Related]  

  • 20. Polymer link breakage of polyimide-film-surface using hydrolysis reaction accelerator for enhancing chemical-mechanical-planarization polishing-rate.
    Jeong GP; Park JS; Lee SJ; Kim PS; Han MH; Hong SW; Kim ES; Park JH; Choo BK; Kang SB; Park JG
    Sci Rep; 2022 Mar; 12(1):3366. PubMed ID: 35233019
    [TBL] [Abstract][Full Text] [Related]  

    [Next]    [New Search]
    of 9.