These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

188 related articles for article (PubMed ID: 35009255)

  • 1. The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration.
    Xu K; Fu X; Wang X; Fu Z; Yang X; Chen S; Shi Y; Huang Y; Chen H
    Materials (Basel); 2021 Dec; 15(1):. PubMed ID: 35009255
    [TBL] [Abstract][Full Text] [Related]  

  • 2. The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints.
    Fu X; Liu M; Xu K; Chen S; Shi Y; Fu Z; Huang Y; Chen H; Yao R
    Materials (Basel); 2020 Dec; 13(23):. PubMed ID: 33276575
    [TBL] [Abstract][Full Text] [Related]  

  • 3. Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints.
    Zhang C; Zhang K; Gao Y; Wang Y
    Materials (Basel); 2023 Mar; 16(7):. PubMed ID: 37048920
    [TBL] [Abstract][Full Text] [Related]  

  • 4. Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints.
    Hsu PN; Lee DL; Tran DP; Shie KC; Tsou NT; Chen C
    Materials (Basel); 2022 Oct; 15(20):. PubMed ID: 36295180
    [TBL] [Abstract][Full Text] [Related]  

  • 5. Crystallographic Characteristic Effect of Cu Substrate on Serrated Cathode Dissolution in Cu/Sn-3.0Ag-0.5Cu/Cu Solder Joints during Electromigration.
    Yue W; Ding C; Qin H; Gong C; Zhang J
    Materials (Basel); 2021 May; 14(10):. PubMed ID: 34064928
    [TBL] [Abstract][Full Text] [Related]  

  • 6. Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper.
    Xiao J; Cheng W; Fu-Kang Q
    Heliyon; 2024 Mar; 10(5):e27010. PubMed ID: 38455589
    [TBL] [Abstract][Full Text] [Related]  

  • 7. Effect of Grain Structure and Ni/Au-UBM Layer on Electromigration-Induced Failure Mechanism in Sn-3.0Ag-0.5Cu Solder Joints.
    Zhang Y; Zhang J; Wang Y; Fang Y
    Micromachines (Basel); 2022 Jun; 13(6):. PubMed ID: 35744565
    [TBL] [Abstract][Full Text] [Related]  

  • 8. Microstructure and Grain Orientation Evolution in SnPb/SnAgCu Interconnects Under Electrical Current Stressing at Cryogenic Temperature.
    Fu X; En Y; Zhou B; Chen S; Huang Y; He X; Chen H; Yao R
    Materials (Basel); 2019 May; 12(10):. PubMed ID: 31096663
    [TBL] [Abstract][Full Text] [Related]  

  • 9. Effect of electromigration on microstructure and properties of CeO
    Chen W; Zhang K; Fan Y; Zhang C; Wang N
    Sci Rep; 2024 Jul; 14(1):15693. PubMed ID: 38977834
    [TBL] [Abstract][Full Text] [Related]  

  • 10. Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints.
    Shen YA; Wu JA
    Materials (Basel); 2022 Jul; 15(14):. PubMed ID: 35888552
    [TBL] [Abstract][Full Text] [Related]  

  • 11. Interfacial Reaction and Electromigration Failure of Cu Pillar/Ni/Sn-Ag/Cu Microbumps under Bidirectional Current Stressing.
    Fu Z; Chen J; Zhao P; Guo X; Xiao Q; Fu X; Wang J; Yang C; Xu J; Yang JY
    Materials (Basel); 2023 Jan; 16(3):. PubMed ID: 36770139
    [TBL] [Abstract][Full Text] [Related]  

  • 12. Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu.
    Li YJ; Yen YW; Chen CM
    Materials (Basel); 2024 May; 17(9):. PubMed ID: 38730955
    [TBL] [Abstract][Full Text] [Related]  

  • 13. Study of the effect of Sn grain boundaries on IMC morphology in solid state inter-diffusion soldering.
    Hou L; Moelans N; Derakhshandeh J; De Wolf I; Beyne E
    Sci Rep; 2019 Oct; 9(1):14862. PubMed ID: 31619710
    [TBL] [Abstract][Full Text] [Related]  

  • 14. Mechanical Property of SAC305 Ball-Grid Array and Epoxy Sn-58Bi Solder Joints with 85 °C/85% Relative Humidity Environmental Conditions.
    Kim KY; Myung WR; Jeong H; Sung YG; Jung SB
    J Nanosci Nanotechnol; 2018 Sep; 18(9):6162-6166. PubMed ID: 29677761
    [TBL] [Abstract][Full Text] [Related]  

  • 15. Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene.
    Ko YH; Lee JD; Yoon T; Lee CW; Kim TS
    ACS Appl Mater Interfaces; 2016 Mar; 8(8):5679-86. PubMed ID: 26856638
    [TBL] [Abstract][Full Text] [Related]  

  • 16. Diffusion Barrier Performance of Ni-W Layer at Sn/Cu Interfacial Reaction.
    Yao J; Li C; Shang M; Chen X; Wang Y; Ma H; Ma H; Liu X
    Materials (Basel); 2024 Jul; 17(15):. PubMed ID: 39124349
    [TBL] [Abstract][Full Text] [Related]  

  • 17. In situ synchrotron study of electromigration induced grain rotations in Sn solder joints.
    Shen H; Zhu W; Li Y; Tamura N; Chen K
    Sci Rep; 2016 Apr; 6():24418. PubMed ID: 27086863
    [TBL] [Abstract][Full Text] [Related]  

  • 18. Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition.
    Wang Q; Chen H; Wang F
    Materials (Basel); 2019 Dec; 12(24):. PubMed ID: 31861193
    [TBL] [Abstract][Full Text] [Related]  

  • 19. Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint.
    Hashim AN; Salleh MAAM; Sandu AV; Ramli MM; Yee KC; Mohd Mokhtar NZ; Chaiprapa J
    Materials (Basel); 2021 Feb; 14(4):. PubMed ID: 33562471
    [TBL] [Abstract][Full Text] [Related]  

  • 20. Growth kinetics of Cu
    Feng J; Hang C; Tian Y; Liu B; Wang C
    Sci Rep; 2018 Jan; 8(1):1775. PubMed ID: 29379073
    [TBL] [Abstract][Full Text] [Related]  

    [Next]    [New Search]
    of 10.