183 related articles for article (PubMed ID: 35454450)
1. Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow.
Zaimi NSM; Salleh MAAM; Abdullah MMA; Nadzri NIM; Sandu AV; Vizureanu P; Ramli MII; Nogita K; Yasuda H; Sandu IG
Materials (Basel); 2022 Apr; 15(8):. PubMed ID: 35454450
[TBL] [Abstract][Full Text] [Related]
2. Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing.
Zaimi NSM; Salleh MAAM; Sandu AV; Abdullah MMAB; Saud N; Rahim SZA; Vizureanu P; Said RM; Ramli MII
Materials (Basel); 2021 Feb; 14(4):. PubMed ID: 33562200
[TBL] [Abstract][Full Text] [Related]
3. Microstructure and Shear Behaviour of Sn-3.0Ag-0.5Cu Composite Solder Pastes Enhanced by Epoxy Resin.
Zhang P; Xue S; Liu L; Wu J; Luo Q; Wang J
Polymers (Basel); 2022 Dec; 14(23):. PubMed ID: 36501697
[TBL] [Abstract][Full Text] [Related]
4. Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene.
Ko YH; Lee JD; Yoon T; Lee CW; Kim TS
ACS Appl Mater Interfaces; 2016 Mar; 8(8):5679-86. PubMed ID: 26856638
[TBL] [Abstract][Full Text] [Related]
5. Effects of Multiple Reflow on the Formation of Primary Crystals in Sn-3.5Ag and Solder Joint Strength: Experimental and Finite Element Analysis.
Amli SFM; Salleh MAAM; Aziz MSA; Yasuda H; Nogita K; Abdullah MMAB; Nemes O; Sandu AV; Vizureanu P
Materials (Basel); 2023 Jun; 16(12):. PubMed ID: 37374543
[TBL] [Abstract][Full Text] [Related]
6. Effect of Epoxy on Mechanical Property of SAC305 Solder Joint with Various Surface Finishes Under 3-Point Bend Test.
Jeong H; Myung WR; Sung YG; Kim KY; Jung SB
J Nanosci Nanotechnol; 2018 Sep; 18(9):6316-6320. PubMed ID: 29677789
[TBL] [Abstract][Full Text] [Related]
7. Influence of Isothermal Aging on Microstructure and Shear Property of Novel Epoxy Composite SAC305 Solder Joints.
Zhang P; Xue S; Liu L; Wang J; Tatsumi H; Nishikawa H
Polymers (Basel); 2023 Oct; 15(20):. PubMed ID: 37896411
[TBL] [Abstract][Full Text] [Related]
8. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition.
Leong YM; Haseeb ASMA
Materials (Basel); 2016 Jun; 9(7):. PubMed ID: 28773645
[TBL] [Abstract][Full Text] [Related]
9. Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate.
Son J; Yu DY; Kim YC; Kim SI; Kim MS; Byun D; Bang J
Materials (Basel); 2021 May; 14(9):. PubMed ID: 34063188
[TBL] [Abstract][Full Text] [Related]
10. Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO
Mohamed Muzni NH; Mhd Noor EE; Abdullah MMAB
Nanomaterials (Basel); 2023 Oct; 13(20):. PubMed ID: 37887960
[TBL] [Abstract][Full Text] [Related]
11. Hybrid solder joints: the effect of nanosized ZrO
Wodak I; Yakymovych A; Svec P; Orovcik L; Khatibi G
Appl Nanosci; 2023; 13(11):7379-7385. PubMed ID: 38046828
[TBL] [Abstract][Full Text] [Related]
12. Effects of Initial Morphology on Growth Kinetics of Cu
Lee JY; Chen CM
Materials (Basel); 2022 Jul; 15(14):. PubMed ID: 35888218
[TBL] [Abstract][Full Text] [Related]
13. Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging.
Zhao D; Zhang K; Ma N; Li S; Yin C; Huo F
Materials (Basel); 2020 Feb; 13(4):. PubMed ID: 32059528
[TBL] [Abstract][Full Text] [Related]
14. Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted reflow soldering.
Tan AT; Tan AW; Yusof F
Ultrason Sonochem; 2017 Jan; 34():616-625. PubMed ID: 27773288
[TBL] [Abstract][Full Text] [Related]
15. The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-
Li C; Yan Y; Gao T; Xu G
Materials (Basel); 2020 Oct; 13(19):. PubMed ID: 33036405
[TBL] [Abstract][Full Text] [Related]
16. Effects of Cu Opening Size on the Mechanical Properties of Epoxy-Contained Sn-58Bi Solder Joints.
Min KD; Myung WR; Kim KY; Sung YG; Jung SB
J Nanosci Nanotechnol; 2019 Oct; 19(10):6437-6443. PubMed ID: 31026974
[TBL] [Abstract][Full Text] [Related]
17. Effect of Thermal Aging on the Mechanical Properties of SAC305.
Hamasha K; Hamasha MM; Hamasha S
Materials (Basel); 2022 Apr; 15(8):. PubMed ID: 35454509
[TBL] [Abstract][Full Text] [Related]
18. Mechanical Property of SAC305 Ball-Grid Array and Epoxy Sn-58Bi Solder Joints with 85 °C/85% Relative Humidity Environmental Conditions.
Kim KY; Myung WR; Jeong H; Sung YG; Jung SB
J Nanosci Nanotechnol; 2018 Sep; 18(9):6162-6166. PubMed ID: 29677761
[TBL] [Abstract][Full Text] [Related]
19. In situ imaging of microstructure formation in electronic interconnections.
Salleh MA; Gourlay CM; Xian JW; Belyakov SA; Yasuda H; McDonald SD; Nogita K
Sci Rep; 2017 Jan; 7():40010. PubMed ID: 28079120
[TBL] [Abstract][Full Text] [Related]
20. Interfacial Reactions and Mechanical Properties of Sn-58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding.
Jeong G; Yu DY; Baek S; Bang J; Lee TI; Jung SB; Kim J; Ko YH
Materials (Basel); 2021 Jan; 14(2):. PubMed ID: 33440741
[TBL] [Abstract][Full Text] [Related]
[Next] [New Search]
