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5. Fabrication of 2-D Capacitive Micromachined Ultrasonic Transducer (CMUT) Array through Silicon Wafer Bonding. Wang Z; He C; Zhang W; Li Y; Gao P; Meng Y; Zhang G; Yang Y; Wang R; Cui J; Wang H; Zhang B; Ren Y; Zhen G; Jiao X; Zhang S Micromachines (Basel); 2022 Jan; 13(1):. PubMed ID: 35056263 [TBL] [Abstract][Full Text] [Related]
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