These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

116 related articles for article (PubMed ID: 36191523)

  • 1. Effect of sodium thiazolinyl dithiopropane sulphonate (SH110) addition on electroplating nanotwinned copper films and their filling performance of fine-pitch redistributed layer (RDL).
    Huang J; Gao LY; Peng ZJ; Li Z; Liu ZQ; Sun R
    Nanotechnology; 2022 Oct; 34(1):. PubMed ID: 36191523
    [TBL] [Abstract][Full Text] [Related]  

  • 2. Experiment and simulation of single inhibitor SH110 for void-free TSV copper filling.
    Wang F; Le Y
    Sci Rep; 2021 Jun; 11(1):12108. PubMed ID: 34103562
    [TBL] [Abstract][Full Text] [Related]  

  • 3. Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing.
    Lai JY; Tran DP; Yang SC; Tseng IH; Shie KC; Leu J; Chen C
    Nanomaterials (Basel); 2023 Feb; 13(4):. PubMed ID: 36839077
    [TBL] [Abstract][Full Text] [Related]  

  • 4. Effect of Cu Ion Concentration on Microstructures and Mechanical Properties of Nanotwinned Cu Foils Fabricated by Rotary Electroplating.
    Hung YW; Tran DP; Chen C
    Nanomaterials (Basel); 2021 Aug; 11(8):. PubMed ID: 34443965
    [TBL] [Abstract][Full Text] [Related]  

  • 5. Tensile Properties of <111>-Oriented Nanotwinned Cu with Different Columnar Grain Structures.
    Li YJ; Tu KN; Chen C
    Materials (Basel); 2020 Mar; 13(6):. PubMed ID: 32183126
    [TBL] [Abstract][Full Text] [Related]  

  • 6. Anisotropic Grain Growth in (111) Nanotwinned Cu Films by DC Electrodeposition.
    Lu TL; Shen YA; Wu JA; Chen C
    Materials (Basel); 2019 Dec; 13(1):. PubMed ID: 31905613
    [TBL] [Abstract][Full Text] [Related]  

  • 7. Effects of substrate bias on the sputtering of high density (111)-nanotwinned Cu films on SiC chips.
    Yang ZH; Wu PC; Chuang TH
    Sci Rep; 2022 Sep; 12(1):15408. PubMed ID: 36104444
    [TBL] [Abstract][Full Text] [Related]  

  • 8. Investigations of the electrochemical performance and filling effects of additives on electroplating process of TSV.
    Wu H; Wang Y; Li Z; Zhu W
    Sci Rep; 2020 Jun; 10(1):9204. PubMed ID: 32514129
    [TBL] [Abstract][Full Text] [Related]  

  • 9. Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films.
    Lin PF; Tran DP; Liu HC; Li YY; Chen C
    Materials (Basel); 2022 Jan; 15(3):. PubMed ID: 35160883
    [TBL] [Abstract][Full Text] [Related]  

  • 10. Copolymer of Pyrrole and 1,4-Butanediol Diglycidyl as an Efficient Additive Leveler for Through-Hole Copper Electroplating.
    Li J; Zhou G; Hong Y; Wang C; He W; Wang S; Chen Y; Wen Z; Wang Q
    ACS Omega; 2020 Mar; 5(10):4868-4874. PubMed ID: 32201772
    [TBL] [Abstract][Full Text] [Related]  

  • 11. Deformation mechanisms in nanotwinned metal nanopillars.
    Jang D; Li X; Gao H; Greer JR
    Nat Nanotechnol; 2012 Sep; 7(9):594-601. PubMed ID: 22796745
    [TBL] [Abstract][Full Text] [Related]  

  • 12. In situ observation of nanotwins formation through twin terrace growth in pulse electrodeposited Cu films.
    Cheng G; Li H; Xu G; Gai W; Luo L
    Sci Rep; 2017 Sep; 7(1):12393. PubMed ID: 28963542
    [TBL] [Abstract][Full Text] [Related]  

  • 13. 1-(4-Hydroxyphenyl)-2
    Teng X; Tao Z; Long Z; Liu G; Tao X
    RSC Adv; 2022 May; 12(25):16153-16164. PubMed ID: 35733656
    [TBL] [Abstract][Full Text] [Related]  

  • 14. Bottom-Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via.
    Sun FL; Liu ZQ; Li CF; Zhu QS; Zhang H; Suganuma K
    Materials (Basel); 2018 Feb; 11(2):. PubMed ID: 29473865
    [TBL] [Abstract][Full Text] [Related]  

  • 15. The effects of ultrasonic agitation on supercritical CO
    Chuang HC; Yang HM; Wu GL; Sánchez J; Shyu JH
    Ultrason Sonochem; 2018 Jan; 40(Pt A):147-156. PubMed ID: 28946408
    [TBL] [Abstract][Full Text] [Related]  

  • 16. Promotion of High-Speed Copper-Filling Performance for Interconnections with Increasing Aspect-Ratio Using Compound Additives.
    Wang Q; Peng Y; Mou Y; Chen M
    Micromachines (Basel); 2022 Sep; 13(9):. PubMed ID: 36144162
    [TBL] [Abstract][Full Text] [Related]  

  • 17. Effect of grain orientations of Cu seed layers on the growth of <111>-oriented nanotwinned Cu.
    Liu CM; Lin HW; Lu CL; Chen C
    Sci Rep; 2014 Aug; 4():6123. PubMed ID: 25134840
    [TBL] [Abstract][Full Text] [Related]  

  • 18. Localized Pulsed Electrodeposition Process for Three-Dimensional Printing of Nanotwinned Metallic Nanostructures.
    Daryadel S; Behroozfar A; Morsali SR; Moreno S; Baniasadi M; Bykova J; Bernal RA; Minary-Jolandan M
    Nano Lett; 2018 Jan; 18(1):208-214. PubMed ID: 29257699
    [TBL] [Abstract][Full Text] [Related]  

  • 19. Synthesis of Quaternary Ammonium Salts Based on Diketopyrrolopyrroles Skeletons and Their Applications in Copper Electroplating.
    Chen B; Xu J; Wang L; Song L; Wu S
    ACS Appl Mater Interfaces; 2017 Mar; 9(8):7793-7803. PubMed ID: 28139918
    [TBL] [Abstract][Full Text] [Related]  

  • 20. Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct Bonding.
    Wu JA; Huang CY; Wu WW; Chen C
    Materials (Basel); 2018 Nov; 11(11):. PubMed ID: 30445699
    [TBL] [Abstract][Full Text] [Related]  

    [Next]    [New Search]
    of 6.