These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

177 related articles for article (PubMed ID: 36295411)

  • 1. Laser-Assisted Micro-Solder Bumping for Copper and Nickel-Gold Pad Finish.
    Kousar S; Hansen K; Keller TF
    Materials (Basel); 2022 Oct; 15(20):. PubMed ID: 36295411
    [TBL] [Abstract][Full Text] [Related]  

  • 2. Solid-phase transient soldering method based on Au/Ni-W multilayer thin-film-modified copper-based structures.
    Xiao J; Zhai Q; Luo J
    Heliyon; 2024 Jun; 10(12):e33071. PubMed ID: 38988553
    [TBL] [Abstract][Full Text] [Related]  

  • 3. Novel First-Level Interconnect Techniques for Flip Chip on MEMS Devices.
    Sutanto J; Anand S; Patel C; Muthuswamy J
    J Microelectromech Syst; 2011 Nov; 21(1):132-144. PubMed ID: 24504168
    [TBL] [Abstract][Full Text] [Related]  

  • 4. Effects of Multiple Reflow on the Formation of Primary Crystals in Sn-3.5Ag and Solder Joint Strength: Experimental and Finite Element Analysis.
    Amli SFM; Salleh MAAM; Aziz MSA; Yasuda H; Nogita K; Abdullah MMAB; Nemes O; Sandu AV; Vizureanu P
    Materials (Basel); 2023 Jun; 16(12):. PubMed ID: 37374543
    [TBL] [Abstract][Full Text] [Related]  

  • 5. Low-Resistance Room-Temperature Interconnection Technique for Bonding Fine Pitch Bumps.
    Roustaie F; Quednau S; Weißenborn F; Birlem O
    J Mater Eng Perform; 2021; 30(5):3173-3177. PubMed ID: 33776387
    [TBL] [Abstract][Full Text] [Related]  

  • 6. Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints.
    Dušek K; Veselý P; Bušek D; Petráč A; Géczy A; Illés B; Krammer O
    Materials (Basel); 2021 Dec; 14(24):. PubMed ID: 34947502
    [TBL] [Abstract][Full Text] [Related]  

  • 7. The Effect of Micro-Alloying and Surface Finishes on the Thermal Cycling Reliability of Doped SAC Solder Alloys.
    Akkara FJ; Hamasha S; Alahmer A; Evans J; Belhadi MEA; Wei X
    Materials (Basel); 2022 Sep; 15(19):. PubMed ID: 36234099
    [TBL] [Abstract][Full Text] [Related]  

  • 8. Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low Temperature.
    He S; Jiang J; Shen YA; Mo L; Bi Y; Wu J; Guo C
    Materials (Basel); 2024 Feb; 17(5):. PubMed ID: 38473526
    [TBL] [Abstract][Full Text] [Related]  

  • 9. Microstructure Evolution and Shear Strength of the Cu/Au80Sn20/Cu Solder Joints with Multiple Reflow Temperatures.
    Chen C; Sun M; Cheng Z; Liang Y
    Materials (Basel); 2022 Jan; 15(3):. PubMed ID: 35160725
    [TBL] [Abstract][Full Text] [Related]  

  • 10. Effect of Epoxy on Mechanical Property of SAC305 Solder Joint with Various Surface Finishes Under 3-Point Bend Test.
    Jeong H; Myung WR; Sung YG; Kim KY; Jung SB
    J Nanosci Nanotechnol; 2018 Sep; 18(9):6316-6320. PubMed ID: 29677789
    [TBL] [Abstract][Full Text] [Related]  

  • 11. Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing.
    Zaimi NSM; Salleh MAAM; Sandu AV; Abdullah MMAB; Saud N; Rahim SZA; Vizureanu P; Said RM; Ramli MII
    Materials (Basel); 2021 Feb; 14(4):. PubMed ID: 33562200
    [TBL] [Abstract][Full Text] [Related]  

  • 12. Patterning Ag nanoparticles by selective wetting for fine size Cu-Ag-Cu bonding.
    Liang Q; Li J; Li T; Liao G; Tang Z; Shi T
    Nanotechnology; 2020 Aug; 31(35):355302. PubMed ID: 32422626
    [TBL] [Abstract][Full Text] [Related]  

  • 13. Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow.
    Zaimi NSM; Salleh MAAM; Abdullah MMA; Nadzri NIM; Sandu AV; Vizureanu P; Ramli MII; Nogita K; Yasuda H; Sandu IG
    Materials (Basel); 2022 Apr; 15(8):. PubMed ID: 35454450
    [TBL] [Abstract][Full Text] [Related]  

  • 14. Low-Temperature Copper Bonding Strategy with Graphene Interlayer.
    Wang H; Leong WS; Hu F; Ju L; Su C; Guo Y; Li J; Li M; Hu A; Kong J
    ACS Nano; 2018 Mar; 12(3):2395-2402. PubMed ID: 29370518
    [TBL] [Abstract][Full Text] [Related]  

  • 15. Laser-induced forward transfer for flip-chip packaging of single dies.
    Kaur KS; Van Steenberge G
    J Vis Exp; 2015 Mar; (97):. PubMed ID: 25867627
    [TBL] [Abstract][Full Text] [Related]  

  • 16. Effect of ultrasonic vibration time on the Cu/Sn-Ag-Cu/Cu joint soldered by low-power-high-frequency ultrasonic-assisted reflow soldering.
    Tan AT; Tan AW; Yusof F
    Ultrason Sonochem; 2017 Jan; 34():616-625. PubMed ID: 27773288
    [TBL] [Abstract][Full Text] [Related]  

  • 17. Microstructure and Shear Behaviour of Sn-3.0Ag-0.5Cu Composite Solder Pastes Enhanced by Epoxy Resin.
    Zhang P; Xue S; Liu L; Wu J; Luo Q; Wang J
    Polymers (Basel); 2022 Dec; 14(23):. PubMed ID: 36501697
    [TBL] [Abstract][Full Text] [Related]  

  • 18. Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review.
    Jang YJ; Sharma A; Jung JP
    Materials (Basel); 2023 Dec; 16(24):. PubMed ID: 38138794
    [TBL] [Abstract][Full Text] [Related]  

  • 19. Effects of Cu Opening Size on the Mechanical Properties of Epoxy-Contained Sn-58Bi Solder Joints.
    Min KD; Myung WR; Kim KY; Sung YG; Jung SB
    J Nanosci Nanotechnol; 2019 Oct; 19(10):6437-6443. PubMed ID: 31026974
    [TBL] [Abstract][Full Text] [Related]  

  • 20. Effect of Ni(P) Layer Thickness on Interface Reaction and Reliability of Ultrathin ENEPIG Surface Finish.
    Chi P; Li Y; Pan H; Wang Y; Chen N; Li M; Gao L
    Materials (Basel); 2021 Dec; 14(24):. PubMed ID: 34947470
    [TBL] [Abstract][Full Text] [Related]  

    [Next]    [New Search]
    of 9.