These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

178 related articles for article (PubMed ID: 36837178)

  • 1. Effect of Graphene Nanosheets on the Microstructure and Mechanical Properties of Sn-20Bi Solder.
    Yang W; Qin W; Wu J; Feng J; Zhan Y
    Materials (Basel); 2023 Feb; 16(4):. PubMed ID: 36837178
    [TBL] [Abstract][Full Text] [Related]  

  • 2. Effect of Graphene Nanosheet Addition on the Wettability and Mechanical Properties of Sn-20Bi-xGNS/Cu Solder Joints.
    Yang W; Yang Z; Fu Y; Yu A; Feng J; Zhan Y
    Materials (Basel); 2020 Sep; 13(18):. PubMed ID: 32911653
    [TBL] [Abstract][Full Text] [Related]  

  • 3. Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys.
    Yang W; Li J; Li Y; Feng J; Wu J; Zhou X; Yu A; Wang J; Liang S; Wei M; Zhan Y
    Materials (Basel); 2019 Apr; 12(7):. PubMed ID: 30979091
    [TBL] [Abstract][Full Text] [Related]  

  • 4. Microstructures and Properties of Sn2.5Ag0.7Cu0.1RE Composite Solders Reinforced with Cu-Coated Graphene Nanosheets Synthesized by Pyrolysis.
    Zhang M; Zhang KK; Huo FP; Wang HG; Wang Y
    Materials (Basel); 2019 Jan; 12(2):. PubMed ID: 30658465
    [TBL] [Abstract][Full Text] [Related]  

  • 5. Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model.
    Qiu J; Peng Y; Gao P; Li C
    Materials (Basel); 2021 Apr; 14(9):. PubMed ID: 33946308
    [TBL] [Abstract][Full Text] [Related]  

  • 6. Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints.
    Wang F; Huang Y; Zhang Z; Yan C
    Materials (Basel); 2017 Aug; 10(8):. PubMed ID: 28792440
    [TBL] [Abstract][Full Text] [Related]  

  • 7. The Role of Intermetallic Compounds in Controlling the Microstructural, Physical and Mechanical Properties of Cu-[Sn-Ag-Cu-Bi]-Cu Solder Joints.
    Sayyadi R; Naffakh-Moosavy H
    Sci Rep; 2019 Jun; 9(1):8389. PubMed ID: 31182784
    [TBL] [Abstract][Full Text] [Related]  

  • 8. Effects of Yttrium Addition on the Microstructure Evolution and Electrochemical Corrosion of SN-9Zn Lead-Free Solders Alloy.
    Yang W; Mao J; Ma Y; Yu S; He H; Qi D; Zhan Y
    Materials (Basel); 2021 May; 14(10):. PubMed ID: 34068956
    [TBL] [Abstract][Full Text] [Related]  

  • 9. Reliability Risk Mitigation in Advanced Packages by Aging-Induced Precipitation of Bi in Water-Quenched Sn-Ag-Cu-Bi Solder.
    Shukla V; Ahmed O; Su P; Jiang T
    Materials (Basel); 2024 Jul; 17(14):. PubMed ID: 39063894
    [TBL] [Abstract][Full Text] [Related]  

  • 10. Effect of electromigration on microstructure and properties of CeO
    Chen W; Zhang K; Fan Y; Zhang C; Wang N
    Sci Rep; 2024 Jul; 14(1):15693. PubMed ID: 38977834
    [TBL] [Abstract][Full Text] [Related]  

  • 11. Ultrasonic-Assisted Dispersion of ZnO Nanoparticles to Sn-Bi Solder: A Study on Microstructure, Spreading, and Mechanical Properties.
    Rajendran SH; Kang H; Jung JP
    J Mater Eng Perform; 2021; 30(5):3167-3172. PubMed ID: 33589857
    [TBL] [Abstract][Full Text] [Related]  

  • 12. Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing.
    Ramli MII; Salleh MAAM; Sandu AV; Amli SFM; Said RM; Saud N; Abdullah MMAB; Vizureanu P; Rylski A; Chaiprapa J; Nabialek M
    Materials (Basel); 2021 Sep; 14(18):. PubMed ID: 34576358
    [TBL] [Abstract][Full Text] [Related]  

  • 13. Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints.
    Zhang C; Zhang K; Gao Y; Wang Y
    Materials (Basel); 2023 Mar; 16(7):. PubMed ID: 37048920
    [TBL] [Abstract][Full Text] [Related]  

  • 14. Solid-phase transient soldering method based on Au/Ni-W multilayer thin-film-modified copper-based structures.
    Xiao J; Zhai Q; Luo J
    Heliyon; 2024 Jun; 10(12):e33071. PubMed ID: 38988553
    [TBL] [Abstract][Full Text] [Related]  

  • 15. Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder.
    Yang F; Zhang L; Liu ZQ; Zhong SJ; Ma J; Bao L
    Materials (Basel); 2017 May; 10(5):. PubMed ID: 28772917
    [TBL] [Abstract][Full Text] [Related]  

  • 16. Effect of Bi, Sb, and Ti on Microstructure and Mechanical Properties of SAC105 Alloys.
    Yang T; Chen Y; You K; Dong Z; Jia Y; Wang G; Peng J; Cai S; Luo X; Liu C; Wang J
    Materials (Basel); 2022 Jul; 15(14):. PubMed ID: 35888194
    [TBL] [Abstract][Full Text] [Related]  

  • 17. Microstructure evolution and grain refinement of ultrasonic-assisted soldering joint by using Ni foam reinforced Sn composite solder.
    He H; Song L; Gao H; Xiao Y; Cao Y
    Ultrason Sonochem; 2023 Jan; 92():106244. PubMed ID: 36508893
    [TBL] [Abstract][Full Text] [Related]  

  • 18. The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-
    Li C; Yan Y; Gao T; Xu G
    Materials (Basel); 2020 Oct; 13(19):. PubMed ID: 33036405
    [TBL] [Abstract][Full Text] [Related]  

  • 19. Application of ZnO Nanoparticles in Sn99Ag0.3Cu0.7-Based Composite Solder Alloys.
    Skwarek A; Krammer O; Hurtony T; Ptak P; Górecki K; Wroński S; Straubinger D; Witek K; Illés B
    Nanomaterials (Basel); 2021 Jun; 11(6):. PubMed ID: 34208099
    [TBL] [Abstract][Full Text] [Related]  

  • 20. Characterization of Sn-Sb-Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu-SiC Metal-Ceramic Composite.
    Kolenak R; Kostolny I; Drapala J; Babincova P; Pasak M
    Materials (Basel); 2021 Oct; 14(21):. PubMed ID: 34771894
    [TBL] [Abstract][Full Text] [Related]  

    [Next]    [New Search]
    of 9.