These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

135 related articles for article (PubMed ID: 36838141)

  • 1. An All-Silicon Resonant Pressure Microsensor Based on Eutectic Bonding.
    Chen S; Qin J; Lu Y; Xie B; Wang J; Chen D; Chen J
    Micromachines (Basel); 2023 Feb; 14(2):. PubMed ID: 36838141
    [TBL] [Abstract][Full Text] [Related]  

  • 2. A Resonant Pressure Microsensor with a Wide Pressure Measurement Range.
    Xiang C; Lu Y; Cheng C; Wang J; Chen D; Chen J
    Micromachines (Basel); 2021 Apr; 12(4):. PubMed ID: 33916030
    [TBL] [Abstract][Full Text] [Related]  

  • 3. A Resonant Pressure Microsensor with Temperature Compensation Method Based on Differential Outputs and a Temperature Sensor.
    Xiang C; Lu Y; Yan P; Chen J; Wang J; Chen D
    Micromachines (Basel); 2020 Nov; 11(11):. PubMed ID: 33233469
    [TBL] [Abstract][Full Text] [Related]  

  • 4. A Lateral Differential Resonant Pressure Microsensor Based on SOI-Glass Wafer-Level Vacuum Packaging.
    Xie B; Xing Y; Wang Y; Chen J; Chen D; Wang J
    Sensors (Basel); 2015 Sep; 15(9):24257-68. PubMed ID: 26402679
    [TBL] [Abstract][Full Text] [Related]  

  • 5. A Resonant Pressure Microsensor with the Measurement Range of 1 MPa Based on Sensitivities Balanced Dual Resonators.
    Lu Y; Yan P; Xiang C; Chen D; Wang J; Xie B; Chen J
    Sensors (Basel); 2019 May; 19(10):. PubMed ID: 31100922
    [TBL] [Abstract][Full Text] [Related]  

  • 6. A high-Q resonant pressure microsensor with through-glass electrical interconnections based on wafer-level MEMS vacuum packaging.
    Luo Z; Chen D; Wang J; Li Y; Chen J
    Sensors (Basel); 2014 Dec; 14(12):24244-57. PubMed ID: 25521385
    [TBL] [Abstract][Full Text] [Related]  

  • 7. A Temperature-Insensitive Resonant Pressure Micro Sensor Based on Silicon-on-Glass Vacuum Packaging.
    Yan P; Lu Y; Xiang C; Wang J; Chen D; Chen J
    Sensors (Basel); 2019 Sep; 19(18):. PubMed ID: 31500306
    [TBL] [Abstract][Full Text] [Related]  

  • 8. A resonant high-pressure microsensor based on a composite pressure-sensitive mechanism of diaphragm bending and volume compression.
    Qian P; Yu Z; Yu J; Lu Y; Xie B; Chen J; Chen D; Wang J
    Microsyst Nanoeng; 2024; 10():38. PubMed ID: 38495469
    [TBL] [Abstract][Full Text] [Related]  

  • 9. A Resonant Pressure Microsensor Based on Double-Ended Tuning Fork and Electrostatic Excitation/Piezoresistive Detection.
    Shi X; Lu Y; Xie B; Li Y; Wang J; Chen D; Chen J
    Sensors (Basel); 2018 Aug; 18(8):. PubMed ID: 30071610
    [TBL] [Abstract][Full Text] [Related]  

  • 10. High-Q Wafer Level Package Based on Modified Tri-Layer Anodic Bonding and High Performance Getter and Its Evaluation for Micro Resonant Pressure Sensor.
    Wang L; Du X; Wang L; Xu Z; Zhang C; Gu D
    Sensors (Basel); 2017 Mar; 17(3):. PubMed ID: 28300752
    [TBL] [Abstract][Full Text] [Related]  

  • 11. A Highly Sensitive and High-Resolution Resonant MEMS Electrostatic Field Microsensor Based on Electrostatic Stiffness Perturbation.
    Liu X; Xia S; Peng C; Gao Y; Peng S; Zhang Z; Zhang W; Xing X; Liu Y
    Micromachines (Basel); 2023 Jul; 14(8):. PubMed ID: 37630029
    [TBL] [Abstract][Full Text] [Related]  

  • 12. A Resonant Pressure Sensor Based upon Electrostatically Comb Driven and Piezoresistively Sensed Lateral Resonators.
    Shi X; Zhang S; Chen D; Wang J; Chen J; Xie B; Lu Y; Li Y
    Micromachines (Basel); 2019 Jul; 10(7):. PubMed ID: 31288381
    [TBL] [Abstract][Full Text] [Related]  

  • 13. Laterally Driven Resonant Pressure Sensor with Etched Silicon Dual Diaphragms and Combined Beams.
    Du X; Liu Y; Li A; Zhou Z; Sun D; Wang L
    Sensors (Basel); 2016 Jan; 16(2):158. PubMed ID: 26821031
    [TBL] [Abstract][Full Text] [Related]  

  • 14. Design and Analysis of a New Tuning Fork Structure for Resonant Pressure Sensor.
    Sun X; Yuan W; Qiao D; Sun M; Ren S
    Micromachines (Basel); 2016 Aug; 7(9):. PubMed ID: 30404322
    [TBL] [Abstract][Full Text] [Related]  

  • 15. Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization.
    Liu J; Xia S; Peng C; Wu Z; Chu Z; Zhang Z; Lei H; Zheng F; Zhang W
    Micromachines (Basel); 2022 Jun; 13(6):. PubMed ID: 35744542
    [TBL] [Abstract][Full Text] [Related]  

  • 16. Novel resonant pressure sensor based on piezoresistive detection and symmetrical in-plane mode vibration.
    Han X; Mao Q; Zhao L; Li X; Wang L; Yang P; Lu D; Wang Y; Yan X; Wang S; Zhu N; Jiang Z
    Microsyst Nanoeng; 2020; 6():95. PubMed ID: 34567705
    [TBL] [Abstract][Full Text] [Related]  

  • 17. A Single-Side Micromachined MPa-Scale High-Temperature Pressure Sensor.
    Li P; Li W; Chen C; Wu S; Pan P; Sun K; Liu M; Wang J; Li X
    Micromachines (Basel); 2023 Apr; 14(5):. PubMed ID: 37241606
    [TBL] [Abstract][Full Text] [Related]  

  • 18. A Sensitivity-Enhanced Vertical-Resonant MEMS Electric Field Sensor Based on TGV Technology.
    Gao Y; Peng S; Liu X; Liu Y; Zhang W; Peng C; Xia S
    Micromachines (Basel); 2024 Feb; 15(3):. PubMed ID: 38542603
    [TBL] [Abstract][Full Text] [Related]  

  • 19. Residual Stress in Lithium Niobate Film Layer of LNOI/Si Hybrid Wafer Fabricated Using Low-Temperature Bonding Method.
    Takigawa R; Tomimatsu T; Higurashi E; Asano T
    Micromachines (Basel); 2019 Feb; 10(2):. PubMed ID: 30781672
    [TBL] [Abstract][Full Text] [Related]  

  • 20. Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via.
    Zhang M; Yang J; He Y; Yang F; Yang F; Han G; Si C; Ning J
    Sensors (Basel); 2018 Dec; 19(1):. PubMed ID: 30597879
    [TBL] [Abstract][Full Text] [Related]  

    [Next]    [New Search]
    of 7.