These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.
9. Superconformal Bottom-Up Gold Deposition in High Aspect Ratio Through Silicon Vias. Josell D; Moffat TP J Electrochem Soc; 2017; 164(6):D327-D334. PubMed ID: 28729743 [TBL] [Abstract][Full Text] [Related]
10. Superconformal Film Growth: From Smoothing Surfaces to Interconnect Technology. Moffat TP; Braun TM; Raciti D; Josell D Acc Chem Res; 2023 May; 56(9):1004-1017. PubMed ID: 37076974 [TBL] [Abstract][Full Text] [Related]
11. Superconformal Bottom-Up Nickel Deposition in High Aspect Ratio Through Silicon Vias. Josell D; Moffat TP ECS Trans; 2016; 163(7):D322-D331. PubMed ID: 29503673 [TBL] [Abstract][Full Text] [Related]
12. Superconformal Copper Deposition in Through Silicon Vias by Suppression-Breakdown. Josell D; Moffat TP J Electrochem Soc; 2018; 165(2):. PubMed ID: 33041352 [TBL] [Abstract][Full Text] [Related]
13. Fabrication of X-ray Gratings for Interferometric Imaging by Conformal Seedless Gold Electroplating. Jefimovs K; Vila-Comamala J; Arboleda C; Wang Z; Romano L; Shi Z; Kagias M; Stampanoni M Micromachines (Basel); 2021 May; 12(5):. PubMed ID: 34066906 [TBL] [Abstract][Full Text] [Related]
14. Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology. Menk LA; Josell D; Moffat TP; Baca E; Blain MG; Smith A; Dominguez J; McClain J; Yeh PD; Hollowell AE J Electrochem Soc; 2018; 166(1):. PubMed ID: 33041354 [TBL] [Abstract][Full Text] [Related]
15. Superconformal Bottom-Up Cobalt Deposition in High Aspect Ratio Through Silicon Vias. Josell D; Silva M; Moffat TP ECS Trans; 2016; 75(2):25-30. PubMed ID: 28690759 [TBL] [Abstract][Full Text] [Related]
16. Simulation of Copper Electrodeposition in Through-Hole Vias. Braun TM; Josell D; John J; Moffat TP J Electrochem Soc; 2020; 167():. PubMed ID: 33223561 [TBL] [Abstract][Full Text] [Related]
17. Electrodeposition of Gold to Conformally Fill High Aspect Ratio Nanometric Silicon Grating Trenches: A Comparison of Pulsed and Direct Current Protocols. Znati SA; Chedid N; Miao H; Chen L; Bennett EE; Wen H J Surf Eng Mater Adv Technol; 2015 Oct; 5(4):207-213. PubMed ID: 27042384 [TBL] [Abstract][Full Text] [Related]
18. The Suppression Induced S-NDR Mechanism for Defect-Free Filling of High Aspect Ratio Features. Josell D; Moffat TP ECS Trans; 2016; 75(7):15-21. PubMed ID: 28690760 [TBL] [Abstract][Full Text] [Related]
19. Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon Vias. Kim SH; Lee HJ; Braun TM; Moffat TP; Josell D J Electrochem Soc; 2021; 168(11):. PubMed ID: 36936718 [TBL] [Abstract][Full Text] [Related]
20. Survey of P-Block Metal Additives for Superconformal Cu Deposition in an Alkaline Electrolyte. Josell D; Moffat TP J Electrochem Soc; 2022; 169(9):. PubMed ID: 36875632 [TBL] [Abstract][Full Text] [Related] [Next] [New Search]