These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

117 related articles for article (PubMed ID: 36848589)

  • 1. Extreme Bottom-up Gold Filling of High Aspect Ratio Features.
    Josell D; Moffat TP
    Acc Chem Res; 2023 Mar; 56(6):677-688. PubMed ID: 36848589
    [TBL] [Abstract][Full Text] [Related]  

  • 2. Bottom-Up Gold Filling in New Geometries and Yet Higher Aspect Ratio Gratings for Hard X-Ray Interferometry.
    Josell D; Shi Z; Jefimovs K; Guzenko V; Beauchamp C; Peer L; Polikarpov M; Moffat TP
    J Electrochem Soc; 2021; 168(8):. PubMed ID: 36938320
    [TBL] [Abstract][Full Text] [Related]  

  • 3. Robust Bottom-Up Gold Filling of Deep Trenches and Gratings.
    Josell D; Osborn W; Williams ME; Miao H
    J Electrochem Soc; 2022; 169(3):. PubMed ID: 36936547
    [TBL] [Abstract][Full Text] [Related]  

  • 4. Exploring the Limits of Bottom-Up Gold Filling to Fabricate Diffraction Gratings.
    Josell D; Ambrozik S; Williams ME; Hollowell AE; Arrington C; Muramoto S; Moffat TP
    J Electrochem Soc; 2019; 166(16):. PubMed ID: 33041357
    [TBL] [Abstract][Full Text] [Related]  

  • 5. Accelerated Bottom-Up Gold Filling of Metallized Trenches.
    Josell D; Williams ME; Ambrozik S; Zhang C; Moffat TP
    J Electrochem Soc; 2019; 166(12):. PubMed ID: 33041356
    [TBL] [Abstract][Full Text] [Related]  

  • 6. Bottom-up Filling of Damascene Trenches with Gold in a Sulfite Electrolyte.
    Josell D; Moffat TP
    J Electrochem Soc; 2019; 166(1):. PubMed ID: 33041353
    [TBL] [Abstract][Full Text] [Related]  

  • 7. Additives for Superconformal Gold Feature Filling.
    Josell D; Moffat TP
    J Electrochem Soc; 2021; 168(5):. PubMed ID: 36937556
    [TBL] [Abstract][Full Text] [Related]  

  • 8. Mechanism of Bismuth Stimulated Bottom-up Gold Feature Filling.
    Josell D; Braun TM; Moffat TP
    J Electrochem Soc; 2022; 169(12):. PubMed ID: 36935768
    [TBL] [Abstract][Full Text] [Related]  

  • 9. Superconformal Bottom-Up Gold Deposition in High Aspect Ratio Through Silicon Vias.
    Josell D; Moffat TP
    J Electrochem Soc; 2017; 164(6):D327-D334. PubMed ID: 28729743
    [TBL] [Abstract][Full Text] [Related]  

  • 10. Superconformal Film Growth: From Smoothing Surfaces to Interconnect Technology.
    Moffat TP; Braun TM; Raciti D; Josell D
    Acc Chem Res; 2023 May; 56(9):1004-1017. PubMed ID: 37076974
    [TBL] [Abstract][Full Text] [Related]  

  • 11. Superconformal Bottom-Up Nickel Deposition in High Aspect Ratio Through Silicon Vias.
    Josell D; Moffat TP
    ECS Trans; 2016; 163(7):D322-D331. PubMed ID: 29503673
    [TBL] [Abstract][Full Text] [Related]  

  • 12. Superconformal Copper Deposition in Through Silicon Vias by Suppression-Breakdown.
    Josell D; Moffat TP
    J Electrochem Soc; 2018; 165(2):. PubMed ID: 33041352
    [TBL] [Abstract][Full Text] [Related]  

  • 13. Fabrication of X-ray Gratings for Interferometric Imaging by Conformal Seedless Gold Electroplating.
    Jefimovs K; Vila-Comamala J; Arboleda C; Wang Z; Romano L; Shi Z; Kagias M; Stampanoni M
    Micromachines (Basel); 2021 May; 12(5):. PubMed ID: 34066906
    [TBL] [Abstract][Full Text] [Related]  

  • 14. Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology.
    Menk LA; Josell D; Moffat TP; Baca E; Blain MG; Smith A; Dominguez J; McClain J; Yeh PD; Hollowell AE
    J Electrochem Soc; 2018; 166(1):. PubMed ID: 33041354
    [TBL] [Abstract][Full Text] [Related]  

  • 15. Superconformal Bottom-Up Cobalt Deposition in High Aspect Ratio Through Silicon Vias.
    Josell D; Silva M; Moffat TP
    ECS Trans; 2016; 75(2):25-30. PubMed ID: 28690759
    [TBL] [Abstract][Full Text] [Related]  

  • 16. Simulation of Copper Electrodeposition in Through-Hole Vias.
    Braun TM; Josell D; John J; Moffat TP
    J Electrochem Soc; 2020; 167():. PubMed ID: 33223561
    [TBL] [Abstract][Full Text] [Related]  

  • 17. Electrodeposition of Gold to Conformally Fill High Aspect Ratio Nanometric Silicon Grating Trenches: A Comparison of Pulsed and Direct Current Protocols.
    Znati SA; Chedid N; Miao H; Chen L; Bennett EE; Wen H
    J Surf Eng Mater Adv Technol; 2015 Oct; 5(4):207-213. PubMed ID: 27042384
    [TBL] [Abstract][Full Text] [Related]  

  • 18. The Suppression Induced S-NDR Mechanism for Defect-Free Filling of High Aspect Ratio Features.
    Josell D; Moffat TP
    ECS Trans; 2016; 75(7):15-21. PubMed ID: 28690760
    [TBL] [Abstract][Full Text] [Related]  

  • 19. Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon Vias.
    Kim SH; Lee HJ; Braun TM; Moffat TP; Josell D
    J Electrochem Soc; 2021; 168(11):. PubMed ID: 36936718
    [TBL] [Abstract][Full Text] [Related]  

  • 20. Survey of P-Block Metal Additives for Superconformal Cu Deposition in an Alkaline Electrolyte.
    Josell D; Moffat TP
    J Electrochem Soc; 2022; 169(9):. PubMed ID: 36875632
    [TBL] [Abstract][Full Text] [Related]  

    [Next]    [New Search]
    of 6.