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12. Superconformal Bottom-Up Nickel Deposition in High Aspect Ratio Through Silicon Vias. Josell D; Moffat TP ECS Trans; 2016; 163(7):D322-D331. PubMed ID: 29503673 [TBL] [Abstract][Full Text] [Related]
13. Superconformal Copper Deposition in Through Silicon Vias by Suppression-Breakdown. Josell D; Moffat TP J Electrochem Soc; 2018; 165(2):. PubMed ID: 33041352 [TBL] [Abstract][Full Text] [Related]
14. The Suppression Induced S-NDR Mechanism for Defect-Free Filling of High Aspect Ratio Features. Josell D; Moffat TP ECS Trans; 2016; 75(7):15-21. PubMed ID: 28690760 [TBL] [Abstract][Full Text] [Related]
15. Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon Vias. Kim SH; Lee HJ; Braun TM; Moffat TP; Josell D J Electrochem Soc; 2021; 168(11):. PubMed ID: 36936718 [TBL] [Abstract][Full Text] [Related]
16. Simulation of Copper Electrodeposition in Through-Hole Vias. Braun TM; Josell D; John J; Moffat TP J Electrochem Soc; 2020; 167():. PubMed ID: 33223561 [TBL] [Abstract][Full Text] [Related]
17. Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction. Braun TM; Kim SH; Lee HJ; Moffat TP; Josell D J Electrochem Soc; 2018; 165(7):. PubMed ID: 33029030 [TBL] [Abstract][Full Text] [Related]
18. The Impact of Adsorbates on Metal Deposition Through The Curvature Enhanced Accelerator Coverage Mechanism… And Beyond. Josell D; Moffat TP ECS Trans; 2018; 85(12):. PubMed ID: 33062132 [TBL] [Abstract][Full Text] [Related]
19. Superconformal Bottom-Up Cobalt Deposition in High Aspect Ratio Through Silicon Vias. Josell D; Silva M; Moffat TP ECS Trans; 2016; 75(2):25-30. PubMed ID: 28690759 [TBL] [Abstract][Full Text] [Related]
20. Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology. Menk LA; Josell D; Moffat TP; Baca E; Blain MG; Smith A; Dominguez J; McClain J; Yeh PD; Hollowell AE J Electrochem Soc; 2018; 166(1):. PubMed ID: 33041354 [TBL] [Abstract][Full Text] [Related] [Next] [New Search]