These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.
42 related articles for article (PubMed ID: 36936718)
1. Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon Vias. Kim SH; Lee HJ; Braun TM; Moffat TP; Josell D J Electrochem Soc; 2021; 168(11):. PubMed ID: 36936718 [TBL] [Abstract][Full Text] [Related]
13. The Impact of Organic Additives on Copper Trench Microstructure. Marro JB; Okoro CA; Obeng YS; Richardson KC J Electrochem Soc; 2017; 164(9):D543-D550. PubMed ID: 29225367 [TBL] [Abstract][Full Text] [Related]
14. Investigations of the electrochemical performance and filling effects of additives on electroplating process of TSV. Wu H; Wang Y; Li Z; Zhu W Sci Rep; 2020 Jun; 10(1):9204. PubMed ID: 32514129 [TBL] [Abstract][Full Text] [Related]
15. Dynamic through-silicon-via filling process using copper electrochemical deposition at different current densities. Wang F; Zhao Z; Nie N; Wang F; Zhu W Sci Rep; 2017 Apr; 7():46639. PubMed ID: 28422170 [TBL] [Abstract][Full Text] [Related]
16. Bottom-up Filling of Damascene Trenches with Gold in a Sulfite Electrolyte. Josell D; Moffat TP J Electrochem Soc; 2019; 166(1):. PubMed ID: 33041353 [TBL] [Abstract][Full Text] [Related]
17. The Suppression Induced S-NDR Mechanism for Defect-Free Filling of High Aspect Ratio Features. Josell D; Moffat TP ECS Trans; 2016; 75(7):15-21. PubMed ID: 28690760 [TBL] [Abstract][Full Text] [Related]
18. Robust Bottom-Up Gold Filling of Deep Trenches and Gratings. Josell D; Osborn W; Williams ME; Miao H J Electrochem Soc; 2022; 169(3):. PubMed ID: 36936547 [TBL] [Abstract][Full Text] [Related]
19. Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon Vias. Kim SH; Braun TM; Lee HJ; Moffat TP; Josell D J Electrochem Soc; 2022; 169(3):. PubMed ID: 36936546 [TBL] [Abstract][Full Text] [Related]