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2. Extreme Bottom-up Gold Filling of High Aspect Ratio Features. Josell D; Moffat TP Acc Chem Res; 2023 Mar; 56(6):677-688. PubMed ID: 36848589 [TBL] [Abstract][Full Text] [Related]
3. Bottom-up Filling of Damascene Trenches with Gold in a Sulfite Electrolyte. Josell D; Moffat TP J Electrochem Soc; 2019; 166(1):. PubMed ID: 33041353 [TBL] [Abstract][Full Text] [Related]
4. Survey of P-Block Metal Additives for Superconformal Cu Deposition in an Alkaline Electrolyte. Josell D; Moffat TP J Electrochem Soc; 2022; 169(9):. PubMed ID: 36875632 [TBL] [Abstract][Full Text] [Related]
5. Superconformal Film Growth: From Smoothing Surfaces to Interconnect Technology. Moffat TP; Braun TM; Raciti D; Josell D Acc Chem Res; 2023 May; 56(9):1004-1017. PubMed ID: 37076974 [TBL] [Abstract][Full Text] [Related]
6. Superconformal Bottom-Up Gold Deposition in High Aspect Ratio Through Silicon Vias. Josell D; Moffat TP J Electrochem Soc; 2017; 164(6):D327-D334. PubMed ID: 28729743 [TBL] [Abstract][Full Text] [Related]
7. Exploring the Limits of Bottom-Up Gold Filling to Fabricate Diffraction Gratings. Josell D; Ambrozik S; Williams ME; Hollowell AE; Arrington C; Muramoto S; Moffat TP J Electrochem Soc; 2019; 166(16):. PubMed ID: 33041357 [TBL] [Abstract][Full Text] [Related]
8. Bottom-Up Gold Filling in New Geometries and Yet Higher Aspect Ratio Gratings for Hard X-Ray Interferometry. Josell D; Shi Z; Jefimovs K; Guzenko V; Beauchamp C; Peer L; Polikarpov M; Moffat TP J Electrochem Soc; 2021; 168(8):. PubMed ID: 36938320 [TBL] [Abstract][Full Text] [Related]
11. Robust Bottom-Up Gold Filling of Deep Trenches and Gratings. Josell D; Osborn W; Williams ME; Miao H J Electrochem Soc; 2022; 169(3):. PubMed ID: 36936547 [TBL] [Abstract][Full Text] [Related]
12. Superconformal Copper Deposition in Through Silicon Vias by Suppression-Breakdown. Josell D; Moffat TP J Electrochem Soc; 2018; 165(2):. PubMed ID: 33041352 [TBL] [Abstract][Full Text] [Related]
13. Superconformal Bottom-Up Nickel Deposition in High Aspect Ratio Through Silicon Vias. Josell D; Moffat TP ECS Trans; 2016; 163(7):D322-D331. PubMed ID: 29503673 [TBL] [Abstract][Full Text] [Related]
14. Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction. Braun TM; Kim SH; Lee HJ; Moffat TP; Josell D J Electrochem Soc; 2018; 165(7):. PubMed ID: 33029030 [TBL] [Abstract][Full Text] [Related]
15. Effect of Chloride Concentration on Copper Deposition in Through Silicon Vias. Braun TM; Josell D; Silva M; Kildon J; Moffat TP J Electrochem Soc; 2019; 166(1):. PubMed ID: 33029031 [TBL] [Abstract][Full Text] [Related]
16. The Impact of Adsorbates on Metal Deposition Through The Curvature Enhanced Accelerator Coverage Mechanism… And Beyond. Josell D; Moffat TP ECS Trans; 2018; 85(12):. PubMed ID: 33062132 [TBL] [Abstract][Full Text] [Related]
17. The Suppression Induced S-NDR Mechanism for Defect-Free Filling of High Aspect Ratio Features. Josell D; Moffat TP ECS Trans; 2016; 75(7):15-21. PubMed ID: 28690760 [TBL] [Abstract][Full Text] [Related]