140 related articles for article (PubMed ID: 37421079)
21. Large-Area Nanopatterning Based on Field Alignment by the Microscale Metal Mask for the Etching Process.
Lee J; Lee JY; Yeo JS
ACS Appl Mater Interfaces; 2019 Oct; 11(39):36177-36185. PubMed ID: 31495170
[TBL] [Abstract][Full Text] [Related]
22. The Method of Low-Temperature ICP Etching of InP/InGaAsP Heterostructures in Cl
Ishutkin S; Arykov V; Yunusov I; Stepanenko M; Smirnov V; Troyan P; Zhidik Y
Micromachines (Basel); 2021 Dec; 12(12):. PubMed ID: 34945385
[TBL] [Abstract][Full Text] [Related]
23. High aspect ratio sub-15 nm silicon trenches from block copolymer templates.
Gu X; Liu Z; Gunkel I; Chourou ST; Hong SW; Olynick DL; Russell TP
Adv Mater; 2012 Nov; 24(42):5688-94. PubMed ID: 22903820
[TBL] [Abstract][Full Text] [Related]
24. "In situ" hard mask materials: a new methodology for creation of vertical silicon nanopillar and nanowire arrays.
Ghoshal T; Senthamaraikannan R; Shaw MT; Holmes JD; Morris MA
Nanoscale; 2012 Dec; 4(24):7743-50. PubMed ID: 23138854
[TBL] [Abstract][Full Text] [Related]
25. Super-selective cryogenic etching for sub-10 nm features.
Liu Z; Wu Y; Harteneck B; Olynick D
Nanotechnology; 2013 Jan; 24(1):015305. PubMed ID: 23220824
[TBL] [Abstract][Full Text] [Related]
26. High-aspect-ratio nanoimprint process chains.
Cadarso VJ; Chidambaram N; Jacot-Descombes L; Schift H
Microsyst Nanoeng; 2017; 3():17017. PubMed ID: 31057864
[TBL] [Abstract][Full Text] [Related]
27. Self-Controlled Cleaving Method for Silicon DRIE Process Cross-Section Characterization.
Baklykov DA; Andronic M; Sorokina OS; Avdeev SS; Buzaverov KA; Ryzhikov IA; Rodionov IA
Micromachines (Basel); 2021 May; 12(5):. PubMed ID: 34066851
[TBL] [Abstract][Full Text] [Related]
28. Low-loss one-dimensional photonic bandgap filter in (110) silicon.
Lipson A; Yeatman EM
Opt Lett; 2006 Feb; 31(3):395-7. PubMed ID: 16480220
[TBL] [Abstract][Full Text] [Related]
29. Selective etching of focused gallium ion beam implanted regions from silicon as a nanofabrication method.
Han Z; Vehkamäki M; Mattinen M; Salmi E; Mizohata K; Leskelä M; Ritala M
Nanotechnology; 2015 Jul; 26(26):265304. PubMed ID: 26062985
[TBL] [Abstract][Full Text] [Related]
30. Room temperature continuous-wave green lasing from an InGaN microdisk on silicon.
Athanasiou M; Smith R; Liu B; Wang T
Sci Rep; 2014 Nov; 4():7250. PubMed ID: 25431166
[TBL] [Abstract][Full Text] [Related]
31. Silicon dioxide mask by plasma enhanced atomic layer deposition in focused ion beam lithography.
Liu Z; Shah A; Alasaarela T; Chekurov N; Savin H; Tittonen I
Nanotechnology; 2017 Feb; 28(8):085303. PubMed ID: 28045005
[TBL] [Abstract][Full Text] [Related]
32. Deep Reactive Ion Etching of Z-Cut Alpha Quartz for MEMS Resonant Devices Fabrication.
Li B; Li C; Zhao Y; Han C; Zhang Q
Micromachines (Basel); 2020 Jul; 11(8):. PubMed ID: 32722536
[TBL] [Abstract][Full Text] [Related]
33. High-temperature etching of SiC in SF
Osipov AA; Iankevich GA; Speshilova AB; Osipov AA; Endiiarova EV; Berezenko VI; Tyurikova IA; Tyurikov KS; Alexandrov SE
Sci Rep; 2020 Nov; 10(1):19977. PubMed ID: 33203949
[TBL] [Abstract][Full Text] [Related]
34. An Ultra-High-Q Lithium Niobate Microresonator Integrated with a Silicon Nitride Waveguide in the Vertical Configuration for Evanescent Light Coupling.
Zhang J; Wu R; Wang M; Liang Y; Zhou J; Wu M; Fang Z; Chu W; Cheng Y
Micromachines (Basel); 2021 Feb; 12(3):. PubMed ID: 33669092
[TBL] [Abstract][Full Text] [Related]
35. Iridium-coated micropore x-ray optics using dry etching of a silicon wafer and atomic layer deposition.
Ogawa T; Ezoe Y; Moriyama T; Mitsuishi I; Kakiuchi T; Ohashi T; Mitsuda K; Putkonen M
Appl Opt; 2013 Aug; 52(24):5949-56. PubMed ID: 24084996
[TBL] [Abstract][Full Text] [Related]
36. Atmospheric Gas-Phase Catalyst Etching of SiO
Sano KH; Ono Y; Tobinaga R; Imamura Y; Hayashi Y; Yanagitani T
ACS Appl Mater Interfaces; 2024 May; 16(17):22657-22664. PubMed ID: 38651281
[TBL] [Abstract][Full Text] [Related]
37. Lithium niobate ridged waveguides with smooth vertical sidewalls fabricated by an ultra-precision cutting method.
Takigawa R; Higurashi E; Kawanishi T; Asano T
Opt Express; 2014 Nov; 22(22):27733-8. PubMed ID: 25401917
[TBL] [Abstract][Full Text] [Related]
38. Pulsed transfer etching of PS-PDMS block copolymers self-assembled in 193 nm lithography stacks.
Girardot C; Böhme S; Archambault S; Salaün M; Latu-Romain E; Cunge G; Joubert O; Zelsmann M
ACS Appl Mater Interfaces; 2014 Sep; 6(18):16276-82. PubMed ID: 25111901
[TBL] [Abstract][Full Text] [Related]
39. Method for Keyhole-Free High-Aspect-Ratio Trench Refill by LPCVD.
Veltkamp HW; Janssens YL; de Boer MJ; Zhao Y; Wiegerink RJ; Tas NR; Lötters JC
Micromachines (Basel); 2022 Nov; 13(11):. PubMed ID: 36363929
[TBL] [Abstract][Full Text] [Related]
40. The Effect of the Anisotropy of Single Crystal Silicon on the Frequency Split of Vibrating Ring Gyroscopes.
Qin Z; Gao Y; Jia J; Ding X; Huang L; Li H
Micromachines (Basel); 2019 Feb; 10(2):. PubMed ID: 30769895
[TBL] [Abstract][Full Text] [Related]
[Previous] [Next] [New Search]