These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

151 related articles for article (PubMed ID: 37724457)

  • 1. Tribochemical mechanisms of abrasives for SiC and sapphire substrates in nanoscale polishing.
    Luo Q; Lu J; Jiang F; Lin J; Tian Z
    Nanoscale; 2023 Oct; 15(38):15675-15685. PubMed ID: 37724457
    [TBL] [Abstract][Full Text] [Related]  

  • 2. Preparation of Fe-doped colloidal SiO(2) abrasives and their chemical mechanical polishing behavior on sapphire substrates.
    Lei H; Gu Q; Chen R; Wang Z
    Appl Opt; 2015 Aug; 54(24):7188-94. PubMed ID: 26368752
    [TBL] [Abstract][Full Text] [Related]  

  • 3. Polishing Performance and Removal Mechanism of Core-Shell Structured Diamond/SiO
    Zhao G; Xu Y; Wang Q; Liu J; Zhan Y; Chen B
    Micromachines (Basel); 2022 Dec; 13(12):. PubMed ID: 36557459
    [TBL] [Abstract][Full Text] [Related]  

  • 4. Super fine cerium hydroxide abrasives for SiO
    Son YH; Jeong GP; Kim PS; Han MH; Hong SW; Bae JY; Kim SI; Park JH; Park JG
    Sci Rep; 2021 Sep; 11(1):17736. PubMed ID: 34489499
    [TBL] [Abstract][Full Text] [Related]  

  • 5. Research on the Preparation and Application of Fixed-Abrasive Tools Based on Solid-Phase Reactions for Sapphire Wafer Lapping and Polishing.
    Cao L; Zhou X; Wang Y; Yang Z; Chen D; Wei W; Wang K
    Micromachines (Basel); 2023 Sep; 14(9):. PubMed ID: 37763959
    [TBL] [Abstract][Full Text] [Related]  

  • 6. Characterization of Ceria Nanoparticles as Abrasives Applied with Defoaming Polymers for CMP (Chemical Mechanical Polishing) Applications.
    Hwang S; Kim W
    Polymers (Basel); 2024 Mar; 16(6):. PubMed ID: 38543450
    [TBL] [Abstract][Full Text] [Related]  

  • 7. Polishing Mechanism of CMP 4H-SiC Crystal Substrate (0001) Si Surface Based on an Alumina (
    Gong J; Wang W; Liu W; Song Z
    Materials (Basel); 2024 Jan; 17(3):. PubMed ID: 38591510
    [TBL] [Abstract][Full Text] [Related]  

  • 8. Green chemical mechanical polishing of sapphire wafers using a novel slurry.
    Xie W; Zhang Z; Liao L; Liu J; Su H; Wang S; Guo D
    Nanoscale; 2020 Nov; 12(44):22518-22526. PubMed ID: 32996521
    [TBL] [Abstract][Full Text] [Related]  

  • 9. Polymer Nanoparticles Applied in the CMP (Chemical Mechanical Polishing) Process of Chip Wafers for Defect Improvement and Polishing Removal Rate Response.
    Chiu WL; Huang CI
    Polymers (Basel); 2023 Jul; 15(15):. PubMed ID: 37571091
    [TBL] [Abstract][Full Text] [Related]  

  • 10. The Effects of Precursors on the Morphology and Chemical Mechanical Polishing Performance of Ceria-Based Abrasives.
    Zheng Y; Wang N; Feng Z; Tan X; Zhang Z; Han H; Huang X
    Materials (Basel); 2022 Oct; 15(21):. PubMed ID: 36363118
    [TBL] [Abstract][Full Text] [Related]  

  • 11. Insight into Polishing Slurry and Material Removal Mechanism of Photoassisted Chemical Mechanical Polishing of YAG Crystals.
    Zhang X; Guo X; Wang H; Kang R; Gao S
    Langmuir; 2023 Sep; 39(38):13668-13677. PubMed ID: 37699563
    [TBL] [Abstract][Full Text] [Related]  

  • 12. Investigation on the Basic Characteristics of Semi-Fixed Abrasive Grains Polishing Technique for Polishing Sapphire (α-Al
    Lei Y; Feng M; Wu K; Chen J; Ji J; Yuan J
    Materials (Basel); 2022 Jun; 15(11):. PubMed ID: 35683293
    [TBL] [Abstract][Full Text] [Related]  

  • 13. Understanding the Mechanisms of SiC-Water Reaction during Nanoscale Scratching without Chemical Reagents.
    Cheng Z; Luo Q; Lu J; Tian Z
    Micromachines (Basel); 2022 Jun; 13(6):. PubMed ID: 35744544
    [TBL] [Abstract][Full Text] [Related]  

  • 14. A novel atomic removal model for chemical mechanical polishing using developed mesoporous shell/core abrasives based on molecular dynamics.
    Liu Z; Zhang Z; Feng J; Yi X; Shi C; Gu Y; Zhao F; Liu S; Li J
    Nanoscale; 2023 Dec; 16(1):85-96. PubMed ID: 38050711
    [TBL] [Abstract][Full Text] [Related]  

  • 15. Experimental Study on the Effects of Alumina Abrasive Particle Behavior in MR Polishing for MEMS Applications.
    Kim DW; Cho MW; Seo TI; Shin YJ
    Sensors (Basel); 2008 Jan; 8(1):222-235. PubMed ID: 27879705
    [TBL] [Abstract][Full Text] [Related]  

  • 16. Study on the Mechanism of Solid-Phase Oxidant Action in Tribochemical Mechanical Polishing of SiC Single Crystal Substrate.
    Qi W; Cao X; Xiao W; Wang Z; Su J
    Micromachines (Basel); 2021 Dec; 12(12):. PubMed ID: 34945397
    [TBL] [Abstract][Full Text] [Related]  

  • 17. Acceleration mechanism of abrasive particle in ultrasonic polishing under synergistic physical vibration and cavitation: Numerical study.
    Chen X; Xu S; Ignacio Ahuir-Torres J; Wang Z; Chen X; Yu T; Zhao J
    Ultrason Sonochem; 2023 Dec; 101():106713. PubMed ID: 38056086
    [TBL] [Abstract][Full Text] [Related]  

  • 18. A Systematic Study of the Factors Affecting the Surface Quality of Chemically Vapor-Deposited Diamond during Chemical and Mechanical Polishing.
    Yuan Z; Cheng Z; Feng Y
    Micromachines (Basel); 2024 Mar; 15(4):. PubMed ID: 38675270
    [TBL] [Abstract][Full Text] [Related]  

  • 19. Recent Advances In Silicon Carbide Chemical Mechanical Polishing Technologies.
    Hsieh CH; Chang CY; Hsiao YK; Chen CA; Tu CC; Kuo HC
    Micromachines (Basel); 2022 Oct; 13(10):. PubMed ID: 36296105
    [TBL] [Abstract][Full Text] [Related]  

  • 20. Piezocatalysis for Chemical-Mechanical Polishing of SiC: Dual Roles of t-BaTiO
    Hu T; Feng J; Yan W; Tian S; Sun J; Liu X; Wei D; Wang Z; Yu Y; Lam JC; Liu S; Wang ZL; Xiong Y
    Small; 2024 May; 20(21):e2310117. PubMed ID: 38155494
    [TBL] [Abstract][Full Text] [Related]  

    [Next]    [New Search]
    of 8.