136 related articles for article (PubMed ID: 37763823)
1. Influence of Diamond Wire Saw Processing Parameters on the Sawn Surface Characteristics of Silicon Nitride Ceramics.
Zhang S; Gao Y; Zhang X; Guo Y
Micromachines (Basel); 2023 Aug; 14(9):. PubMed ID: 37763823
[TBL] [Abstract][Full Text] [Related]
2. Wire Bow In Situ Measurement for Monitoring the Evolution of Sawing Capability of Diamond Wire Saw during Slicing Sapphire.
Yang Z; Huang H; Liao X; Lai Z; Xu Z; Zhao Y
Materials (Basel); 2024 May; 17(9):. PubMed ID: 38730940
[TBL] [Abstract][Full Text] [Related]
3. Prediction of Subsurface Microcrack Damage Depth Based on Surface Roughness in Diamond Wire Sawing of Monocrystalline Silicon.
Wang K; Gao Y; Yang C
Materials (Basel); 2024 Jan; 17(3):. PubMed ID: 38591417
[TBL] [Abstract][Full Text] [Related]
4. Experimental and Theoretical Investigations on Diamond Wire Sawing for a NdFeB Magnet.
Liu J; Zhang Z; Wan S; Wu B; Feng J; Zhang T; Zhou C
Materials (Basel); 2022 Apr; 15(9):. PubMed ID: 35591369
[TBL] [Abstract][Full Text] [Related]
5. Sawing Force Prediction Model and Experimental Study on Vibration-Assisted Diamond Wire Sawing.
Zhang C; Dong Z; Zhao Y; Liu Z; Wu S; Yang J
Micromachines (Basel); 2022 Nov; 13(11):. PubMed ID: 36422455
[TBL] [Abstract][Full Text] [Related]
6. The Influence of Wire Speed on Phase Transitions and Residual Stress in Single Crystal Silicon Wafers Sawn by Resin Bonded Diamond Wire Saw.
Liu T; Ge P; Bi W
Micromachines (Basel); 2021 Apr; 12(4):. PubMed ID: 33919757
[TBL] [Abstract][Full Text] [Related]
7. Breakage Ratio of Silicon Wafer during Fixed Diamond Wire Sawing.
Liu T; Su Y; Ge P
Micromachines (Basel); 2022 Nov; 13(11):. PubMed ID: 36363919
[TBL] [Abstract][Full Text] [Related]
8. Experimental Study on the Influence of Wire-Saw Wear on Cutting Force and Silicon Wafer Surface.
Liang L; Li S; Lan K; Yu R; Wang J; Zhao W
Materials (Basel); 2023 May; 16(10):. PubMed ID: 37241246
[TBL] [Abstract][Full Text] [Related]
9. Experiment Comparative Analysis of Feed Rate with Velocity Control in Cutting Mono Crystalline Silicon Using a Diamond Wire Saw.
Wang J; Li S; Liang L
Micromachines (Basel); 2024 Mar; 15(4):. PubMed ID: 38675284
[TBL] [Abstract][Full Text] [Related]
10. Experimental investigation of the machining characteristics in diamond wire sawing of unidirectional CFRP.
Seeholzer L; Süssmaier S; Kneubühler F; Wegener K
Int J Adv Manuf Technol; 2021; 117(7-8):2197-2212. PubMed ID: 34759439
[TBL] [Abstract][Full Text] [Related]
11. Fabrication of Ceramic Microchannels with Periodic Corrugated Microstructures as Catalyst Support for Hydrogen Production via Diamond Wire Sawing.
Li X; Gao C; Yuan D; Qin Y; Fu D; Jiang X; Zhou W
Materials (Basel); 2024 May; 17(11):. PubMed ID: 38893797
[TBL] [Abstract][Full Text] [Related]
12. Slicing Ceramics on Material Removed by a Single Abrasive Particle.
Tsai YY; Wu MC; Liao YS; Tsao CC; Hsu CY
Materials (Basel); 2020 Sep; 13(19):. PubMed ID: 32998400
[TBL] [Abstract][Full Text] [Related]
13. Surface Quality Improvement for Ultrasonic-Assisted Inner Diameter Sawing with Six-Axis Force Sensors.
Zhao J; Wang L; Jiang B; Pei Y; Lu H
Sensors (Basel); 2023 Jul; 23(14):. PubMed ID: 37514737
[TBL] [Abstract][Full Text] [Related]
14. Grain flash temperatures in diamond wire sawing of silicon.
Pala U; Süssmaier S; Wegener K
Int J Adv Manuf Technol; 2021; 117(7-8):2227-2236. PubMed ID: 34759440
[TBL] [Abstract][Full Text] [Related]
15. Experimental Study on Surface Integrity of Solar Cell Silicon Wafers Sliced by Electrochemical Multi-Wire Saw.
Bao G; Huang C; Zhang Y; Yu Z; Wang W
Micromachines (Basel); 2022 Sep; 13(9):. PubMed ID: 36144092
[TBL] [Abstract][Full Text] [Related]
16. Experimental Investigation on the Surface Formation Mechanism of NdFeB during Diamond Wire Sawing.
Wu B; Zhang Z; Feng J; Meng F; Wan S; Zhuang X; Li L; Liu H; Zhang F
Materials (Basel); 2023 Feb; 16(4):. PubMed ID: 36837151
[TBL] [Abstract][Full Text] [Related]
17. Effects of Grinding Parameters on the Processing Temperature, Crack Propagation and Residual Stress in Silicon Nitride Ceramics.
Yan H; Deng F; Qin Z; Zhu J; Chang H; Niu H
Micromachines (Basel); 2023 Mar; 14(3):. PubMed ID: 36985073
[TBL] [Abstract][Full Text] [Related]
18. Experimental Investigation of Milling Performance of Silicon Nitride Ceramic Subject to Different Assisted Systems.
Raza MN; Lin SY
Materials (Basel); 2022 Dec; 16(1):. PubMed ID: 36614476
[TBL] [Abstract][Full Text] [Related]
19. Experimental Investigation on Diamond Band Saw Processing of Resin Mineral Composites.
Sun J; Zhang J; Gu W; Long Y; Guo C
Materials (Basel); 2024 Apr; 17(8):. PubMed ID: 38673172
[TBL] [Abstract][Full Text] [Related]
20. Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon.
Li A; Hu S; Zhou Y; Wang H; Zhang Z; Ming W
Micromachines (Basel); 2023 Jul; 14(8):. PubMed ID: 37630048
[TBL] [Abstract][Full Text] [Related]
[Next] [New Search]
