134 related articles for article (PubMed ID: 37887960)
1. Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO
Mohamed Muzni NH; Mhd Noor EE; Abdullah MMAB
Nanomaterials (Basel); 2023 Oct; 13(20):. PubMed ID: 37887960
[TBL] [Abstract][Full Text] [Related]
2. Microstructure and Shear Behaviour of Sn-3.0Ag-0.5Cu Composite Solder Pastes Enhanced by Epoxy Resin.
Zhang P; Xue S; Liu L; Wu J; Luo Q; Wang J
Polymers (Basel); 2022 Dec; 14(23):. PubMed ID: 36501697
[TBL] [Abstract][Full Text] [Related]
3. Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow.
Zaimi NSM; Salleh MAAM; Abdullah MMA; Nadzri NIM; Sandu AV; Vizureanu P; Ramli MII; Nogita K; Yasuda H; Sandu IG
Materials (Basel); 2022 Apr; 15(8):. PubMed ID: 35454450
[TBL] [Abstract][Full Text] [Related]
4. Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing.
Zaimi NSM; Salleh MAAM; Sandu AV; Abdullah MMAB; Saud N; Rahim SZA; Vizureanu P; Said RM; Ramli MII
Materials (Basel); 2021 Feb; 14(4):. PubMed ID: 33562200
[TBL] [Abstract][Full Text] [Related]
5. The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-
Li C; Yan Y; Gao T; Xu G
Materials (Basel); 2020 Oct; 13(19):. PubMed ID: 33036405
[TBL] [Abstract][Full Text] [Related]
6. Tensile properties and thermal shock reliability of Sn-Ag-Cu solder joint with indium addition.
Yu AM; Jang JW; Lee JH; Kim JK; Kim MS
J Nanosci Nanotechnol; 2012 Apr; 12(4):3655-7. PubMed ID: 22849189
[TBL] [Abstract][Full Text] [Related]
7. Effect of Epoxy on Mechanical Property of SAC305 Solder Joint with Various Surface Finishes Under 3-Point Bend Test.
Jeong H; Myung WR; Sung YG; Kim KY; Jung SB
J Nanosci Nanotechnol; 2018 Sep; 18(9):6316-6320. PubMed ID: 29677789
[TBL] [Abstract][Full Text] [Related]
8. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition.
Leong YM; Haseeb ASMA
Materials (Basel); 2016 Jun; 9(7):. PubMed ID: 28773645
[TBL] [Abstract][Full Text] [Related]
9. Microstructure and Electro-Physical Properties of Sn-3.0Ag-0.5Cu Nanocomposite Solder Reinforced with Ni Nanoparticles in the Melting-Solidification Temperature Range.
Yakymovych A; Plevachuk Y; Sklyarchuk V; Sokoliuk B; Galya T; Ipser H
J Phase Equilibria Diffus; 2017; 38(3):217-222. PubMed ID: 32025225
[TBL] [Abstract][Full Text] [Related]
10. Effects of Cu Opening Size on the Mechanical Properties of Epoxy-Contained Sn-58Bi Solder Joints.
Min KD; Myung WR; Kim KY; Sung YG; Jung SB
J Nanosci Nanotechnol; 2019 Oct; 19(10):6437-6443. PubMed ID: 31026974
[TBL] [Abstract][Full Text] [Related]
11. Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene.
Ko YH; Lee JD; Yoon T; Lee CW; Kim TS
ACS Appl Mater Interfaces; 2016 Mar; 8(8):5679-86. PubMed ID: 26856638
[TBL] [Abstract][Full Text] [Related]
12. The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints.
Kang MS; Kim DS; Shin YE
Materials (Basel); 2019 Mar; 12(6):. PubMed ID: 30909434
[TBL] [Abstract][Full Text] [Related]
13. Hybrid solder joints: the effect of nanosized ZrO
Wodak I; Yakymovych A; Svec P; Orovcik L; Khatibi G
Appl Nanosci; 2023; 13(11):7379-7385. PubMed ID: 38046828
[TBL] [Abstract][Full Text] [Related]
14. Suppressed Growth of (Fe, Cr
Shen YA; Lin CM; Li J; Gao R; Nishikawa H
Sci Rep; 2019 Jul; 9(1):10210. PubMed ID: 31308462
[TBL] [Abstract][Full Text] [Related]
15. Effect of Mo Nanoparticles on the Growth Behavior of the Intermetallic Compounds Layer in Sn3.0Ag0.5Cu/Cu Solder Joints.
Yang L; Quan S; Liu C; Xiong H
J Nanosci Nanotechnol; 2020 Apr; 20(4):2573-2577. PubMed ID: 31492278
[TBL] [Abstract][Full Text] [Related]
16. Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints.
Dušek K; Veselý P; Bušek D; Petráč A; Géczy A; Illés B; Krammer O
Materials (Basel); 2021 Dec; 14(24):. PubMed ID: 34947502
[TBL] [Abstract][Full Text] [Related]
17. Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint.
Zhang S; Wang Z; Wang J; Duan G; Li H
Materials (Basel); 2022 Jul; 15(14):. PubMed ID: 35888222
[TBL] [Abstract][Full Text] [Related]
18. Mechanical Property of SAC305 Ball-Grid Array and Epoxy Sn-58Bi Solder Joints with 85 °C/85% Relative Humidity Environmental Conditions.
Kim KY; Myung WR; Jeong H; Sung YG; Jung SB
J Nanosci Nanotechnol; 2018 Sep; 18(9):6162-6166. PubMed ID: 29677761
[TBL] [Abstract][Full Text] [Related]
19. Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy.
Roduan SF; Wahab JA; Salleh MAAM; Mahayuddin NAHM; Abdullah MMAB; Halil ABM; Zaifuddin AQS; Muhammad MI; Sandu AV; Baltatu MS; Vizureanu P
Materials (Basel); 2022 Dec; 16(1):. PubMed ID: 36614433
[TBL] [Abstract][Full Text] [Related]
20. Comparative Study of the Impurity Effect on SnAgCu and SnZn Solder Joints with Electrodeposited Cu.
Li YJ; Yen YW; Chen CM
Materials (Basel); 2024 May; 17(9):. PubMed ID: 38730955
[TBL] [Abstract][Full Text] [Related]
[Next] [New Search]
