These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

119 related articles for article (PubMed ID: 38001161)

  • 1. Effect of CoSn
    Wang J; Zhang L; Lv Z; Wang J; Zhang W; Wang X; Chen H; Li M
    Sci Rep; 2023 Nov; 13(1):20693. PubMed ID: 38001161
    [TBL] [Abstract][Full Text] [Related]  

  • 2. Synthesis and Atomic Transport of CoSn
    Wang J; Wang J; Zhang L; Lv Z; Chen H; Li M
    ACS Omega; 2023 Sep; 8(35):32176-32184. PubMed ID: 37692228
    [TBL] [Abstract][Full Text] [Related]  

  • 3. Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper.
    Xiao J; Cheng W; Fu-Kang Q
    Heliyon; 2024 Mar; 10(5):e27010. PubMed ID: 38455589
    [TBL] [Abstract][Full Text] [Related]  

  • 4. Cu
    Wang J; Wang J; Duan F; Chen H
    Sci Rep; 2023 Jan; 13(1):668. PubMed ID: 36635376
    [TBL] [Abstract][Full Text] [Related]  

  • 5. CoSn
    Wang J; Lv Z; Zhang L; Duan F; Zhang W; Chen H
    Nanomaterials (Basel); 2022 Nov; 12(22):. PubMed ID: 36432370
    [TBL] [Abstract][Full Text] [Related]  

  • 6. Growth kinetics of Cu
    Feng J; Hang C; Tian Y; Liu B; Wang C
    Sci Rep; 2018 Jan; 8(1):1775. PubMed ID: 29379073
    [TBL] [Abstract][Full Text] [Related]  

  • 7. Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints.
    Zhang C; Zhang K; Gao Y; Wang Y
    Materials (Basel); 2023 Mar; 16(7):. PubMed ID: 37048920
    [TBL] [Abstract][Full Text] [Related]  

  • 8. Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow.
    Zaimi NSM; Salleh MAAM; Abdullah MMA; Nadzri NIM; Sandu AV; Vizureanu P; Ramli MII; Nogita K; Yasuda H; Sandu IG
    Materials (Basel); 2022 Apr; 15(8):. PubMed ID: 35454450
    [TBL] [Abstract][Full Text] [Related]  

  • 9. In situ imaging of microstructure formation in electronic interconnections.
    Salleh MA; Gourlay CM; Xian JW; Belyakov SA; Yasuda H; McDonald SD; Nogita K
    Sci Rep; 2017 Jan; 7():40010. PubMed ID: 28079120
    [TBL] [Abstract][Full Text] [Related]  

  • 10. Influence of Isothermal Aging on Microstructure and Shear Property of Novel Epoxy Composite SAC305 Solder Joints.
    Zhang P; Xue S; Liu L; Wang J; Tatsumi H; Nishikawa H
    Polymers (Basel); 2023 Oct; 15(20):. PubMed ID: 37896411
    [TBL] [Abstract][Full Text] [Related]  

  • 11. Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene.
    Ko YH; Lee JD; Yoon T; Lee CW; Kim TS
    ACS Appl Mater Interfaces; 2016 Mar; 8(8):5679-86. PubMed ID: 26856638
    [TBL] [Abstract][Full Text] [Related]  

  • 12. Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging.
    Zhao D; Zhang K; Ma N; Li S; Yin C; Huo F
    Materials (Basel); 2020 Feb; 13(4):. PubMed ID: 32059528
    [TBL] [Abstract][Full Text] [Related]  

  • 13. Hybrid solder joints: the effect of nanosized ZrO
    Wodak I; Yakymovych A; Svec P; Orovcik L; Khatibi G
    Appl Nanosci; 2023; 13(11):7379-7385. PubMed ID: 38046828
    [TBL] [Abstract][Full Text] [Related]  

  • 14. Effects of Initial Morphology on Growth Kinetics of Cu
    Lee JY; Chen CM
    Materials (Basel); 2022 Jul; 15(14):. PubMed ID: 35888218
    [TBL] [Abstract][Full Text] [Related]  

  • 15. Copper-Based Nanomaterials for Fine-Pitch Interconnects in Microelectronics.
    Castillo E; Njuki M; Pasha AF; Dimitrov N
    Acc Chem Res; 2023 Jun; 56(12):1384-1394. PubMed ID: 37289991
    [TBL] [Abstract][Full Text] [Related]  

  • 16. Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient.
    Zhao N; Zhong Y; Huang ML; Ma HT; Dong W
    Sci Rep; 2015 Aug; 5():13491. PubMed ID: 26311323
    [TBL] [Abstract][Full Text] [Related]  

  • 17. Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing.
    Ramli MII; Salleh MAAM; Sandu AV; Amli SFM; Said RM; Saud N; Abdullah MMAB; Vizureanu P; Rylski A; Chaiprapa J; Nabialek M
    Materials (Basel); 2021 Sep; 14(18):. PubMed ID: 34576358
    [TBL] [Abstract][Full Text] [Related]  

  • 18. Interfacial Reactions and Mechanical Properties of Sn-58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding.
    Jeong G; Yu DY; Baek S; Bang J; Lee TI; Jung SB; Kim J; Ko YH
    Materials (Basel); 2021 Jan; 14(2):. PubMed ID: 33440741
    [TBL] [Abstract][Full Text] [Related]  

  • 19. In situ visualization of metallurgical reactions in nanoscale Cu/Sn diffusion couples.
    Yin Q; Gao F; Gu Z; Stach EA; Zhou G
    Nanoscale; 2015 Mar; 7(11):4984-94. PubMed ID: 25692392
    [TBL] [Abstract][Full Text] [Related]  

  • 20. Effects of Multiple Reflow on the Formation of Primary Crystals in Sn-3.5Ag and Solder Joint Strength: Experimental and Finite Element Analysis.
    Amli SFM; Salleh MAAM; Aziz MSA; Yasuda H; Nogita K; Abdullah MMAB; Nemes O; Sandu AV; Vizureanu P
    Materials (Basel); 2023 Jun; 16(12):. PubMed ID: 37374543
    [TBL] [Abstract][Full Text] [Related]  

    [Next]    [New Search]
    of 6.