124 related articles for article (PubMed ID: 38068235)
1. Effective Macroscopic Thermomechanical Characterization of Multilayer Circuit Laminates for Advanced Electronic Packaging.
Cheng HC; Jhu WY
Materials (Basel); 2023 Dec; 16(23):. PubMed ID: 38068235
[TBL] [Abstract][Full Text] [Related]
2. Theoretical and Experimental Investigation of Warpage Evolution of Flip Chip Package on Packaging during Fabrication.
Cheng HC; Tai LC; Liu YC
Materials (Basel); 2021 Aug; 14(17):. PubMed ID: 34500909
[TBL] [Abstract][Full Text] [Related]
3. Additive Manufacturing of Composite Polymers: Thermomechanical FEA and Experimental Study.
Behseresht S; Park YH
Materials (Basel); 2024 Apr; 17(8):. PubMed ID: 38673269
[TBL] [Abstract][Full Text] [Related]
4. Optimization of the Warpage of Fused Deposition Modeling Parts Using Finite Element Method.
Syrlybayev D; Zharylkassyn B; Seisekulova A; Perveen A; Talamona D
Polymers (Basel); 2021 Nov; 13(21):. PubMed ID: 34771405
[TBL] [Abstract][Full Text] [Related]
5. Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges.
Tsai MY; Wang YW; Liu CM
Materials (Basel); 2021 Jul; 14(13):. PubMed ID: 34279290
[TBL] [Abstract][Full Text] [Related]
6. Investigation of the Contact Interface between Natural Fibre Metal Laminates under Tension Using Finite Element Analysis (FEA).
Song CH; Giasin K; Saifullah A; Barouni A
Polymers (Basel); 2022 Nov; 14(21):. PubMed ID: 36365640
[TBL] [Abstract][Full Text] [Related]
7. Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages.
Mirone G; Barbagallo R; Bua G; La Rosa G
Materials (Basel); 2023 Jul; 16(13):. PubMed ID: 37445122
[TBL] [Abstract][Full Text] [Related]
8. Development of ANN-Based Warpage Prediction Model for FCCSP via Subdomain Sampling and Taguchi Hyperparameter Optimization.
Cheng HC; Ma CL; Liu YL
Micromachines (Basel); 2023 Jun; 14(7):. PubMed ID: 37512636
[TBL] [Abstract][Full Text] [Related]
9. Warpage Simulation During Fan-Out Wafer-Level Packaging Process with Uncertainty of Material Properties.
Kim G; Kwon D
J Nanosci Nanotechnol; 2021 May; 21(5):2987-2991. PubMed ID: 33653469
[TBL] [Abstract][Full Text] [Related]
10. Optimizing Thermomechanical Processing of Bimetallic Laminates.
Kocich R
Materials (Basel); 2023 Apr; 16(9):. PubMed ID: 37176362
[TBL] [Abstract][Full Text] [Related]
11. Development of Equivalent Material Properties of Microbump for Simulating Chip Stacking Packaging.
Lee CC; Tzeng TL; Huang PC
Materials (Basel); 2015 Aug; 8(8):5121-5137. PubMed ID: 28793495
[TBL] [Abstract][Full Text] [Related]
12. Investigation of Warpage for Multi-Die Fan-Out Wafer-Level Packaging Process.
Chen C; Su M; Ma R; Zhou Y; Li J; Cao L
Materials (Basel); 2022 Feb; 15(5):. PubMed ID: 35268913
[TBL] [Abstract][Full Text] [Related]
13. Analytical modeling, finite-difference simulation and experimental validation of air-coupled ultrasound beam refraction and damping through timber laminates, with application to non-destructive testing.
Sanabria SJ; Furrer R; Neuenschwander J; Niemz P; Schütz P
Ultrasonics; 2015 Dec; 63():65-85. PubMed ID: 26231999
[TBL] [Abstract][Full Text] [Related]
14. Investigation of Impacts on Printed Circuit Board Laminated Composites Caused by Surface Finish Application.
Froš D; Dušek K; Veselý P
Polymers (Basel); 2021 Sep; 13(19):. PubMed ID: 34641019
[TBL] [Abstract][Full Text] [Related]
15. Simulation of Mechanical Stresses in BaTiO
Yuile A; Wiss E; Barth D; Wiese S
Materials (Basel); 2024 Jun; 17(11):. PubMed ID: 38893966
[TBL] [Abstract][Full Text] [Related]
16. Multiscale Process Modeling of Semicrystalline PEEK for Tailored Thermomechanical Properties.
Kashmari K; Al Mahmud H; Patil SU; Pisani WA; Deshpande P; Maiaru M; Odegard GM
ACS Appl Eng Mater; 2023 Nov; 1(11):3167-3177. PubMed ID: 38037665
[TBL] [Abstract][Full Text] [Related]
17. A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications.
Shao S; Liu D; Niu Y; O'Donnell K; Sengupta D; Park S
Sensors (Basel); 2017 Feb; 17(2):. PubMed ID: 28208758
[TBL] [Abstract][Full Text] [Related]
18. Thermomechanical characterisation data of 30 g/m
Sánchez-Carmona S; Velasco ML; Barroso A; Correa E
Data Brief; 2023 Apr; 47():108966. PubMed ID: 36879610
[TBL] [Abstract][Full Text] [Related]
19. A Three-Dimensional Equivalent Stiffness Model of Composite Laminates with Wrinkle Defects.
Hu H; Mei Z; Li H
Materials (Basel); 2022 Jul; 15(15):. PubMed ID: 35955199
[TBL] [Abstract][Full Text] [Related]
20. Modeling thermophysical properties of glasses.
Lucia A; Gregory O
Sci Rep; 2023 Jan; 13(1):989. PubMed ID: 36653430
[TBL] [Abstract][Full Text] [Related]
[Next] [New Search]