122 related articles for article (PubMed ID: 38183406)
1. Direct In- and Out-of-Plane Writing of Metals on Insulators by Electron-Beam-Enabled, Confined Electrodeposition with Submicrometer Feature Size.
Nydegger M; Wang ZJ; Willinger MG; Spolenak R; Reiser A
Small Methods; 2024 Jan; ():e2301247. PubMed ID: 38183406
[TBL] [Abstract][Full Text] [Related]
2. Targeted Additive Micromodulation of Grain Size in Nanocrystalline Copper Nanostructures by Electrohydrodynamic Redox 3D Printing.
Menétrey M; Koch L; Sologubenko A; Gerstl S; Spolenak R; Reiser A
Small; 2022 Dec; 18(51):e2205302. PubMed ID: 36328737
[TBL] [Abstract][Full Text] [Related]
3. Additive Manufacturing of Metal Structures at the Micrometer Scale.
Hirt L; Reiser A; Spolenak R; Zambelli T
Adv Mater; 2017 May; 29(17):. PubMed ID: 28052421
[TBL] [Abstract][Full Text] [Related]
4. Beginner's Guide to Micro- and Nanoscale Electrochemical Additive Manufacturing.
Hengsteler J; Kanes KA; Khasanova L; Momotenko D
Annu Rev Anal Chem (Palo Alto Calif); 2023 Jun; 16(1):71-91. PubMed ID: 37068744
[TBL] [Abstract][Full Text] [Related]
5. Mechanical Properties of 3D Nanostructures Obtained by Focused Electron/Ion Beam-Induced Deposition: A Review.
Utke I; Michler J; Winkler R; Plank H
Micromachines (Basel); 2020 Apr; 11(4):. PubMed ID: 32290292
[TBL] [Abstract][Full Text] [Related]
6. High-resolution deposition of conductive and insulating materials at micrometer scale on complex substrates.
Łysień M; Witczak Ł; Wiatrowska A; Fiączyk K; Gadzalińska J; Schneider L; Stręk W; Karpiński M; Kosior Ł; Granek F; Kowalczewski P
Sci Rep; 2022 Jun; 12(1):9327. PubMed ID: 35665755
[TBL] [Abstract][Full Text] [Related]
7. Bringing Electrochemical Three-Dimensional Printing to the Nanoscale.
Hengsteler J; Mandal B; van Nisselroy C; Lau GPS; Schlotter T; Zambelli T; Momotenko D
Nano Lett; 2021 Nov; 21(21):9093-9101. PubMed ID: 34699726
[TBL] [Abstract][Full Text] [Related]
8. Microstructure-driven electrical conductivity optimization in additively manufactured microscale copper interconnects.
Menétrey M; van Nisselroy C; Xu M; Hengsteler J; Spolenak R; Zambelli T
RSC Adv; 2023 May; 13(20):13575-13585. PubMed ID: 37152573
[TBL] [Abstract][Full Text] [Related]
9. Coaxial Electrohydrodynamic Printing of Microscale Core-Shell Conductive Features for Integrated Fabrication of Flexible Transparent Electronics.
Yu K; Qiu Z; Gu B; Li J; Meng Z; Li D; He J
ACS Appl Mater Interfaces; 2024 Jan; 16(1):1114-1128. PubMed ID: 38133830
[TBL] [Abstract][Full Text] [Related]
10. Area-Selective Atomic Layer Deposition Patterned by Electrohydrodynamic Jet Printing for Additive Manufacturing of Functional Materials and Devices.
Cho TH; Farjam N; Allemang CR; Pannier CP; Kazyak E; Huber C; Rose M; Trejo O; Peterson RL; Barton K; Dasgupta NP
ACS Nano; 2020 Dec; 14(12):17262-17272. PubMed ID: 33216539
[TBL] [Abstract][Full Text] [Related]
11. Interconnect Fabrication by Electroless Plating on 3D-Printed Electroplated Patterns.
Hossain Bhuiyan ME; Moreno S; Wang C; Minary-Jolandan M
ACS Appl Mater Interfaces; 2021 Apr; 13(16):19271-19281. PubMed ID: 33856182
[TBL] [Abstract][Full Text] [Related]
12. Superconformal Film Growth: From Smoothing Surfaces to Interconnect Technology.
Moffat TP; Braun TM; Raciti D; Josell D
Acc Chem Res; 2023 May; 56(9):1004-1017. PubMed ID: 37076974
[TBL] [Abstract][Full Text] [Related]
13. High-Resolution Three-Dimensional Sculpting of Two-Dimensional Graphene Oxide by E-Beam Direct Write.
Kim S; Jung S; Lee J; Kim S; Fedorov AG
ACS Appl Mater Interfaces; 2020 Sep; 12(35):39595-39601. PubMed ID: 32805878
[TBL] [Abstract][Full Text] [Related]
14. Confined Chemical Etching for Electrochemical Machining with Nanoscale Accuracy.
Zhan D; Han L; Zhang J; Shi K; Zhou JZ; Tian ZW; Tian ZQ
Acc Chem Res; 2016 Nov; 49(11):2596-2604. PubMed ID: 27668827
[TBL] [Abstract][Full Text] [Related]
15. Three-dimensional printing of freeform helical microstructures: a review.
Farahani RD; Chizari K; Therriault D
Nanoscale; 2014 Sep; 6(18):10470-85. PubMed ID: 25072812
[TBL] [Abstract][Full Text] [Related]
16. Electrohydrodynamic direct-writing.
Huang Y; Bu N; Duan Y; Pan Y; Liu H; Yin Z; Xiong Y
Nanoscale; 2013 Dec; 5(24):12007-17. PubMed ID: 24057297
[TBL] [Abstract][Full Text] [Related]
17. Electrodeposition in capillaries: bottom-up micro- and nanopatterning of functional materials on conductive substrates.
George A; Maijenburg AW; Maas MG; Blank DH; Ten Elshof JE
ACS Appl Mater Interfaces; 2011 Sep; 3(9):3666-72. PubMed ID: 21838239
[TBL] [Abstract][Full Text] [Related]
18. Nanoscale electrochemical 3D deposition of cobalt with nanosecond voltage pulses in an STM.
Reiser A; Schuster R; Spolenak R
Nanoscale; 2022 Apr; 14(14):5579-5588. PubMed ID: 35343988
[TBL] [Abstract][Full Text] [Related]
19. Microscale 3D Printing of Nanotwinned Copper.
Behroozfar A; Daryadel S; Morsali SR; Moreno S; Baniasadi M; Bernal RA; Minary-Jolandan M
Adv Mater; 2018 Jan; 30(4):. PubMed ID: 29215174
[TBL] [Abstract][Full Text] [Related]
20. Localized Pulsed Electrodeposition Process for Three-Dimensional Printing of Nanotwinned Metallic Nanostructures.
Daryadel S; Behroozfar A; Morsali SR; Moreno S; Baniasadi M; Bykova J; Bernal RA; Minary-Jolandan M
Nano Lett; 2018 Jan; 18(1):208-214. PubMed ID: 29257699
[TBL] [Abstract][Full Text] [Related]
[Next] [New Search]
