These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

115 related articles for article (PubMed ID: 38202582)

  • 1. Mechanism Exploration of the Effect of Polyamines on the Polishing Rate of Silicon Chemical Mechanical Polishing: A Study Combining Simulations and Experiments.
    Lin Z; Zhu J; Huang Q; Zhu L; Li W; Yu W
    Nanomaterials (Basel); 2024 Jan; 14(1):. PubMed ID: 38202582
    [TBL] [Abstract][Full Text] [Related]  

  • 2. Atomic-Level Material Removal Mechanisms of Si(110) Chemical Mechanical Polishing: Insights from ReaxFF Reactive Molecular Dynamics Simulations.
    Wang M; Duan F
    Langmuir; 2021 Feb; 37(6):2161-2169. PubMed ID: 33530684
    [TBL] [Abstract][Full Text] [Related]  

  • 3. Silicon Wafer CMP Slurry Using a Hydrolysis Reaction Accelerator with an Amine Functional Group Remarkably Enhances Polishing Rate.
    Bae JY; Han MH; Lee SJ; Kim ES; Lee K; Lee GS; Park JH; Park JG
    Nanomaterials (Basel); 2022 Nov; 12(21):. PubMed ID: 36364668
    [TBL] [Abstract][Full Text] [Related]  

  • 4. Recent Advances In Silicon Carbide Chemical Mechanical Polishing Technologies.
    Hsieh CH; Chang CY; Hsiao YK; Chen CA; Tu CC; Kuo HC
    Micromachines (Basel); 2022 Oct; 13(10):. PubMed ID: 36296105
    [TBL] [Abstract][Full Text] [Related]  

  • 5. Orthogonal Experimental Research on Dielectrophoresis Polishing (DEPP) of Silicon Wafer.
    Zhao T; Deng Q; Zhang C; Feng K; Zhou Z; Yuan J
    Micromachines (Basel); 2020 May; 11(6):. PubMed ID: 32471163
    [TBL] [Abstract][Full Text] [Related]  

  • 6. Surface Morphology Evolution during Chemical Mechanical Polishing Based on Microscale Material Removal Modeling for Monocrystalline Silicon.
    Xia J; Yu J; Lu S; Huang Q; Xie C; Wang Z
    Materials (Basel); 2022 Aug; 15(16):. PubMed ID: 36013778
    [TBL] [Abstract][Full Text] [Related]  

  • 7. Polymer Nanoparticles Applied in the CMP (Chemical Mechanical Polishing) Process of Chip Wafers for Defect Improvement and Polishing Removal Rate Response.
    Chiu WL; Huang CI
    Polymers (Basel); 2023 Jul; 15(15):. PubMed ID: 37571091
    [TBL] [Abstract][Full Text] [Related]  

  • 8. Surface Orientation and Temperature Effects on the Interaction of Silicon with Water: Molecular Dynamics Simulations Using ReaxFF Reactive Force Field.
    Wen J; Ma T; Zhang W; van Duin AC; Lu X
    J Phys Chem A; 2017 Jan; 121(3):587-594. PubMed ID: 28045520
    [TBL] [Abstract][Full Text] [Related]  

  • 9. Study on chemical mechanical polishing of silicon wafer with megasonic vibration assisted.
    Zhai K; He Q; Li L; Ren Y
    Ultrasonics; 2017 Sep; 80():9-14. PubMed ID: 28494230
    [TBL] [Abstract][Full Text] [Related]  

  • 10. The Effects of Friction and Temperature in the Chemical-Mechanical Planarization Process.
    Ilie F; Minea IL; Cotici CD; Hristache AF
    Materials (Basel); 2023 Mar; 16(7):. PubMed ID: 37048844
    [TBL] [Abstract][Full Text] [Related]  

  • 11. A novel atomic removal model for chemical mechanical polishing using developed mesoporous shell/core abrasives based on molecular dynamics.
    Liu Z; Zhang Z; Feng J; Yi X; Shi C; Gu Y; Zhao F; Liu S; Li J
    Nanoscale; 2023 Dec; 16(1):85-96. PubMed ID: 38050711
    [TBL] [Abstract][Full Text] [Related]  

  • 12. Material Removal Characteristics of Abrasive-Free Cu Chemical-Mechanical Polishing (CMP) Using Electrolytic Ionization via Ni Electrodes.
    Lee H
    Micromachines (Basel); 2023 Jan; 14(2):. PubMed ID: 36837971
    [TBL] [Abstract][Full Text] [Related]  

  • 13. Functionalization of adsorbent with different aliphatic polyamines for heavy metal ion removal: characteristics and performance.
    Liu C; Bai R; Hong L; Liu T
    J Colloid Interface Sci; 2010 May; 345(2):454-60. PubMed ID: 20172530
    [TBL] [Abstract][Full Text] [Related]  

  • 14. Investigation on the Material Removal and Surface Generation of a Single Crystal SiC Wafer by Ultrasonic Chemical Mechanical Polishing Combined with Ultrasonic Lapping.
    Hu Y; Shi D; Hu Y; Zhao H; Sun X
    Materials (Basel); 2018 Oct; 11(10):. PubMed ID: 30340373
    [TBL] [Abstract][Full Text] [Related]  

  • 15. Preliminary Study on Fluidized Bed Chemical Mechanical Polishing (FB-CMP) Process for Stainless Steel 304 (SS304).
    Kim T; Lee H
    Micromachines (Basel); 2020 Jul; 11(7):. PubMed ID: 32708270
    [TBL] [Abstract][Full Text] [Related]  

  • 16. Characterization of wet pad surface in chemical mechanical polishing (CMP) process with full-field optical coherence tomography (FF-OCT).
    Choi WJ; Jung SP; Shin JG; Yang D; Lee BH
    Opt Express; 2011 Jul; 19(14):13343-50. PubMed ID: 21747489
    [TBL] [Abstract][Full Text] [Related]  

  • 17. Atomic surface achieved through a novel cross-scale model from macroscale to nanoscale.
    Zhao F; Zhang Z; Deng X; Feng J; Zhou H; Liu Z; Meng F; Shi C
    Nanoscale; 2024 Feb; 16(5):2318-2336. PubMed ID: 38175155
    [TBL] [Abstract][Full Text] [Related]  

  • 18. Charge density and pH effects on polycation adsorption on poly-Si, SiO2, and Si3N4 films and impact on removal during chemical mechanical polishing.
    Penta NK; Veera PR; Babu SV
    ACS Appl Mater Interfaces; 2011 Oct; 3(10):4126-32. PubMed ID: 21939223
    [TBL] [Abstract][Full Text] [Related]  

  • 19. Experimental Study on Shear Rheological Polishing of Si Surface of 4H-SiC Wafer.
    Li P; Yuan J; Zhu M; Zhou J; Lyu B
    Micromachines (Basel); 2023 Apr; 14(4):. PubMed ID: 37421085
    [TBL] [Abstract][Full Text] [Related]  

  • 20. Unprecedented atomic surface of silicon induced by environmentally friendly chemical mechanical polishing.
    Cui X; Zhang Z; Yu S; Chen X; Shi C; Zhou H; Meng F; Yu J; Wen W
    Nanoscale; 2023 Jun; 15(21):9304-9314. PubMed ID: 37171082
    [TBL] [Abstract][Full Text] [Related]  

    [Next]    [New Search]
    of 6.