These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

117 related articles for article (PubMed ID: 38203033)

  • 1. Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging.
    Yu C; Wu S; Zhong Y; Xu R; Yu T; Zhao J; Yu D
    Sensors (Basel); 2023 Dec; 24(1):. PubMed ID: 38203033
    [TBL] [Abstract][Full Text] [Related]  

  • 2. Research on Wafer-Level MEMS Packaging with Through-Glass Vias.
    Yang F; Han G; Yang J; Zhang M; Ning J; Yang F; Si C
    Micromachines (Basel); 2018 Dec; 10(1):. PubMed ID: 30597830
    [TBL] [Abstract][Full Text] [Related]  

  • 3. Fabrication of Substrate-Integrated Waveguide Using Micromachining of Photoetchable Glass Substrate for 5G Millimeter-Wave Applications.
    Chung SH; Shin JH; Kim YK; Baek CW
    Micromachines (Basel); 2023 Jan; 14(2):. PubMed ID: 36837988
    [TBL] [Abstract][Full Text] [Related]  

  • 4. Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter.
    Chen Z; Yu D; Zhong Y
    Sensors (Basel); 2022 Mar; 22(6):. PubMed ID: 35336284
    [TBL] [Abstract][Full Text] [Related]  

  • 5. Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection.
    Zhao J; Chen Z; Qin F; Yu D
    Micromachines (Basel); 2022 Oct; 13(10):. PubMed ID: 36296152
    [TBL] [Abstract][Full Text] [Related]  

  • 6. A High-Performance MEMS Accelerometer with an Improved TGV Process of Low Cost.
    Fu Y; Han G; Gu J; Zhao Y; Ning J; Wei Z; Yang F; Si C
    Micromachines (Basel); 2022 Jul; 13(7):. PubMed ID: 35888888
    [TBL] [Abstract][Full Text] [Related]  

  • 7. A Comprehensive Review on the Optical Micro-Electromechanical Sensors for the Biomedical Application.
    Upadhyaya AM; Hasan MK; Abdel-Khalek S; Hassan R; Srivastava MC; Sharan P; Islam S; Saad AME; Vo N
    Front Public Health; 2021; 9():759032. PubMed ID: 34926383
    [TBL] [Abstract][Full Text] [Related]  

  • 8. Advances in high-performance MEMS pressure sensors: design, fabrication, and packaging.
    Han X; Huang M; Wu Z; Gao Y; Xia Y; Yang P; Fan S; Lu X; Yang X; Liang L; Su W; Wang L; Cui Z; Zhao Y; Li Z; Zhao L; Jiang Z
    Microsyst Nanoeng; 2023; 9():156. PubMed ID: 38125202
    [TBL] [Abstract][Full Text] [Related]  

  • 9. Wafer-Level Self-Packaging Design and Fabrication of MEMS Capacitive Pressure Sensors.
    Wan Y; Li Z; Huang Z; Hu B; Lv W; Zhang C; San H; Zhang S
    Micromachines (Basel); 2022 May; 13(5):. PubMed ID: 35630205
    [TBL] [Abstract][Full Text] [Related]  

  • 10. Characteristics of an Implantable Blood Pressure Sensor Packaged by Ultrafast Laser Microwelding.
    Kim S; Park J; So S; Ahn S; Choi J; Koo C; Joung YH
    Sensors (Basel); 2019 Apr; 19(8):. PubMed ID: 30991708
    [TBL] [Abstract][Full Text] [Related]  

  • 11. Robust Pressure Sensor in SOI Technology with Butterfly Wiring for Airfoil Integration.
    Haus JN; Schwerter M; Schneider M; Gäding M; Leester-Schädel M; Schmid U; Dietzel A
    Sensors (Basel); 2021 Sep; 21(18):. PubMed ID: 34577355
    [TBL] [Abstract][Full Text] [Related]  

  • 12. Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via.
    Zhang M; Yang J; He Y; Yang F; Yang F; Han G; Si C; Ning J
    Sensors (Basel); 2018 Dec; 19(1):. PubMed ID: 30597879
    [TBL] [Abstract][Full Text] [Related]  

  • 13. Die-Attach Structure of Silicon-on-Glass MEMS Devices Considering Asymmetric Packaging Stress and Thermal Stress.
    An JE; Park U; Jung DG; Park C; Kong SH
    Sensors (Basel); 2019 Sep; 19(18):. PubMed ID: 31540113
    [TBL] [Abstract][Full Text] [Related]  

  • 14. Combination of Ceramic Laser Micromachining and Printed Technology as a Way for Rapid Prototyping Semiconductor Gas Sensors.
    Samotaev N; Oblov K; Dzhumaev P; Fritsch M; Mosch S; Vinnichenko M; Trofimenko N; Baumgärtner C; Fuchs FM; Wissmeier L
    Micromachines (Basel); 2021 Nov; 12(12):. PubMed ID: 34945292
    [TBL] [Abstract][Full Text] [Related]  

  • 15. Research of Vertical via Based on Silicon, Ceramic and Glass.
    Tian W; Wu S; Li W
    Micromachines (Basel); 2023 Jul; 14(7):. PubMed ID: 37512702
    [TBL] [Abstract][Full Text] [Related]  

  • 16. A Novel Packaging of the MEMS Gas Sensors Used for Harsh Outdoor and Human Exhale Sampling Applications.
    Chen L; Chang C; Chien L; Lee B; Shieh W
    Sensors (Basel); 2023 May; 23(11):. PubMed ID: 37299814
    [TBL] [Abstract][Full Text] [Related]  

  • 17. Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding.
    Bleiker SJ; Visser Taklo MM; Lietaer N; Vogl A; Bakke T; Niklaus F
    Micromachines (Basel); 2016 Oct; 7(10):. PubMed ID: 30404365
    [TBL] [Abstract][Full Text] [Related]  

  • 18. A high-Q resonant pressure microsensor with through-glass electrical interconnections based on wafer-level MEMS vacuum packaging.
    Luo Z; Chen D; Wang J; Li Y; Chen J
    Sensors (Basel); 2014 Dec; 14(12):24244-57. PubMed ID: 25521385
    [TBL] [Abstract][Full Text] [Related]  

  • 19. MEMS inductor fabrication and emerging applications in power electronics and neurotechnologies.
    Le HT; Haque RI; Ouyang Z; Lee SW; Fried SI; Zhao D; Qiu M; Han A
    Microsyst Nanoeng; 2021; 7():59. PubMed ID: 34567771
    [TBL] [Abstract][Full Text] [Related]  

  • 20. Extracting and Analyzing the S-Parameters of Vertical Interconnection Structures in 3D Glass Packaging.
    Liu J; Zhang J; Gao L; Chen H
    Micromachines (Basel); 2023 Mar; 14(4):. PubMed ID: 37421035
    [TBL] [Abstract][Full Text] [Related]  

    [Next]    [New Search]
    of 6.