These tools will no longer be maintained as of December 31, 2024. Archived website can be found here. PubMed4Hh GitHub repository can be found here. Contact NLM Customer Service if you have questions.


BIOMARKERS

Molecular Biopsy of Human Tumors

- a resource for Precision Medicine *

119 related articles for article (PubMed ID: 38295706)

  • 1. SiO
    Han J; Mei J; Huang D; Pan K; Zhang Y; Xu Z; Zheng F; Jiang J; Li Y; Huang Y; Wang H; Li Q
    J Colloid Interface Sci; 2024 May; 661():91-101. PubMed ID: 38295706
    [TBL] [Abstract][Full Text] [Related]  

  • 2. D-GQDs Modified Epoxy Resin Enhances the Thermal Conductivity of AlN/Epoxy Resin Thermally Conductive Composites.
    Zhang D; Liu F; Wang S; Yan M; Hu X; Xu M
    Polymers (Basel); 2021 Nov; 13(23):. PubMed ID: 34883578
    [TBL] [Abstract][Full Text] [Related]  

  • 3. Research on the thermal conductivity and dielectric properties of AlN and BN co-filled addition-cure liquid silicone rubber composites.
    Ou Z; Gao F; Zhao H; Dang S; Zhu L
    RSC Adv; 2019 Sep; 9(49):28851-28856. PubMed ID: 35529667
    [TBL] [Abstract][Full Text] [Related]  

  • 4. Highly Thermal Conductive and Electrical Insulating Epoxy Composites with a Three-Dimensional Filler Network by Sintering Silver Nanowires on Aluminum Nitride Surface.
    Lee W; Kim J
    Polymers (Basel); 2021 Feb; 13(5):. PubMed ID: 33669009
    [TBL] [Abstract][Full Text] [Related]  

  • 5. Enhanced field-dependent conductivity and material properties of nano-AlN/micro-SiC/silicone elastomer hybrid composites for electric stress mitigation in high-voltage power modules.
    Wang Q; Chen X; Huang X; Muhammad A; Paramane A; Ren N
    Nanotechnology; 2022 Sep; 33(47):. PubMed ID: 35981500
    [TBL] [Abstract][Full Text] [Related]  

  • 6. Preparation and mechanism research of bio-inspired dopamine decorated expanded graphite/silicone rubber composite with high thermal conductivity and excellent insulation.
    Liu X; Wu W; Liu C; Wang Y; Chen Q; Cui S
    Nanotechnology; 2021 May; 32(32):. PubMed ID: 33902011
    [TBL] [Abstract][Full Text] [Related]  

  • 7. Thermal Boundary Conductance of Direct Bonded Aluminum Nitride to Silicon Interfaces.
    Nieminen T; Koskinen T; Kornienko V; Ross G; Paulasto-Kröckel M
    ACS Appl Electron Mater; 2024 Apr; 6(4):2413-2419. PubMed ID: 38680727
    [TBL] [Abstract][Full Text] [Related]  

  • 8. Thermally Insulating SiO
    Zhao C; Qiao F; Ji J; Deng S; Qi H
    Langmuir; 2023 Jul; 39(27):9468-9475. PubMed ID: 37382911
    [TBL] [Abstract][Full Text] [Related]  

  • 9. Enhancing the Thermal Conductivity of CNT/AlN/Silicone Rubber Composites by Using CNTs Directly Grown on AlN to Achieve a Reduced Filler Filling Ratio.
    Matsumoto N; Futaba DN; Yamada T; Kokubo K
    Nanomaterials (Basel); 2024 Mar; 14(6):. PubMed ID: 38535677
    [TBL] [Abstract][Full Text] [Related]  

  • 10. Deposition and thermal characterization of nano-structured aluminum nitride thin film on Cu-W substrate for high power light emitting diode package.
    Cho HM; Kim MS
    J Nanosci Nanotechnol; 2014 Aug; 14(8):5824-7. PubMed ID: 25936009
    [TBL] [Abstract][Full Text] [Related]  

  • 11. Preparation of a Crosslinked Poly(imide-siloxane) for Application to Transistor Insulation.
    Park HJ; Choi JY; Jin SW; Lee SH; Choi YJ; Kim DB; Chung CM
    Polymers (Basel); 2022 Dec; 14(24):. PubMed ID: 36559758
    [TBL] [Abstract][Full Text] [Related]  

  • 12. Double-Network MK Resin-Modified Silica Aerogels for High-Temperature Thermal Insulation.
    Xu L; Zhu W; Chen Z; Su D
    ACS Appl Mater Interfaces; 2023 Sep; 15(37):44238-44247. PubMed ID: 37672731
    [TBL] [Abstract][Full Text] [Related]  

  • 13. Enhancement of the heat conduction performance of boron nitride/cellulosic fibre insulating composites.
    Yu Z; Wang X; Bian H; Jiao L; Wu W; Dai H
    PLoS One; 2018; 13(7):e0200842. PubMed ID: 30024928
    [TBL] [Abstract][Full Text] [Related]  

  • 14. Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging.
    Lee Sanchez WA; Li JW; Chiu HT; Cheng CC; Chiou KC; Lee TM; Chiu CW
    Polymers (Basel); 2022 Jul; 14(14):. PubMed ID: 35890726
    [TBL] [Abstract][Full Text] [Related]  

  • 15. Effect of the alumina micro-particle sizes on the thermal conductivity and dynamic mechanical property of epoxy resin.
    Xu Z; Zhang C; Li Y; Zou J; Li Y; Yang B; Hu R; Qian Q
    PLoS One; 2023; 18(10):e0292878. PubMed ID: 37831678
    [TBL] [Abstract][Full Text] [Related]  

  • 16. Enhanced Thermal Conductivity of Epoxy Composites by Introducing 1D AlN Whiskers and Constructing Directionally Aligned 3D AlN Filler Skeletons.
    Hao X; Wan S; Zhao Z; Zhu L; Peng D; Yue M; Kuang J; Cao W; Liu G; Wang Q
    ACS Appl Mater Interfaces; 2023 Jan; 15(1):2124-2133. PubMed ID: 36576869
    [TBL] [Abstract][Full Text] [Related]  

  • 17. The thermal conductivity of embedded nano-aluminum nitride-doped multi-walled carbon nanotubes in epoxy composites containing micro-aluminum nitride particles.
    Choi S; Im H; Kim J
    Nanotechnology; 2012 Feb; 23(6):065303. PubMed ID: 22248559
    [TBL] [Abstract][Full Text] [Related]  

  • 18. Direct Evidence on Effect of Oxygen Dissolution on Thermal and Electrical Conductivity of AlN Ceramics Using Al Solid-State NMR Analysis.
    Kim J; Kim JY; Ahn H; Jeong MH; Lee E; Cho K; Lee SM; Shim W; Pee JH
    Materials (Basel); 2022 Nov; 15(22):. PubMed ID: 36431611
    [TBL] [Abstract][Full Text] [Related]  

  • 19. Epoxy Nanocomposites with Reduced Graphene Oxide-Constructed Three-Dimensional Networks of Single Wall Carbon Nanotube for Enhanced Thermal Management Capability with Low Filler Loading.
    Liang X; Dai F
    ACS Appl Mater Interfaces; 2020 Jan; 12(2):3051-3058. PubMed ID: 31855411
    [TBL] [Abstract][Full Text] [Related]  

  • 20. High Thermal Conductivity of Submicrometer Aluminum Nitride Thin Films Sputter-Deposited at Low Temperature.
    Perez C; McLeod AJ; Chen ME; Yi SI; Vaziri S; Hood R; Ueda ST; Bao X; Asheghi M; Park W; Talin AA; Kumar S; Pop E; Kummel AC; Goodson KE
    ACS Nano; 2023 Nov; 17(21):21240-21250. PubMed ID: 37796248
    [TBL] [Abstract][Full Text] [Related]  

    [Next]    [New Search]
    of 6.